NXP Semiconductors MC33FS8415GJKSR2
- Part No.:
- MC33FS8415GJKSR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8415GJKSR2.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC33FS8415GJKSR2 from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, three low-voltage synchronous buck converters (BUCK1/BUCK2/BUCK3), one boost converter, and two LDOs. It delivers up to 3.6 A peak per buck rail, supports 60 V DC input, and features SPI/I²C control with CRC, fail-safe output (FS0B), and power-good/reset signaling for radar domain controllers.
For engineers reviewing the MC33FS8415GJKSR2 datasheet, MC33FS8415GJKSR2 pinout, MC33FS8415GJKSR2 application, or MC33FS8415GJKSR2 equivalent, key selection criteria include its ASIL B safety certification, 4.5 A current limit on BUCK1, 2.22 MHz switching frequency, OTP-programmable power-up sequencing, and dedicated support for NXP S32R294 + TEF810x radar systems in 12 V/24 V automotive applications.
Technical Context
The MC33FS8415GJKSR2 implements a multi-rail power management architecture with independent control loops for each regulator: VPRE uses external MOSFETs with programmable slope compensation (50 mV/µs) and 32 ms turn-off delay; BUCK1 supplies MCU core at 0.825 V with 4.5 A current limit and 2.22 MHz operation; BUCK3 is enabled and configured for 2.3 V output with 4.5 A capability and 10.41 mV/µs DVS soft-start.
Safety logic includes a dedicated fail-safe state machine, challenger watchdog, built-in self-test (ABIST), and configurable voltage supervision on VCOREMON, VDDIOMON, VMON1–VMON4 with programmable OV/UV thresholds and deglitch times. The device supports power synchronization (PSYNC) and frequency synchronization (FIN/FOUT) for EMC-optimized multi-device systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ASIL Level | ASIL B compliant per ISO 26262; qualified to AEC-Q100 Grade 1 |
| Input Voltage Range | 4.9 V to 60 V DC - supports 12 V and 24 V automotive battery systems with reverse-battery protection diodes required on VSUP1/VSUP2 |
| BUCK1 Output | 0.825 V @ 4.5 A peak - dedicated MCU core supply with SVS capability and slot-3 power sequencing |
| BUCK3 Output | 2.3 V @ 4.5 A peak - enabled and sequenced in Slot 0; supports radar sensor I/O or interface ICs |
| Switching Frequency | 2.22 MHz fixed - enables compact magnetics and reduces EMI in high-density radar PCB layouts |
| Interface | SPI or I²C (0x20 address) with CRC - enables secure configuration, monitoring, and fault reporting in safety-critical boot sequences |
| Fail-Safe Output | FS0B open-drain active-low - directly drives external safety relay or MCU fail-safe input without level-shifting |
Pinout & Package
MC33FS8415GJKSR2 is housed in a HVQFN56 package (8 mm × 8 mm × 0.85 mm, 0.5 mm pitch) with wettable flank (KS variant) and exposed thermal pad (EP) connected to GNDFS/GND. Pin count is 56, with 3 dedicated GND pins (GND, GNDFS, EP) and 2 power inputs (VSUP1, VSUP2).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| FS0B (Pin 14) | Fail-safe output | Active-low open-drain signal indicating internal safety violation or external watchdog timeout; requires external pull-up to VDDIO |
| VCOREMON (Pin 17) | Core voltage monitor input | Must be connected to BUCK1 output to enable SVS and over/under-voltage detection with 95.5% UVTH and 104.5% OVTH |
| BUCK1_FB (Pin 39) | Buck1 feedback input | Closes regulation loop for 0.825 V output; supports resistor-divider programming and dynamic voltage scaling |
| PSYNC (Pin 38) | Power sync I/O | Configurable as input or output to synchronize startup timing between multiple FS84/FS85 devices or external PMICs |
| FIN (Pin 20) / FOUT (Pin 24) | Freq sync input/output | Enables daisy-chained SMPS clock alignment across system for reduced broadband EMI peaks |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable power sequencing | Regulator start/stop slots assigned per rail (e.g., BUCK1 in Slot 3, BUCK3 in Slot 0) - enables deterministic boot order for radar SoCs like S32R294 |
