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NXP Semiconductors MC33FS8415GJESR2
- Part No.:
- MC33FS8415GJESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8415GJESR2.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:2,052
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Product details
Overview
MC33FS8415GJESR2 from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, three low-voltage synchronous buck converters (BUCK1/BUCK2/BUCK3), one boost converter, and two LDOs. It delivers up to 3.6 A peak per buck rail, supports 60 V DC input, and features SPI/I²C control with CRC, fail-safe output (FS0B), and power-good/reset signaling - optimized for radar systems using NXP S32R294 + TEF810x in 12 V/24 V applications.
For engineers reviewing the MC33FS8415GJESR2 datasheet, MC33FS8415GJESR2 pinout, MC33FS8415GJESR2 application, or MC33FS8415GJESR2 equivalent, this page provides verified functional safety architecture, regulator sequencing slots (BUCK1 Slot 3, BUCK3 Slot 0, LDO1 Slot 2, LDO2 Slot 1), OTP-configured VPRE=3.3 V / BUCK1=0.825 V / BUCK3=2.3 V / LDO1=LDO2=3.3 V, and fail-safe state machine behavior including infinite deep fail-safe autoretry and challenger watchdog support.
Technical Context
The MC33FS8415GJESR2 implements a dual-domain safety architecture: a dedicated fail-safe state machine monitors VCOREMON, VMON1–VMON4, PGOOD, RSTB, and external FCCU inputs, triggering FS0B assertion on fault detection. Its power management includes independent sequencing control across six slots, with BUCK1 assigned to MCU core supply (SVS-capable), BUCK3 supporting radar sensor rails, and LDO1/LDO2 powering ADC and PHY interfaces.
EMC optimization is achieved via frequency synchronization (FIN/FOUT), spread spectrum modulation, slew rate control on PRE_GHS/PRE_GLS, and manual tuning of switching frequencies (455 kHz forced PWM for VPRE; 2.22 MHz for BUCK1/BUCK3). The device uses OTP-programmed configuration - no runtime reprogramming - with pre-verified settings for radar use cases including TSD response (BUCK1/BUCK3 shutdown + DFS, LDO1/LDO2 shutdown).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 60 V DC max - supports direct connection to 12 V and 24 V automotive battery rails with reverse-battery protection diodes on VSUP1/VSUP2. |
| VPRE Output | 3.3 V fixed (OTP-configured) - supplies external high-side MOSFET gate drivers in radar front-end power stages. |
| BUCK1 Output | 0.825 V @ 4.5 A peak - MCU core supply with SVS capability and soft-start slope of 7.81 mV/µs. |
| BUCK3 Output | 2.3 V @ 4.5 A peak - dedicated radar sensor rail with power sequencing slot 0 and TSD-triggered shutdown + DFS. |
| LDO1 / LDO2 | 3.3 V each @ 400 mA DC - supplies MCU I/Os and physical layer interfaces; both assigned to sequencing slots 2 and 1 respectively. |
| Safety Certification | ASIL B compliant per ISO 26262 - includes fail-safe output (FS0B), built-in self-test (ABIST/LBIST), and dedicated monitoring circuitry for VCOREMON, VMON1–VMON4. |
| Interface | SPI or I²C (0x20 address) with CRC - enables secure configuration and real-time status reporting without host MCU dependency. |
Pinout & Package
MC33FS8415GJESR2 is housed in HVQFN56 (SOT684-23): 8 mm × 8 mm × 0.85 mm body, 0.5 mm pitch, wettable flank (ES suffix), exposed thermal pad (EP) connected to GNDFS/GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| FS0B (Pin 14) | Fail-safe output driver | Active-low open-drain signal asserting system-level fault condition; directly drives external safety-critical logic or MCU interrupt. |
| VCOREMON (Pin 17) | Core voltage monitor input | Connected to BUCK1 output to enable SVS functionality; triggers fail-safe response if 0.825 V deviates beyond ±4.5 % UV/OV thresholds. |
| BUCK1_FB (Pin 39) | Voltage feedback node | Closes regulation loop for 0.825 V core supply; requires external resistor divider to set precise output voltage and stability. |
| PSYNC (Pin 38) | Power sync I/O | Enables synchronized operation with second FS85 device or external PMIC - eliminates beat frequencies and reduces system-level EMI. |
| FIN / FOUT (Pins 20 / 24) | Freq. sync input/output | Allows daisy-chained clock distribution across multiple SMPS to align switching edges and minimize conducted emissions. |
| EP (Pin 57) | Exposed thermal pad | Internally connects BUCK1/BUCK2/BUCK3 low-side GNDs; must be soldered to PCB ground plane for thermal dissipation and noise reduction. |
Key Features
| Feature | Design Value |
|---|---|
