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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Power Management - Specialized

NXP Semiconductors MC33FS8410G6KSR2

Name: MC33FS8410G6KSR2
Brand: NXP Semiconductors
SKU: MC33FS8410G6KSR2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MC33FS8410G6KSR2

Manufacturer:: NXP Semiconductors

Category:: Power Management - Specialized

Package:: 56-VFQFN Exposed Pad

Datasheet:: MC33FS8410G6KSR2.pdf

Description:: SAFETY POWER MANAGEMENT IC, QFN5

Quantity:: RFQ Add To RFQ list

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Product details

Overview

MC33FS8410G6KSR2 from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, one integrated low-voltage synchronous BUCK1 (1.2 V @ 2.6 A), one BUCK3 (1.8 V @ 2.6 A), two LDOs (LDO1 = 1.8 V / 400 mA, LDO2 = 3.3 V / 400 mA), BOOST converter, and safety monitoring circuitry. It targets gateway ECUs with NXP MPC5748G MCU, delivering multi-rail power sequencing, fail-safe output, and SPI/I²C control.

For engineers reviewing the MC33FS8410G6KSR2 datasheet, MC33FS8410G6KSR2 pinout, MC33FS8410G6KSR2 application, or MC33FS8410G6KSR2 equivalent, this device requires attention to its fixed OTP configuration (VPRE = 3.3 V, BUCK1 = 1.2 V, BUCK3 = 1.8 V, LDO1 = 1.8 V, LDO2 = 3.3 V), ASIL B safety partitioning, HVQFN56 thermal-enhanced package, and dedicated wake-up/monitoring pins for automotive gateway power management.

Technical Context

The MC33FS8410G6KSR2 implements a hierarchical power architecture: VPRE (3.3 V) supplies external gate drivers for high-current pre-regulation; BUCK1 (1.2 V, 2.6 A) powers the MCU core with SVS capability; BUCK3 (1.8 V, 2.6 A) supports auxiliary logic; LDO1 (1.8 V) and LDO2 (3.3 V) serve I/O and ADC rails. All regulators feature programmable soft-start (7.81 mV/µs for BUCK1/BUCK3), thermal shutdown response, and configurable power-up sequencing slots.

Safety operation is enforced via dedicated monitoring paths: VCOREMON (monitors BUCK1 output), VDDIOMON (monitors LDO2), VMON1–VMON4 (four independent analog voltage monitors), PGOOD/RSTB outputs, and a simple watchdog. The fail-safe state machine asserts FS0B on detected faults, and the device supports external frequency synchronization (FIN/FOUT) and power sync (PSYNC) for EMC-optimized multi-device systems.

Key Specifications

Parameter	Value and Actual Design Meaning
Input Voltage Range	60 V DC max - supports 12 V and 24 V automotive battery systems with reverse-battery protection diodes on VSUP1/VSUP2.
VPRE Output	3.3 V fixed - drives external high-side MOSFETs in synchronous buck stage for primary pre-regulation.
BUCK1 Output	1.2 V @ 2.6 A peak - dedicated MCU core supply with SVS (supply voltage supervision) and slot-0 power sequencing.
BUCK3 Output	1.8 V @ 2.6 A peak - auxiliary rail with slot-0 sequencing, phase delay 4, and TSD-triggered shutdown + DFS.
LDO1/LDO2	1.8 V / 3.3 V @ 400 mA each - low-noise IO/ADC supplies with independent UV/OV monitoring and slot-2/slot-1 sequencing.
Safety Rating	ASIL B compliant - certified per ISO 26262, AEC-Q100 Grade 1, with fail-safe output (FS0B), PGOOD, RSTB, and built-in self-test (ABIST/LBIST).
Interface	SPI or I²C (0x20 address) - enables full register access, OTP emulation during development, and real-time fault reporting via INTB.

Pinout & Package

MC33FS8410G6KSR2 uses the HVQFN56 (SOT684-23) thermally enhanced wettable flank package: 8 mm × 8 mm × 0.85 mm body, 0.5 mm pitch, exposed pad (EP) for thermal and ground connection. Pin count is 56, with 3 dedicated GND pins (GND, GNDFS, EP) and 4 voltage monitor inputs (VMON1–VMON4).

