Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MC33FS8415G0ESR2

Part No.:
MC33FS8415G0ESR2
Manufacturer:
NXP Semiconductors
Category:
Power Management - Specialized
Package:
56-VFQFN Exposed Pad
Datasheet:
AetrixMC33FS8415G0ESR2.pdf
Description:
SAFETY POWER MANAGEMENT IC, QFN5
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,366

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MC33FS8415G0ESR2 from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, one integrated low-voltage synchronous BUCK1 (1.1 V, 4.5 A peak), one integrated BUCK3 (2.3 V, 4.5 A peak), a BOOST converter (5.0 V, 1.5 A peak), and two LDOs (LDO1: 1.8 V/400 mA; LDO2: 3.3 V/400 mA). It serves as the primary power management and safety monitor for radar modules with NXP S32R294 + TEF810x in 12 V/24 V applications.

For engineers reviewing the MC33FS8415G0ESR2 datasheet, MC33FS8415G0ESR2 pinout, MC33FS8415G0ESR2 application, or MC33FS8415G0ESR2 equivalent, this page delivers verified functional architecture, validated safety features per ISO 26262, confirmed OTP-configured regulator settings, and real-world radar-system integration context - all aligned to the FS84 family's documented FS8415 variant specifications.

Technical Context

The MC33FS8415G0ESR2 implements a dual-domain power architecture: VPRE controls external high-side MOSFETs for primary 12 V/24 V input conditioning, while BUCK1, BUCK3, BOOST, LDO1, and LDO2 deliver tightly regulated, sequenced rails to MCU cores, I/Os, ADCs, and RF front-ends. Its fail-safe state machine monitors VCOREMON, VMON1–VMON4, and FCCU inputs to assert FS0B on fault detection.

It supports both SPI and I2C (0x20 address) interfaces with CRC, includes frequency synchronization (FIN/FOUT), PSYNC for multi-device coordination, and integrates ABIST/LBIST for on-chip self-test. Power-up sequencing is fixed per OTP: BUCK1 starts in Slot 6, BUCK3 in Slot 0, LDO1 in Slot 2, and LDO2 in Slot 1.

Key Specifications

ParameterValue and Actual Design Meaning
ASIL LevelASIL B compliant per ISO 26262; includes dedicated monitoring circuitry and fail-safe output (FS0B)
Input Voltage Range60 V DC max; supports 12 V and 24 V automotive battery systems with reverse-battery protection diodes on VSUP1/VSUP2
VPRE ControllerSynchronous buck controller with external MOSFETs; configured for 3.3 V output, 455 kHz forced PWM, 80 mV current limit
BUCK1 Output1.1 V ±1.5 % at up to 4.5 A peak; used for MCU core supply with SVS capability and soft-start slope of 7.81 mV/µs
BUCK3 Output2.3 V ±1.5 % at up to 4.5 A peak; assigned to VDDIO rail; starts in power sequencing Slot 0
BOOST Output5.0 V ±1.5 % at up to 1.5 A peak; integrated low-side switch; enabled by OTP; used for radar PHY biasing
LDO1 / LDO2LDO1: 1.8 V/400 mA; LDO2: 3.3 V/400 mA; both support voltage supervision and thermal shutdown with DFS escalation
Fail-Safe OutputFS0B is open-drain, active-low; asserts on monitored fault (e.g., VCOREMON UV/OV, TSD, FCCU error) with infinite auto-retry mode

Pinout & Package

MC33FS8415G0ESR2 uses the HVQFN56 package: plastic thermal-enhanced very thin quad flat package with wettable flank, 56 terminals, 0.5 mm pitch, 8 mm × 8 mm × 0.85 mm body, and exposed pad (EP) connected to GNDFS/GND.

PinCircuit RoleDesign Meaning
1 (WAKE2)Wake-up input 2Digital/analog input for system wake from OFF mode; requires external series resistor if used globally
14 (FS0B)Fail-safe output 0Active-low open-drain signal asserting system-level fault; drives external safety relay or MCU interrupt
17 (VCOREMON)Core voltage monitor inputAnalog input tied directly to BUCK1 output; enables SVS with 112 % OVTH and 95.5 % UVTH thresholds
18 (PGOOD)Power good indicatorActive-low status flag confirming all regulated outputs are within tolerance; requires external pull-up to VDDIO
37 (BUCK1_SW)BUCK1 switching nodeHigh-frequency switching output driving external inductor; connects to internal high-/low-side MOSFETs
48 (PRE_FB)VPRE feedback inputRegulates VPRE output via external resistive divider; also senses negative current for reverse-current protection
54 (LDO2)LDO2 outputStable 3.3 V supply for MCU I/O banks or analog peripherals; 400 mA DC capable with thermal foldback
56 (LDO1_IN)LDO1 inputAccepts pre-regulated input (e.g., from BUCK3 or VBOOST); decoupling required per layout guidelines

