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NXP Semiconductors MC33FS8415GYESR2
- Part No.:
- MC33FS8415GYESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8415GYESR2.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:4,866
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Product details
Overview
MC33FS8415GYESR2 from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating one VPRE synchronous buck controller, one low-voltage integrated synchronous BUCK1 (0.825 V/4.5 A), one BUCK3 (2.5 V/4.5 A), a BOOST converter (5.0 V/1.5 A), and two LDOs (1.8 V/400 mA and 3.3 V/400 mA). It serves as the primary power management and safety monitor for radar systems with NXP S32R294 + TEF810x/TEF82xx in 12 V/24 V applications.
For engineers reviewing the MC33FS8415GYESR2 datasheet, MC33FS8415GYESR2 pinout, MC33FS8415GYESR2 application, or MC33FS8415GYESR2 equivalent, this page delivers verified functional architecture, OTP-configured regulator settings, fail-safe state machine behavior, SPI/I²C interface timing, and radar-specific power sequencing - all confirmed for the exact MC33FS8415GYESR2 variant per NXP FS84_FS85C Rev. 12.0.
Technical Context
The MC33FS8415GYESR2 implements a dual-domain safety architecture: a dedicated fail-safe state machine monitors BUCK1, BUCK3, LDO1/LDO2, and external voltage rails via six analog monitoring inputs (VCOREMON, VMON1–VMON4), triggering fail-safe output (FS0B) and deep fail-safe autoretry (infinite cycles) on fault detection. Its power-up sequence assigns BUCK1 to Slot 3, BUCK3 to Slot 0, LDO1 to Slot 2, and LDO2 to Slot 1 - matching radar subsystem timing requirements.
It supports full functional safety compliance per ISO 26262 up to ASIL B, with challenger watchdog disabled and simple watchdog enabled, FCCU monitoring disabled, and FLT_RECOVERY enabled. The device uses 32-bit SPI or I²C (address 0x20) with CRC for configuration, and includes frequency synchronization (FIN/FOUT), PSYNC for multi-device coordination, and AMUX for ADC-based rail telemetry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 60 V DC max - supports direct connection to 12 V and 24 V automotive battery rails with reverse-battery protection diodes on VSUP1/VSUP2. |
| BUCK1 Output | 0.825 V / 4.5 A peak - configured for MCU core supply with SVS capability and soft-start slope of 7.81 mV/µs. |
| BUCK3 Output | 2.5 V / 4.5 A peak - dedicated to radar sensor analog front-end or interface IC supply, sequenced in Slot 0. |
| LDO1/LDO2 Outputs | 1.8 V / 400 mA and 3.3 V / 400 mA - provide low-noise, low-ripple supplies for MCU I/Os and ADC reference circuits. |
| Fail-Safe Response | Infinite deep fail-safe autoretry - asserts FS0B (open-drain, active-low) and initiates full power cycle recovery without MCU intervention. |
| Interface Protocol | SPI or I²C (0x20) with CRC - enables secure register access, OTP emulation during engineering, and real-time fault reporting via INTB and PGOOD/RSTB signals. |
| Thermal Shutdown | TSD triggers BUCK1/BUCK3/LDO1/LDO2 shutdown with DFS (deep fail-safe) activation - ensures deterministic safe state entry under overtemperature. |
Pinout & Package
MC33FS8415GYESR2 is housed in HVQFN56 (8 mm × 8 mm × 0.85 mm), thermal-enhanced wettable flank package with 0.5 mm pitch and exposed pad (EP) tied to GNDFS/GND. Pin compatibility follows FS84 family layout (non-superset variant).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BUCK1_FB (39) | Voltage feedback input | Closes regulation loop for 0.825 V BUCK1 output; connects to resistor divider on VCORE rail. |
| VCOREMON (17) | Core voltage monitor input | Directly connected to BUCK1 output for SVS and over/under-voltage fault detection (UVTH = 95.5%, OVTH = 104.5%). |
| FS0B (14) | Fail-safe output | Open-drain active-low signal asserting safe state; drives external safety relay or MCU safety interrupt. |
| INTB (33) | Interrupt output | Active-low interrupt flag indicating fault event (e.g., TSD, UV/OV, watchdog timeout) requiring MCU service. |
| PSYNC (38) | Power sync I/O | Enables synchronized switching across multiple MC33FS8415GYESR2 devices or with external PMIC to reduce system EMI peaks. |
