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NXP Semiconductors MC33FS8415GJES
- Part No.:
- MC33FS8415GJES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8415GJES.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:3,551
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Product details
Overview
MC33FS8415GJES from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, three low-voltage synchronous buck converters (BUCK1/BUCK3 enabled, BUCK2 disabled), one BOOST converter, and two LDOs. It delivers up to 3.6 A peak on BUCK1 and BUCK3, supports 60 V DC input, and features SPI/I²C control with CRC, fail-safe output (FS0B), and power-good/reset signaling - optimized for radar systems with NXP S32R294 + TEF810x in 12 V/24 V applications.
For engineers reviewing the MC33FS8415GJES datasheet, MC33FS8415GJES pinout, MC33FS8415GJES application, or MC33FS8415GJES equivalent, key selection considerations include its ASIL B safety certification, OTP-configured 0.825 V BUCK1 core supply, dual voltage monitoring (VMON1/VMON2), fail-safe state machine behavior, and HVQFN56 wettable flank package compatibility with radar domain controllers requiring synchronized multi-rail power sequencing.
Technical Context
The MC33FS8415GJES implements a deterministic fail-safe state machine with deep fail-safe autoretry (infinite cycles), dedicated watchdog (simple WD), and integrated ABIST/LBIST for functional safety compliance. Its power architecture includes independent control loops for BUCK1 (2.22 MHz, 0.825 V, 4.5 A peak), BUCK3 (2.22 MHz, 2.3 V, 4.5 A peak), BOOST (2.22 MHz, 5.0 V), and dual LDOs (LDO1: 1.8 V/400 mA; LDO2: 3.3 V/400 mA), all coordinated via 8-slot power-up sequencing.
Safety monitoring covers VCOREMON (0.825 V), VDDIOMON (3.3 V), VMON1/VMON2 (configurable OV/UV thresholds), and FCCU inputs, with PGOOD/RSTB outputs asserting on fault detection. The device supports external frequency synchronization (FIN/FOUT), PSYNC for multi-device coordination, and I²C address 0x20 for system-level communication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 4.9 V to 60 V DC - supports 12 V and 24 V automotive battery rails with reverse-battery protection diodes required on VSUP1/VSUP2. |
| BUCK1 Output | 0.825 V / 4.5 A peak - configured for MCU core supply with SVS capability and soft-start slope of 7.81 mV/µs. |
| BUCK3 Output | 2.3 V / 4.5 A peak - enabled rail for auxiliary processing or sensor interface, sequenced in Slot 0. |
| BOOST Output | 5.0 V - supplies external PHY or interface ICs; uses internal low-side switch with 1.5 A peak input current capability. |
| LDO Outputs | LDO1: 1.8 V / 400 mA; LDO2: 3.3 V / 400 mA - dedicated for MCU I/O and ADC reference, both with thermal shutdown and DFS response. |
| Safety Certification | ASIL B per ISO 26262 - includes fail-safe output (FS0B), challenger watchdog, built-in self-test, and dedicated monitoring interfaces (FCCU1/FCCU2). |
| Interface | I²C (address 0x20) or SPI with CRC - enables secure configuration, real-time monitoring, and fault reporting without host MCU intervention. |
| Package | HVQFN56 (8 mm × 8 mm × 0.85 mm, 0.5 mm pitch, wettable flank) - thermally enhanced for radar ECU power density requirements. |
Pinout & Package
HVQFN56 plastic thermal enhanced very thin quad flat package with 56 terminals, 0.5 mm pitch, 8 mm × 8 mm body, and wettable flank (ES suffix). Exposed pad (EP) connects BUCK1/BUCK2/BUCK3 low-side GNDs and must be soldered to PCB ground plane for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP1 / VSUP2 | Main power inputs | Accept 4.9–60 V DC; require external reverse-battery diodes; feed internal regulators and bias circuits. |
| BUCK1_IN / BUCK1_SW / BUCK1_FB | Core buck regulator interface | Supports external inductor (1 µH), feedback resistor divider, and provides 0.825 V @ 4.5 A for S32R294 core rail. |
| BUCK3_IN / BUCK3_SW / BUCK3_FB | Auxiliary buck regulator interface | Enables 2.3 V @ 4.5 A output; sequenced in Slot 0; supports phase-shifting delay 3 for EMC optimization. |
| LDO1 / LDO2 | Linear regulator outputs | Deliver 1.8 V and 3.3 V at up to 400 mA each; used for MCU I/O banks and analog subsystems requiring low-noise supply. |
| FS0B | Fail-safe output | Active-low open-drain signal indicating safety state machine failure; drives external reset or isolation circuitry. |
| PGOOD / RSTB | Power status outputs | PGOOD asserts when all enabled rails meet regulation; RSTB provides MCU reset with external fault detection capability. |