| Fail-safe state machine | Independent hardware monitor with infinite autoretry on deep fail-safe entry - ensures deterministic response without MCU intervention during critical faults. |
| Multi-rail power sequencing | Configurable start/stop slots (e.g., BUCK1 Slot 3, BUCK3 Slot 0, LDO2 Slot 1) - enables precise timing alignment for radar SoC boot-up and sensor initialization sequences. |
| EMC-optimized SMPS control | Integrated spread spectrum, slew rate control on PRE_GHS/PRE_GLS, and FIN/FOUT synchronization - reduces peak radiated emissions by >10 dBμV in 150 kHz–30 MHz band. |
| OTP-configured radar profile | Pre-programmed VPRE=3.3 V, BUCK1=0.825 V, BUCK3=2.3 V, LDO1/LDO2=3.3 V, and TSD behavior (BUCK1/BUCK3 shutdown + DFS) - eliminates engineering validation overhead for S32R294+TEF810x designs. |
| Dual safety interface | FCCU1/FCCU2 inputs accept MCU error signals; ERRMON monitors external ICs - enables layered safety partitioning between radar processor and power subsystem. |
Applications
| Radar Sensor Power Management | ADAS Domain Controller Supply |
|---|---|
|
Use Scenario: Powers NXP S32R294 radar MCU and TEF810x RF transceiver in corner/imaging radar modules operating from 12 V/24 V battery. IC Role / Device Role / Timing Role: System basis chip providing regulated VPRE (3.3 V), core (0.825 V), sensor (2.3 V), and I/O (3.3 V) rails with synchronized startup and fail-safe assertion on overvoltage/overtemperature. Use Value: Eliminates need for discrete supervisors and sequencers; reduces BOM count by 4+ components while meeting ASIL B requirements out-of-box. |
Use Scenario: Supplies multi-core domain controller (e.g., S32Z/S32E) requiring independent, sequenced rails for CPU, GPU, memory, and communication peripherals. IC Role / Device Role / Timing Role: Centralized power manager delivering BUCK1 (core), BUCK3 (memory), LDO1/LDO2 (I/O/ADC), and BOOST (PHY bias) with slot-based sequencing and fault isolation. Use Value: Enables deterministic boot order across heterogeneous subsystems; fail-safe output (FS0B) halts unsafe execution before corrupted data propagates to vehicle networks. |
| Vision System Power Architecture | Automotive Infotainment SoC Supply |
|
Use Scenario: Powers S32V234 vision processor and image sensors in mono/stereo camera modules with strict voltage accuracy and low noise. IC Role / Device Role / Timing Role: Delivers low-noise 1.1 V/1.8 V/3.3 V rails with soft-start control, VMON supervision, and PGOOD coordination to ensure clean sensor initialization. Use Value: Integrated LDOs replace discrete regulators for analog/ADC supplies; BUCK3's 2.22 MHz switching minimizes interference with image capture timing. |
Use Scenario: Supplies infotainment head unit SoC (e.g., i.MX8Q) requiring multiple voltage domains, thermal management, and fail-safe reset coordination. IC Role / Device Role / Timing Role: Provides scalable SMPS/LDO outputs with programmable sequencing, temperature derating, and fail-safe output to meet functional safety requirements for non-critical but safety-relevant functions. Use Value: Reduces layout complexity vs. discrete PMIC + supervisor solutions; PSYNC enables synchronized switching with audio codec power supplies to suppress audible noise. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8415GYESR2 | Same OTP configuration (VPRE=3.3 V, BUCK1=0.825 V, BUCK3=2.5 V) but dimple wettable flank (KS suffix); identical electrical specs and safety features. | Targeted for new designs per NXP recommendation; same radar application fit but optimized for improved solder joint inspection yield. | Select when new board design allows KS-package footprint; offers identical functionality with enhanced manufacturability. |
| MC33FS8510A2ESR2 | ASIL D–rated variant with identical pinout and regulator count; differs in safety architecture (dual-channel FCCU, enhanced ABIST coverage) and OTP settings (BUCK1=1.025 V, VPRE=3.3 V). | Required for ASIL D–compliant radar domain controllers; supports higher integrity monitoring but increases system-level safety analysis burden. | Choose only when full ASIL D decomposition is mandated; not drop-in compatible due to differing safety register maps and diagnostic coverage. |
Compared with MC33FS8415GJESR2, MC33FS8415GYESR2 offers identical electrical and safety performance in a manufacturing-optimized package, while MC33FS8510A2ESR2 upgrades to ASIL D at the cost of increased design verification effort and non-interchangeable safety firmware.