| Dual-supervision LDOs | LDO1 (1.8 V/400 mA) and LDO2 (3.3 V/400 mA) - independently monitored and sequenced for MCU I/O and ADC supply domains |
| EMC optimization suite | SMPS frequency synchronization, spread spectrum (not enabled by default), slew rate control, and manual tuning - reduces radiated emissions in 77 GHz radar bands |
| Fail-safe state machine | Dedicated hardware FSM with infinite auto-retry on deep fail-safe entry - maintains fail-safe output assertion until external reset or recovery command |
| Multi-input wake-up | WAKE1 (Pin 49) and WAKE2 (Pin 1) - support low-power sleep mode exit via battery or CAN transceiver signals with external series resistors |
Applications
| Radar Sensor Power Management | ADAS Domain Controller Supply |
|---|---|
Use Scenario: Powers NXP S32R294 radar processor and TEF810x RF transceiver in 12 V/24 V automotive radar modules. IC Role / Device Role / Timing Role: System basis chip providing regulated VPRE (3.3 V), BUCK1 (0.825 V core), BUCK3 (2.3 V I/O), LDO1 (1.8 V), and LDO2 (3.3 V) with synchronized startup. Use Value: Enables single-chip power solution meeting ASIL B requirements while reducing board area and BOM count versus discrete PMIC + supervisor designs. | Use Scenario: Supplies power to multi-core ADAS domain controllers requiring tightly sequenced rails for CPU, GPU, and vision accelerators. IC Role / Device Role / Timing Role: Integrates six regulated outputs (VPRE, BUCK1–BUCK3, LDO1, LDO2) with programmable slot-based sequencing and real-time voltage monitoring. Use Value: Eliminates need for external sequencers and supervisors; supports functional safety diagnostics via ABIST, FCCU, and PGOOD/RSTB signaling. |
| Vision System Power Architecture | Infotainment Head Unit Power |
Use Scenario: Delivers clean, low-noise power to S32V234 vision processors and image sensors in mono/stereo camera modules. IC Role / Device Role / Timing Role: Provides BUCK1 (1.03125 V core), BUCK3 (3.3 V sensor interface), LDO1 (1.8 V), and LDO2 (3.3 V) with 2.22 MHz switching to minimize interference with image data paths. Use Value: Achieves <15 mVpp output ripple on critical rails and supports dynamic voltage scaling for power-aware vision processing. | Use Scenario: Manages power for infotainment head units with display, audio DSP, and connectivity modules (Wi-Fi, Bluetooth, cellular). IC Role / Device Role / Timing Role: Supplies VPRE (3.3 V), BUCK1 (1.2 V), BUCK3 (2.5 V), LDO1 (1.8 V), and LDO2 (3.3 V) with independent fault handling and fail-safe output for system-level shutdown. Use Value: Supports hot-plug operation and graceful degradation during brown-out events via configurable UV/OV thresholds and deglitch timers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8410G3ES | ASIL B; BUCK1=1.25 V/4.5 A; BUCK3=2.3 V/4.5 A; no FCCU; VPRE=3.3 V; TSD behavior: BUCK3 shutdown + DFS | Targeted for radar with S32R274 MCU; lacks FCCU monitoring inputs and deep fail-safe auto-retry | Select when FCCU and infinite auto-retry are not required; lower cost for legacy radar platforms |
| MC33FS8510A2ES | ASIL D; BUCK1=1.025 V/2.6 A; BUCK3=1.8 V/2.6 A; includes FCCU1/FCCU2; PLL enabled; TSD behavior: BUCK3 shutdown + DFS | Designed for domain controllers requiring ASIL D partitioning and MCU error monitoring via FCCU | Select for ASIL D systems needing dual MCU monitoring inputs and higher safety integrity; requires updated safety case documentation |
Compared with MC33FS8410G3ES, MC33FS8415GJKSR2 adds FCCU monitoring and infinite deep fail-safe retry, making it suitable for next-gen radar with enhanced diagnostic coverage; versus MC33FS8510A2ES, it trades ASIL D compliance for higher BUCK1 current (4.5 A vs 2.6 A) and optimized sequencing for S32R294+TEF810x integration.