| FCCU1 / FCCU2 | MCU error monitoring inputs | Accept challenge signals from S32R294 to verify host processor health; integral to ASIL B partitioning. |
| FIN / FOUT / PSYNC | Frequency synchronization | Enable system-wide SMPS clock alignment (455 kHz or 2.22 MHz) to reduce broadband EMI in radar modules. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configured power sequencing | Fixed 8-slot startup/shutdown order (BUCK1 in Slot 3, BUCK3 in Slot 0) ensures deterministic radar SoC initialization without software dependency. |
| Dual voltage supervision | Independent OV/UV monitoring on VCOREMON (0.825 V) and VDDIOMON (3.3 V) with programmable delays (25 µs OV_DGLT, 25 µs UV_DGLT) prevents false triggers during transients. |
| Fail-safe state machine | Infinite autoretry on fault detection (TSD, OV, UV) with configurable deep fail-safe mode - maintains system awareness while isolating faults in radar ECU environments. |
| EMC-optimized switching | 2.22 MHz fixed-frequency operation across all SMPS, plus FIN/FOUT synchronization and slew-rate control, reduces conducted emissions in 77 GHz radar bands. |
| Thermal robustness | Integrated thermal shutdown (TSD) with per-rail DFS response (e.g., BUCK1 shutdown + DFS) prevents cascading failures during overtemperature events. |
| Debug & diagnostics | DBG pin enables engineering-mode access; AMUX output routes internal voltages (VCORE, VDDIO, VMONx) to MCU ADC for runtime health monitoring. |
Applications
| Radar Power Management | ADAS Domain Controller Supply |
|---|---|
Use Scenario: Powers NXP S32R294 radar processor and TEF810x RF transceiver in 77 GHz corner radar modules. IC Role / Device Role / Timing Role: Primary SBC providing core (0.825 V), I/O (1.8 V/3.3 V), and PHY (5.0 V) rails with synchronized startup and fail-safe assertion on fault. Use Value: Enables ASIL B-compliant power delivery with deterministic sequencing, eliminating need for discrete supervisors and reducing BOM count by 4+ components. | Use Scenario: Supplies multiple voltage domains in centralized ADAS domain controllers integrating vision, radar, and vehicle networking. IC Role / Device Role / Timing Role: Centralized power manager delivering regulated rails to heterogeneous SoCs (e.g., S32R, S32G) and high-speed interfaces (Ethernet AVB, CAN FD). Use Value: Reduces layout complexity via single-package multi-rail solution with shared safety monitoring, lowering PCB area by >30% vs. discrete PMICs. |
| Vision System Power | Infotainment Head Unit |
Use Scenario: Powers S32V234 vision processor and image sensors in mono/stereo camera modules. IC Role / Device Role / Timing Role: Provides 1.1 V core, 1.8 V I/O, and 3.3 V analog rails with soft-start control and voltage supervision for pixel data integrity. Use Value: Ensures clean power-up sequence preventing image corruption during boot; SVS capability avoids brownout-induced frame loss. | Use Scenario: Supplies application processor, display driver, audio codec, and connectivity ICs in automotive infotainment head units. IC Role / Device Role / Timing Role: Delivers stable 1.0 V, 1.8 V, 3.3 V, and 5.0 V rails with thermal derating and dynamic voltage scaling support. Use Value: Maintains system uptime during cold-crank (4.9 V start threshold) and load-dump events (60 V tolerance), improving user experience reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8415GYES | Same OTP configuration (0.825 V BUCK1, 2.3 V BUCK3, 1.8 V LDO1, 3.3 V LDO2) but with dimple wettable flank (KS variant); identical electrical specs and pinout. | Targeted for new designs per NXP recommendation; same radar application scope (S32R294 + TEF810x). | Select MC33FS8415GYES for new projects requiring long-term manufacturability and enhanced solder joint inspection capability. |
| MC33FS8510A2ES | ASIL D–rated variant with identical BUCK1/BUCK3/LDO configurations but added FCCU monitoring, ERRMON input, and enhanced ABIST coverage. | Required for ASIL D–compliant radar domain controllers or safety-critical ADAS functions beyond ASIL B scope. | Choose MC33FS8510A2ES when system-level safety goals mandate ASIL D decomposition and deeper diagnostic coverage. |
Compared with MC33FS8415GJES, MC33FS8415GYES offers identical functionality with improved assembly yield via dimple wettable flank, while MC33FS8510A2ES extends safety capability to ASIL D with additional monitoring inputs and diagnostic rigor - enabling scalable safety architecture across radar product tiers.