Pin/Terminal	Circuit Role	Design Meaning
VSUP1 / VSUP2	Main power inputs	Accept 60 V DC input; require external reverse-battery diodes; feed internal regulators and bias circuits.
VPRE-related (PRE_GHS, PRE_GLS, PRE_SW, PRE_FB, PRE_CSP, PRE_COMP)	External synchronous buck interface	Drive external high-/low-side MOSFETs; enable precise current sensing, feedback, and bootstrap operation for VPRE stage.
BUCK1_SW / BUCK1_FB / BUCK1_IN	Integrated BUCK1 power path	Switching node, feedback input, and input supply for 1.2 V / 2.6 A MCU core regulator with SVS.
BUCK3_SW / BUCK3_FB / BUCK3_IN	Integrated BUCK3 power path	Switching node, feedback input, and input for 1.8 V / 2.6 A auxiliary rail with slot-0 sequencing.
LDO1 / LDO2 / LDO1_IN	Linear regulator outputs/inputs	Deliver low-noise 1.8 V and 3.3 V at up to 400 mA; LDO1_IN accepts regulated input from upstream SMPS.
VCOREMON / VDDIOMON / VMON1–VMON4	Analog voltage monitors	Monitor BUCK1 output, LDO2 output, and up to four external rails; trigger fault responses with configurable OV/UV thresholds and delays.
FS0B / PGOOD / RSTB / INTB	Fault signaling outputs	Open-drain fail-safe output (FS0B), active-low power-good (PGOOD), reset (RSTB), and interrupt (INTB) for system-level safety coordination.
SPI (MOSI/MISO/SCLK/CSB) / I²C (SCL/SDA)	Digital control interfaces	Configurable dual-interface communication; I²C address 0x20; supports CRC-protected register reads/writes and fault logging.

Key Features

Feature	Design Value
ASIL B Safety Architecture	Independent monitoring paths (VCOREMON, VDDIOMON, VMON1–VMON4), fail-safe output (FS0B), PGOOD/RSTB assertion, and ABIST/LBIST for ISO 26262-compliant gateway ECU designs.
Multi-Rail Power Sequencing	Configurable startup/shutdown slots (e.g., BUCK1/BUCK3 in Slot 0, LDO1 in Slot 1, LDO2 in Slot 2) ensure deterministic power-up order for MPC5748G-based gateways.
EMC-Optimized Switching	Frequency synchronization (FIN/FOUT), spread spectrum, slew rate control, and manual tuning reduce radiated emissions in dense automotive PCB layouts.
OTP-Programmed Configuration	Factory-programmed for VPRE = 3.3 V, BUCK1 = 1.2 V, BUCK3 = 1.8 V, LDO1 = 1.8 V, LDO2 = 3.3 V - eliminates external resistor networks and simplifies design validation.
Low-Power OFF Mode	10 µA typical quiescent current in power-down state - extends battery life during vehicle sleep modes without compromising wake-up responsiveness.

Applications

Automotive Gateway ECU	Radar Sensor Power Management
Use Scenario: Central vehicle network gateway managing CAN FD, Ethernet, and LIN communication between domains. IC Role / Device Role / Timing Role: Primary SBC providing sequenced, monitored power to MPC5748G MCU core (BUCK1), I/O banks (LDO1/LDO2), and auxiliary logic (BUCK3), while asserting FS0B on critical faults. Use Value: Enables ASIL B compliance for gateway function, reduces external component count by integrating six regulated rails and safety logic in HVQFN56.	Use Scenario: Power delivery and safety monitoring for corner radar modules using NXP S32R274 MCU. IC Role / Device Role / Timing Role: Supplies VPRE (3.3 V) to drive external radar transceiver gate drivers, BUCK1 (1.2 V) to S32R274 core, and LDO2 (3.3 V) to RF front-end bias rails. Use Value: Delivers tightly regulated, low-noise supplies with fast OV/UV fault detection (<45 µs) and fail-safe output to meet ASIL B radar functional safety requirements.
Infotainment Domain Controller	ADAS Camera Module
Use Scenario: Power management for head-unit controllers requiring multiple voltage domains and robust fault handling. IC Role / Device Role / Timing Role: Generates BUCK1 (1.2 V) for application processor core, BUCK3 (1.8 V) for DDR I/O, LDO1 (1.8 V) for display interface, and LDO2 (3.3 V) for audio codec. Use Value: Integrates all required rails with programmable sequencing and monitoring - eliminating discrete supervisors and reducing BOM cost and board area.	Use Scenario: Compact camera ECU powering image sensor, ISP, and communication interface under strict thermal constraints. IC Role / Device Role / Timing Role: Provides BUCK1 (1.2 V) for ISP core, LDO2 (3.3 V) for sensor analog supply, and VPRE (3.3 V) for external level shifters, with thermal shutdown coordination. Use Value: Achieves <0.85 mm profile in HVQFN56 while maintaining 2.6 A BUCK1 current capability and 10 µA OFF-mode current for always-on vision systems.