Availability
MC33FS8415GJESR2 is available at Aetrix Electronics and suitable for radar sensor modules, ADAS domain controllers, and automotive vision systems requiring stable component supply, long-term lifecycle support, and AEC-Q100 Grade 1 qualification.
Supply support for MC33FS8415GJESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in automotive, industrial, and IoT solutions, with deep expertise in functional safety and power management ICs.
The FS84 product line delivers ASIL B–certified system basis chips for radar, vision, and domain controller applications - designed to consolidate power, safety, and communication functions into a single AEC-Q100 qualified device.
FAQ
What is the primary safety certification level of the MC33FS8415GJESR2?
The MC33FS8415GJESR2 is certified to ASIL B per ISO 26262, developed in compliance with the ASIL B process and qualified to AEC-Q100 Grade 1. It includes a dedicated fail-safe state machine, ABIST/LBIST, and hardware-monitored voltage supervision (VCOREMON, VMON1–VMON4) - all verified for MC33FS8415GJESR2's OTP configuration.
Does the MC33FS8415GJESR2 support external frequency synchronization?
Yes, the MC33FS8415GJESR2 supports external frequency synchronization via FIN (Pin 20) and FOUT (Pin 24), enabling phase-aligned switching across multiple SMPS to reduce system-level EMI. This feature is active and validated for MC33FS8415GJESR2's 2.22 MHz BUCK1/BUCK3 and 455 kHz VPRE operation.
What are the OTP-configured output voltages for MC33FS8415GJESR2?
The MC33FS8415GJESR2 is factory-programmed with VPRE = 3.3 V, BUCK1 = 0.825 V, BUCK3 = 2.3 V, LDO1 = 3.3 V, and LDO2 = 3.3 V. These values are fixed per OTP and confirmed in Table 4.1 of the FS84_FS85C datasheet for part number MC33FS8415GJ.
How does the MC33FS8415GJESR2 handle thermal shutdown events?
On thermal shutdown (TSD), the MC33FS8415GJESR2 disables BUCK1 and BUCK3 while asserting deep fail-safe (DFS); LDO1 and LDO2 also shut down. Recovery is enabled via infinite autoretry - the device automatically restarts regulation once junction temperature falls below threshold, without requiring external reset.
Is the MC33FS8415GJESR2 pin-compatible with other FS84/FS85 family members?
Yes, all FS84 and FS85 devices are pin-to-pin and software compatible per the datasheet. MC33FS8415GJESR2 shares the HVQFN56 footprint and register map with MC33FS8410G0ES, MC33FS8420G0ES, and MC33FS8530A0ES - though OTP configurations and safety ratings differ.
MC33FS8415GJESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8415GJESR2 FAQ
1.How can I place an order for MC33FS8415GJESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8415GJESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8415GJESR2 reliable?
The price and inventory of MC33FS8415GJESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8415GJESR2 is usually 5 days.
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Once your MC33FS8415GJESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8415GJESR2?
For technical support, including MC33FS8415GJESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8415GJESR2 requirements.
6.How does Aetrix verify that MC33FS8415GJESR2 is sourced from the original manufacturer or authorized distributors?
All MC33FS8415GJESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8415GJESR2 meets industry standards.
7.What is the process for return or replacement of MC33FS8415GJESR2?
All MC33FS8415GJESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8415GJESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8415GJESR2 part is unused and in its original packaging.
Return procedure for MC33FS8415GJESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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