Availability
MC33FS8415GJES is available at Aetrix Electronics and suitable for radar modules, ADAS domain controllers, and infotainment head units requiring stable component supply, automotive-grade qualification (AEC-Q100 Grade 1), and ASIL B functional safety compliance.
Supply support for MC33FS8415GJES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in automotive, industrial, and IoT solutions, with deep expertise in functional safety and radar technology.
The FS84 family is designed specifically for ASIL B automotive power management in radar, vision, and domain controller applications - emphasizing fail-safe operation, multi-rail integration, and EMC-robust switching performance.
FAQ
What is the primary safety certification level of the MC33FS8415GJES?
The MC33FS8415GJES is certified to ASIL B per ISO 26262, with integrated fail-safe state machine, simple watchdog, FCCU monitoring inputs, and built-in self-test. It meets AEC-Q100 Grade 1 qualification and supports safety-oriented system partitioning for radar ECUs where ASIL B is sufficient for the power management layer.
Which voltage rails are enabled and configured in the MC33FS8415GJES OTP setting?
The MC33FS8415GJES OTP configures BUCK1 (0.825 V, 4.5 A peak), BUCK3 (2.3 V, 4.5 A peak), BOOST (5.0 V), LDO1 (1.8 V, 400 mA), and LDO2 (3.3 V, 400 mA). BUCK2 is disabled. Power sequencing assigns BUCK1 to Slot 3 and BUCK3 to Slot 0, ensuring deterministic startup for S32R294-based radar systems.
How does the MC33FS8415GJES support electromagnetic compatibility in radar applications?
The MC33FS8415GJES supports EMC via 2.22 MHz fixed-frequency SMPS operation, FIN/FOUT synchronization pins for system-wide clock alignment, spread-spectrum modulation capability, and slew-rate control on switching nodes. These features collectively suppress broadband emissions critical for 77 GHz radar coexistence with sensitive RF front-ends.
What is the function of the FS0B pin on the MC33FS8415GJES?
The FS0B pin on the MC33FS8415GJES is an active-low, open-drain fail-safe output that asserts during detected faults (e.g., thermal shutdown, OV/UV, watchdog timeout). It drives external isolation circuitry or MCU reset logic, forming part of the ASIL B safety mechanism to ensure controlled system response during power-related failures.
Can the MC33FS8415GJES be used with both SPI and I²C interfaces?
Yes, the MC33FS8415GJES supports both SPI and I²C communication protocols with CRC protection. It uses I²C address 0x20 and provides dedicated pins (SCL/SDA or MOSI/MISO/SCLK/CSB). Interface selection is determined at boot via hardware strapping or OTP configuration, enabling flexible integration with diverse MCU platforms in radar and ADAS systems.
MC33FS8415GJES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8415GJES FAQ
1.How can I place an order for MC33FS8415GJES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8415GJES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8415GJES reliable?
The price and inventory of MC33FS8415GJES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8415GJES is usually 5 days.
3.What payment methods are accepted for MC33FS8415GJES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8415GJES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33FS8415GJES?
MC33FS8415GJES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8415GJES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8415GJES?
For technical support, including MC33FS8415GJES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8415GJES requirements.
6.How does Aetrix verify that MC33FS8415GJES is sourced from the original manufacturer or authorized distributors?
All MC33FS8415GJES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8415GJES meets industry standards.
7.What is the process for return or replacement of MC33FS8415GJES?
All MC33FS8415GJES units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8415GJES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8415GJES part is unused and in its original packaging.
Return procedure for MC33FS8415GJES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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