Automotive Gateway ECU

Radar Sensor Power Management

Use Scenario: Central vehicle network gateway managing CAN FD, Ethernet, and LIN communication between domains.

IC Role / Device Role / Timing Role: Primary SBC providing sequenced, monitored power to MPC5748G MCU core (BUCK1), I/O banks (LDO1/LDO2), and auxiliary logic (BUCK3), while asserting FS0B on critical faults.

Use Value: Enables ASIL B compliance for gateway function, reduces external component count by integrating six regulated rails and safety logic in HVQFN56.

Use Scenario: Power delivery and safety monitoring for corner radar modules using NXP S32R274 MCU.

IC Role / Device Role / Timing Role: Supplies VPRE (3.3 V) to drive external radar transceiver gate drivers, BUCK1 (1.2 V) to S32R274 core, and LDO2 (3.3 V) to RF front-end bias rails.

Use Value: Delivers tightly regulated, low-noise supplies with fast OV/UV fault detection (<45 µs) and fail-safe output to meet ASIL B radar functional safety requirements.

Infotainment Domain Controller

ADAS Camera Module

Use Scenario: Power management for head-unit controllers requiring multiple voltage domains and robust fault handling.

IC Role / Device Role / Timing Role: Generates BUCK1 (1.2 V) for application processor core, BUCK3 (1.8 V) for DDR I/O, LDO1 (1.8 V) for display interface, and LDO2 (3.3 V) for audio codec.

Use Value: Integrates all required rails with programmable sequencing and monitoring - eliminating discrete supervisors and reducing BOM cost and board area.

Use Scenario: Compact camera ECU powering image sensor, ISP, and communication interface under strict thermal constraints.

IC Role / Device Role / Timing Role: Provides BUCK1 (1.2 V) for ISP core, LDO2 (3.3 V) for sensor analog supply, and VPRE (3.3 V) for external level shifters, with thermal shutdown coordination.

Use Value: Achieves <0.85 mm profile in HVQFN56 while maintaining 2.6 A BUCK1 current capability and 10 µA OFF-mode current for always-on vision systems.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive SBC applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MC33FS8410G3KSR2	Same FS84 family, but configured for Radar with S32R274: BUCK1 = 1.25 V, BUCK3 = 2.3 V, LDO1 = 3.3 V, LDO2 = 5.0 V.	Targeted for radar sensor modules rather than gateways; different voltage setpoints and sequencing slots (BUCK1 in Slot 1, BUCK3 in Slot 0).	Select MC33FS8410G3KSR2 when powering S32R274-based radar; use MC33FS8410G6KSR2 for MPC5748G gateway with 1.2 V core and 1.8 V auxiliary rail.
MC33FS8510A2KSR2	ASIL D–rated variant with identical pinout and regulator count, but adds FCCU monitoring, ERRMON input, and Challenger WD instead of Simple WD.	Required for ASIL D domain controllers; supports dual MCU error monitoring (FCCU1/FCCU2) and external IC fault reporting (ERRMON) not present in FS84.	Choose MC33FS8510A2KSR2 only when ASIL D compliance is mandated; MC33FS8410G6KSR2 suffices for ASIL B gateway functions with lower complexity and cost.

Compared with MC33FS8410G3KSR2 and MC33FS8510A2KSR2, MC33FS8410G6KSR2 offers optimized voltage setpoints (1.2 V BUCK1, 1.8 V BUCK3, 1.8 V/3.3 V LDOs) and sequencing for MPC5748G gateways, retains full ASIL B safety features without ASIL D overhead, and delivers lowest system cost for non-domain-controller applications.

Availability

MC33FS8410G6KSR2 is available at Aetrix Electronics and suitable for automotive gateway ECUs, radar sensor modules, and infotainment domain controllers requiring stable component supply, AEC-Q100 qualification, and long-term automotive lifecycle support.

Supply support for MC33FS8410G6KSR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive processors and power management.

The FS84 product line delivers ASIL B–compliant system basis chips for automotive gateway, radar, and infotainment ECUs, integrating multi-rail SMPS/LDO regulation, functional safety monitoring, and EMC-optimized switching in compact HVQFN packages.