Availability
MC33FS8415GJKSR2 is available at Aetrix Electronics and suitable for radar sensor modules, ADAS domain controllers, and automotive vision systems requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified power management.
Supply support for MC33FS8415GJKSR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in radar, vision, and ADAS silicon.
The FS84 product line delivers ASIL B–certified system basis chips for radar, vision, and infotainment systems, emphasizing integrated safety, EMC robustness, and seamless compatibility with NXP's S32R and S32V processor families.
FAQ
What is the primary safety certification level of the MC33FS8415GJKSR2?
The MC33FS8415GJKSR2 is certified to ASIL B per ISO 26262 and qualified to AEC-Q100 Grade 1. Its safety features include a dedicated fail-safe state machine, ABIST, configurable voltage monitors (VCOREMON, VMON1–VMON4), and fail-safe output FS0B - all validated for use in radar and ADAS applications where ASIL B compliance is required. MC33FS8415GJKSR2 does not meet ASIL D requirements.
Which output rails are enabled and configured by default in the MC33FS8415GJKSR2?
In the MC33FS8415GJKSR2, BUCK1 (0.825 V, 4.5 A), BUCK3 (2.3 V, 4.5 A), LDO1 (1.8 V, 400 mA), and LDO2 (3.3 V, 400 mA) are enabled and factory-programmed. VPRE operates at 3.3 V with external MOSFETs. BUCK2 is disabled. All regulators are assigned to specific power-up sequencing slots (e.g., BUCK1 in Slot 3, BUCK3 in Slot 0), and OTP configuration is fixed - no field reprogramming is supported for production units.
How does the MC33FS8415GJKSR2 support radar-specific EMC requirements?
The MC33FS8415GJKSR2 supports radar EMC via FIN/FOUT frequency synchronization for multi-device clock alignment, programmable slew rate control on switching nodes, and spread spectrum modulation (configurable via OTP). Its 2.22 MHz fixed switching frequency avoids sensitive ISM bands, and the integrated BOOST converter (5.0 V output) powers radar PHYs with low noise. These features collectively reduce broadband radiated emissions critical for 77 GHz radar coexistence.
What is the function of the PSYNC pin on the MC33FS8415GJKSR2?
The PSYNC pin (Pin 38) on the MC33FS8415GJKSR2 serves as a bidirectional power synchronization interface. When configured as input, it aligns the startup timing of MC33FS8415GJKSR2 with another FS84/FS85 device or external PMIC; as output, it triggers synchronized power-on of downstream regulators. This ensures deterministic sequencing across multi-rail systems - essential for radar modules using S32R294 + TEF810x where rail timing margins are sub-microsecond.
Can the MC33FS8415GJKSR2 be used with non-NXP microcontrollers?
Yes, the MC33FS8415GJKSR2 supports standard SPI and I²C interfaces (I²C address 0x20) with CRC-protected transactions, enabling interoperability with non-NXP MCUs. However, full utilization of safety features - including FCCU monitoring, fail-safe state machine control, and ABIST execution - requires integration with compatible safety software stacks. Reference designs and driver libraries are optimized for NXP S32R/S32V, but register-level access allows adaptation to other architectures.
MC33FS8415GJKSR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8415GJKSR2 FAQ
1.How can I place an order for MC33FS8415GJKSR2 through Aetrix?
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5.How can I obtain technical support or documentation for MC33FS8415GJKSR2?
For technical support, including MC33FS8415GJKSR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8415GJKSR2 requirements.
6.How does Aetrix verify that MC33FS8415GJKSR2 is sourced from the original manufacturer or authorized distributors?
All MC33FS8415GJKSR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8415GJKSR2 meets industry standards.
7.What is the process for return or replacement of MC33FS8415GJKSR2?
All MC33FS8415GJKSR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8415GJKSR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8415GJKSR2 part is unused and in its original packaging.
Return procedure for MC33FS8415GJKSR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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