| WAKE1/WAKE2 (1, 49) | Wake-up inputs | Analog/digital wake sources with external series resistor; initiate power-up from OFF mode (10 µA quiescent current). |
Key Features
| Feature | Design Value |
|---|---|
| ASIL B Safety Certification | Developed per ISO 26262 process; qualified to AEC-Q100 Grade 1 (−40 °C to +125 °C); includes ABIST, LBIST, and dedicated fail-safe state machine. |
| Radar-Optimized Power Sequencing | Pre-programmed slot assignment: BUCK1 (Slot 3), BUCK3 (Slot 0), LDO1 (Slot 2), LDO2 (Slot 1) - aligns with S32R294 + TEF810x boot timing. |
| EMC Optimization | Integrated FSYNC (FIN/FOUT), spread spectrum, slew rate control, and manual frequency tuning - reduces radiated emissions in 77 GHz radar bands. |
| OTP-Configurable Regulators | Factory-programmed BUCK1 (0.825 V), BUCK3 (2.5 V), LDO1 (1.8 V), LDO2 (3.3 V), and VBOOST (5.0 V) - eliminates external resistor networks and enables design reuse. |
| Multi-Rail Analog Monitoring | Six independent voltage monitors (VCOREMON, VMON1–VMON4) with programmable OV/UV thresholds and deglitch times - enables comprehensive rail health telemetry for radar subsystems. |
Applications
| Radar Sensor Power Management | ADAS Domain Controller Auxiliary Supply |
|---|---|
Use Scenario: Powers NXP S32R294 MCU and TEF810x/TEF82xx radar transceivers in corner or imaging radar modules operating from 12 V/24 V battery. IC Role / Device Role / Timing Role: Primary SBC providing regulated BUCK1 (0.825 V core), BUCK3 (2.5 V RF bias), LDO1 (1.8 V I/O), LDO2 (3.3 V ADC), and fail-safe supervision. Use Value: Enables single-chip power + safety solution meeting ASIL B requirements while reducing board area by consolidating six regulators and safety logic. | Use Scenario: Supplies auxiliary rails (e.g., CAN PHY, sensor interfaces, debug ports) in ADAS domain controllers where main SoC uses separate high-power PMIC. IC Role / Device Role / Timing Role: Secondary SBC delivering isolated, monitored LDO outputs and fail-safe signaling to augment main power tree. Use Value: Provides deterministic fault response (FS0B assertion + infinite retry) and voltage telemetry (AMUX) without burdening main controller's safety resources. |
| Automotive Camera Module Power | Infotainment Head Unit Subsystem |
Use Scenario: Powers image signal processor (ISP) and MIPI interface in mono/stereo camera modules requiring low-noise, tightly regulated supplies. IC Role / Device Role / Timing Role: Delivers LDO1 (1.8 V ISP core), LDO2 (3.3 V MIPI PHY), and BUCK3 (2.5 V sensor bias) with soft-start and sequencing. Use Value: Eliminates need for discrete LDOs and sequencing ICs; integrated monitoring prevents image corruption from undervoltage events. | Use Scenario: Supplies audio codec, touch controller, and display interface in infotainment head units with strict EMC and thermal constraints. IC Role / Device Role / Timing Role: Provides low-EMI BUCK3 (2.5 V) and noise-sensitive LDOs (1.8 V/3.3 V) with FSYNC synchronization to avoid beat frequencies with display clocks. Use Value: Reduces conducted/radiated emissions through synchronized switching and spread spectrum - critical for CISPR 25 Class 5 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8410GYESR2 | Lacks FCCU monitoring and supports only up to 2 VMON inputs; BUCK3 output fixed at 2.3 V (vs. 2.5 V); no FLT_RECOVERY. | Targeted for simpler radar sensors without external IC error monitoring or deep fail-safe recovery requirements. | Select when cost sensitivity outweighs need for full fault recovery and extended monitoring. |
| MC33FS8510A2ESR2 | ASIL D–rated; adds FCCU1/FCCU2 monitoring, ERRMON input, and Challenger WD; BUCK1 set to 1.025 V; VBOOST = 5.0 V. | Required for domain controllers or BMS where end-to-end ASIL D decomposition mandates dual-channel MCU monitoring. | Select when system-level ASIL D allocation requires hardware-enforced challenge-response watchdog and external IC fault injection capability. |
Compared with MC33FS8410GYESR2, the MC33FS8415GYESR2 adds FLT_RECOVERY and four VMON inputs for enhanced radar subsystem diagnostics; versus MC33FS8510A2ESR2, it trades ASIL D certification and challenger watchdog for lower cost and simplified safety qualification while retaining identical radar-optimized OTP settings.