FAQ

What is the primary application target for MC33FS8410G6KSR2?

The MC33FS8410G6KSR2 is specifically designed for automotive gateway ECUs using the NXP MPC5748G microcontroller. Its factory-programmed voltage rails - BUCK1 at 1.2 V for the MCU core, BUCK3 at 1.8 V for auxiliary logic, and LDO1/LDO2 at 1.8 V and 3.3 V for I/O and ADC supplies - align precisely with MPC5748G power requirements. The device also supports ASIL B safety compliance, fail-safe output (FS0B), and multi-protocol communication (CAN FD, Ethernet) gateway architectures.

Does MC33FS8410G6KSR2 support both SPI and I²C interfaces?

Yes, MC33FS8410G6KSR2 supports both SPI and I²C interfaces for configuration and monitoring. It uses I²C address 0x20 and provides full register access via either protocol, including fault status, voltage readings, and safety event logs. The interface selection is hardware-configurable, and both support CRC-protected transactions. This dual-interface flexibility allows seamless integration into systems where either SPI (e.g., with MPC5748G) or I²C (e.g., for debug or secondary controllers) is preferred.

What safety features does MC33FS8410G6KSR2 provide for ASIL B compliance?

MC33FS8410G6KSR2 achieves ASIL B compliance through integrated safety mechanisms: dedicated voltage monitors (VCOREMON, VDDIOMON, VMON1–VMON4) with configurable OV/UV thresholds and delay times; fail-safe output (FS0B) that asserts on critical faults; power-good (PGOOD) and reset (RSTB) signals; built-in self-test (ABIST/LBIST); and a simple watchdog. All safety logic is partitioned independently from power regulation, and the device is qualified to AEC-Q100 Grade 1 and ISO 26262 ASIL B process requirements.

Can MC33FS8410G6KSR2 be used in radar applications?

Yes, MC33FS8410G6KSR2 can be used in radar applications, particularly for gateway-integrated radar nodes or lower-complexity radar ECUs. While MC33FS8410G3KSR2 is explicitly designated for NXP S32R274 radar, MC33FS8410G6KSR2's 3.3 V VPRE output, 1.2 V BUCK1, and 3.3 V LDO2 make it suitable for powering radar transceivers, signal processors, and analog front-ends. Its fast fault detection (<45 µs OV/UV delay), fail-safe output, and EMC optimization (FIN/FOUT sync) meet key radar power integrity requirements.

What is the package type and thermal performance of MC33FS8410G6KSR2?

MC33FS8410G6KSR2 uses the HVQFN56 (SOT684-23) package: 8 mm × 8 mm × 0.85 mm body with 0.5 mm pitch and wettable flank terminals (KS suffix indicates dimple wettable flank). The exposed pad (EP) connects BUCK1/BUCK2/BUCK3 low-side grounds and serves as primary thermal path. This package enables high power density and efficient heat dissipation in space-constrained automotive modules, supporting continuous operation at junction temperatures up to +125 °C per AEC-Q100 Grade 1 specification.

MC33FS8410G6KSR2 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 56-VFQFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Applications:: System Basis Chip

Current - Supply:: 15mA

Voltage - Supply:: 60V

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount, Wettable Flank

Supplier Device Package:: 56-HVQFN (8x8)

MC33FS8410G6KSR2 FAQ

1.How can I place an order for MC33FS8410G6KSR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for MC33FS8410G6KSR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC33FS8410G6KSR2 reliable?

The price and inventory of MC33FS8410G6KSR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8410G6KSR2 is usually 5 days.

3.What payment methods are accepted for MC33FS8410G6KSR2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8410G6KSR2 transactions.

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4.How is shipping managed for MC33FS8410G6KSR2?

MC33FS8410G6KSR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC33FS8410G6KSR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC33FS8410G6KSR2?

For technical support, including MC33FS8410G6KSR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8410G6KSR2 requirements.

6.How does Aetrix verify that MC33FS8410G6KSR2 is sourced from the original manufacturer or authorized distributors?

All MC33FS8410G6KSR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8410G6KSR2 meets industry standards.

7.What is the process for return or replacement of MC33FS8410G6KSR2?

All MC33FS8410G6KSR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8410G6KSR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC33FS8410G6KSR2 part is unused and in its original packaging.

Return procedure for MC33FS8410G6KSR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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