Key Features

FeatureDesign Value
OTP-configurable power sequencingFixed startup order across 6 slots: BUCK1 (Slot 6), BUCK3 (Slot 0), LDO1 (Slot 2), LDO2 (Slot 1) - eliminates external sequencing IC
EMC-optimized SMPS controlIncludes frequency synchronization (FIN/FOUT), spread spectrum, slew rate control, and manual tuning - reduces radiated emissions in radar bands
Fail-safe state machineMonitors 5 independent voltage rails (VCOREMON, VMON1–VMON4), temperature, and FCCU signals; asserts FS0B within <250 µs of fault detection
Multi-interface communicationSupports both SPI (4-wire) and I2C (0x20) with CRC error checking - enables redundancy or interface selection during system design
Deep fail-safe autoretryFS0B remains asserted with infinite retry cycles until fault clears; prevents unsafe recovery without host MCU intervention
OFF mode quiescent current10 µA typical - meets automotive cold-cranking and parking-mode current budget requirements

Applications

Radar Sensor ModuleADAS Domain Controller

Use Scenario: Integrated into corner radar units using NXP S32R294 MCU and TEF810x RF transceiver in 12 V/24 V vehicle architectures.

IC Role / Device Role / Timing Role: Primary power manager and safety supervisor - supplies VPRE, BUCK1 (core), BUCK3 (I/O), BOOST (PHY), LDO1/LDO2 (ADC/IO), and monitors all critical voltages.

Use Value: Enables single-chip power + safety compliance for ASIL B radar ECU; eliminates discrete supervisors and reduces BOM count by ≥4 components.

Use Scenario: Used in mid-tier ADAS domain controllers consolidating camera, radar, and ultrasonic sensor processing.

IC Role / Device Role / Timing Role: Centralized power source delivering sequenced, monitored rails to heterogeneous SoCs (e.g., S32G) and companion PMICs via PSYNC.

Use Value: Provides deterministic power-up timing across multiple voltage domains and enables synchronized switching to minimize system-level EMC peaks.

Vision Processing UnitInfotainment Head Unit

Use Scenario: Powers NXP S32V-based mono/stereo camera modules requiring precise core and I/O rail regulation.

IC Role / Device Role / Timing Role: Supplies BUCK1 (1.03125 V core), BUCK3 (1.8 V I/O), LDO1 (1.8 V ADC), and LDO2 (3.3 V SerDes) with SVS and PGOOD monitoring.

Use Value: Delivers sub-2% output accuracy and <10 µs fault response - ensures image sensor stability and avoids frame corruption during voltage transients.

Use Scenario: Embedded in premium infotainment head units supporting audio DSP, display drivers, and connectivity (Wi-Fi/BT).

IC Role / Device Role / Timing Role: Manages multi-rail power for application processor, GPU, DDR memory, and audio codec - coordinated via SPI configuration and PSYNC.

Use Value: Reduces thermal footprint vs. discrete regulators; enables deep-sleep OFF mode (10 µA) to meet OEM overnight battery drain specs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive SBC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC33FS8410G0ESNo FCCU monitoring; only 2 VMON inputs (VMON1/VMON2); no BUCK3; BUCK1 starts in Slot 0Targeted for simpler camera modules without radar PHY or multi-rail safety monitoringSelect when ASIL B safety scope is limited to core + I/O rails only, and FCCU/ERRMON interfaces are unused
MC33FS8420G0ESIncludes BUCK2 (1.8 V/4.5 A) instead of BUCK3; BUCK2 multiphase-capable with BUCK1; no FCCUOptimized for dual-core MCU platforms requiring higher I/O current or parallel regulationChoose when system requires >4.5 A on a single low-voltage rail and does not need BOOST or FCCU-level MCU health monitoring

Compared with MC33FS8410G0ES and MC33FS8420G0ES, the MC33FS8415G0ESR2 uniquely combines BUCK3 + BOOST + FCCU + 4× VMON monitoring in a single ASIL B SBC - making it the only FS84 variant qualified for radar subsystems requiring simultaneous RF bias, core/I/O regulation, and MCU error signaling.

Availability

MC33FS8415G0ESR2 is available at Aetrix Electronics and suitable for radar sensor modules, ADAS domain controllers, vision processing units, and infotainment head units requiring stable component supply, automotive-grade qualification, and long-term lifecycle support.

Supply support for MC33FS8415G0ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive microcontrollers and power management.

The FS84 product line delivers ASIL B–certified system basis chips targeting radar, vision, and domain controller power architectures - designed to reduce design complexity, improve functional safety compliance, and accelerate time-to-market for automotive electronics.

FAQ

What safety certifications apply to the MC33FS8415G0ESR2?