Availability
MC33FS8415GYESR2 is available at Aetrix Electronics and suitable for radar sensor modules, ADAS domain controllers, and automotive infotainment subsystems requiring stable component supply, AEC-Q100 Grade 1 qualification, and ASIL B functional safety compliance.
Supply support for MC33FS8415GYESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in radar processing and automotive power management.
The FS84 product line delivers ASIL B–capable system basis chips optimized for radar, vision, and domain controller power architectures - emphasizing integrated safety, EMC robustness, and OTP-configurable multi-rail regulation.
FAQ
What is the primary safety certification level for the MC33FS8415GYESR2?
The MC33FS8415GYESR2 is ASIL B–capable and developed in compliance with ISO 26262 for automotive functional safety. It is qualified per AEC-Q100 Grade 1 (−40 °C to +125 °C) and includes ABIST, LBIST, and a dedicated fail-safe state machine. The MC33FS8415GYESR2 does not support ASIL D decomposition - that requires FS85-series variants like MC33FS8510A2ESR2.
Which regulator outputs are pre-configured in the MC33FS8415GYESR2 and what are their values?
The MC33FS8415GYESR2 has factory-programmed OTP settings: BUCK1 delivers 0.825 V (4.5 A), BUCK3 delivers 2.5 V (4.5 A), LDO1 delivers 1.8 V (400 mA), LDO2 delivers 3.3 V (400 mA), and VBOOST delivers 5.0 V (1.5 A). These values are confirmed in Table 4.1 of the FS84_FS85C Rev. 12.0 datasheet for the GY OTP flavor.
How does the MC33FS8415GYESR2 support radar-specific EMC requirements?
The MC33FS8415GYESR2 supports radar EMC via FIN/FOUT frequency synchronization, spread spectrum modulation, slew rate control on switching nodes, and manual frequency tuning - all enabling precise alignment of switching edges to avoid interference with 77 GHz radar chirp timing. Its PSYNC pin further allows coordinated operation across multiple MC33FS8415GYESR2 devices in multi-radar systems.
What is the function of the FS0B pin on the MC33FS8415GYESR2 and how is it used in a radar system?
The FS0B pin on the MC33FS8415GYESR2 is an open-drain, active-low fail-safe output that asserts during detected faults (e.g., overtemperature, undervoltage, watchdog timeout). In radar systems, FS0B drives external safety relays or connects to the S32R294 MCU's safety interrupt pin to trigger immediate subsystem shutdown and initiate deep fail-safe autoretry - ensuring deterministic safe state entry without software dependency.
Can the MC33FS8415GYESR2 be used with both SPI and I²C interfaces, and what are the address details?
Yes, the MC33FS8415GYESR2 supports both 32-bit SPI and I²C interfaces with CRC protection. Its I²C address is fixed at 0x20 (7-bit), and SPI communication uses standard MOSI/MISO/SCLK/CSB signals. Interface selection is hardware-configured via strap pins, and both protocols provide full register access for configuration, monitoring, and fault reporting in the MC33FS8415GYESR2.
MC33FS8415GYESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8415GYESR2 FAQ
1.How can I place an order for MC33FS8415GYESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8415GYESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8415GYESR2 reliable?
The price and inventory of MC33FS8415GYESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8415GYESR2 is usually 5 days.
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Once your MC33FS8415GYESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8415GYESR2?
For technical support, including MC33FS8415GYESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8415GYESR2 requirements.
6.How does Aetrix verify that MC33FS8415GYESR2 is sourced from the original manufacturer or authorized distributors?
All MC33FS8415GYESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8415GYESR2 meets industry standards.
7.What is the process for return or replacement of MC33FS8415GYESR2?
All MC33FS8415GYESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8415GYESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8415GYESR2 part is unused and in its original packaging.
Return procedure for MC33FS8415GYESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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