The MC33FS8415G0ESR2 is developed in compliance with ISO 26262 for ASIL B applications and qualified per AEC-Q100 Rev H Grade 1 (−40 °C to +125 °C ambient). It includes built-in ABIST/LBIST, fail-safe state machine, and hardware-monitored voltage rails - all documented in the FS84_FS85C product data sheet Rev. 12.0.

Does the MC33FS8415G0ESR2 support both SPI and I2C interfaces simultaneously?

No - the MC33FS8415G0ESR2 supports either SPI or I2C, selected at boot via OTP configuration. Its I2C address is fixed at 0x20; SPI uses standard 4-wire protocol with CSB, SCLK, MOSI, and MISO. Interface selection is immutable after OTP programming.

What is the function of the PSYNC pin on the MC33FS8415G0ESR2?

The PSYNC pin on the MC33FS8415G0ESR2 operates as a bidirectional power synchronization signal. It allows two MC33FS8415G0ESR2 devices - or one MC33FS8415G0ESR2 plus an external PMIC - to align switching frequencies and phase-shifted operation, reducing system-level conducted and radiated noise in radar-sensitive environments.

How is the fail-safe output (FS0B) triggered on the MC33FS8415G0ESR2?

The FS0B pin on the MC33FS8415G0ESR2 asserts low within ≤250 µs upon detection of any monitored fault: VCOREMON UV/OV, VMON1–VMON4 threshold violation, TSD, FCCU1/FCCU2 error, or ERRMON assertion. It remains latched in infinite autoretry mode until the root cause is cleared and the device resets.

Can the MC33FS8415G0ESR2 be used in 24 V commercial vehicle applications?

Yes - the MC33FS8415G0ESR2 supports up to 60 V DC input and is qualified for 12 V and 24 V automotive applications. Its VSUP1/VSUP2 pins require external reverse-battery protection diodes, and its VPRE controller is configured for 3.3 V output at 455 kHz - validated for use with NXP S32R294 + TEF810x in 24 V radar systems per ordering table notes.

MC33FS8415G0ESR2 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
56-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
System Basis Chip
Current - Supply:
15mA
Voltage - Supply:
60V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
56-HVQFN (8x8)

MC33FS8415G0ESR2 FAQ

1.How can I place an order for MC33FS8415G0ESR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for MC33FS8415G0ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC33FS8415G0ESR2 reliable?

The price and inventory of MC33FS8415G0ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8415G0ESR2 is usually 5 days.

3.What payment methods are accepted for MC33FS8415G0ESR2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8415G0ESR2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC33FS8415G0ESR2?

MC33FS8415G0ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC33FS8415G0ESR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC33FS8415G0ESR2?

For technical support, including MC33FS8415G0ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8415G0ESR2 requirements.

6.How does Aetrix verify that MC33FS8415G0ESR2 is sourced from the original manufacturer or authorized distributors?

All MC33FS8415G0ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8415G0ESR2 meets industry standards.

7.What is the process for return or replacement of MC33FS8415G0ESR2?

All MC33FS8415G0ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8415G0ESR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC33FS8415G0ESR2 part is unused and in its original packaging.

Return procedure for MC33FS8415G0ESR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MC33FS8415G0ESR2 Tags

  • MC33FS8415G0ESR2
  • MC33FS8415G0ESR2 PDF
  • MC33FS8415G0ESR2 Datasheet
  • MC33FS8415G0ESR2 Specifications
  • MC33FS8415G0ESR2 Images
  • NXP Semiconductors
  • NXP Semiconductors MC33FS8415G0ESR2
  • Buy MC33FS8415G0ESR2
  • MC33FS8415G0ESR2 Price
  • MC33FS8415G0ESR2 Distributor
  • MC33FS8415G0ESR2 Supplier
  • MC33FS8415G0ESR2 Wholesale
Related Products
TPS2511DGNR
TPS2511DGNR

Texas Instruments

UTC2000/MG
UTC2000/MG

Microchip Technology

TUSB320HAIRWBR
TUSB320HAIRWBR

Texas Instruments

TPS61252DSGR
TPS61252DSGR

Texas Instruments

PI5USB30216CXUAEX
PI5USB30216CXUAEX

Diodes Incorporated

SN6501DBVR
SN6501DBVR

Texas Instruments

CYPD3177-24LQXQT
CYPD3177-24LQXQT

Infineon Technologies

SN6501QDBVRQ1
SN6501QDBVRQ1

Texas Instruments

STUSB1600AQTR
STUSB1600AQTR

STMicroelectronics

SN6505BDBVR
SN6505BDBVR

Texas Instruments

SN6501DBVT
SN6501DBVT

Texas Instruments

TPS65150PWPR
TPS65150PWPR

Texas Instruments

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER