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NXP Semiconductors MC33FS8420G0ES

Part No.:
MC33FS8420G0ES
Manufacturer:
NXP Semiconductors
Category:
Power Management - Specialized
Package:
56-VFQFN Exposed Pad
Datasheet:
AetrixMC33FS8420G0ES.pdf
Description:
SAFETY POWER MANAGEMENT IC, QFN5
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,596

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Product details

Overview

MC33FS8420G0ES from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, two low-voltage synchronous buck converters (BUCK1 and BUCK2), one boost converter, and two LDOs. It delivers up to 3.6 A peak per buck rail, supports 60 V DC input, and features SPI/I²C control with CRC, fail-safe output, and power-up sequencing for radar and ADAS domain controllers.

For engineers reviewing the MC33FS8420G0ES datasheet, MC33FS8420G0ES pinout, MC33FS8420G0ES application, or MC33FS8420G0ES equivalent, this device serves as a multi-rail power management solution requiring functional safety compliance (ISO 26262), EMC-optimized frequency synchronization, and configurable voltage rails for MCU core, I/O, and sensor supplies in 12 V/24 V automotive systems.

Technical Context

The MC33FS8420G0ES implements a hierarchical power architecture with three independent switching regulators (VPRE controller + BUCK1 + BUCK2) and two linear regulators (LDO1/LDO2), all coordinated by an integrated safety state machine. Its dual wake-up inputs (WAKE1/WAKE2), fail-safe output (FS0B), and dedicated monitoring pins (VCOREMON, VMON1–VMON4) enable robust fault detection and response in ASIL B–compliant systems.

It supports external frequency synchronization (FIN/FOUT), spread-spectrum modulation, and slew-rate control to meet stringent automotive EMC requirements. Power sequencing is programmable via OTP and controlled through SPI/I²C, with configurable start/stop slots and deep fail-safe autoretry behavior.

Key Specifications

ParameterValue and Actual Design Meaning
Input Voltage Range4.9 V to 60 V DC - supports both 12 V and 24 V automotive battery architectures with reverse-battery protection diode requirement on VSUP1/VSUP2.
BUCK1 Output1.1 V @ 4.5 A peak - dedicated MCU core supply with SVS capability and soft-start slope of 7.81 mV/µs.
BUCK2 Output1.8 V @ 4.5 A peak - second low-voltage rail with multiphase capability disabled; starts in Slot 0 per OTP configuration.
LDO1/LDO2 Output1.8 V / 3.3 V @ 400 mA each - supplies MCU I/O and ADC reference; independently monitored and sequenced.
Fail-Safe OutputFS0B active-low open-drain - asserts on detected fault (TSD, OV/UV, watchdog timeout) and integrates into system-level safety partitioning.
InterfaceSPI or I²C (0x20 address) with CRC - enables secure register access, OTP programming, and real-time status reporting including PGOOD and RSTB.
Quiescent Current10 µA typical in OFF mode - enables ultra-low-power sleep states for always-on automotive subsystems.

Pinout & Package

MC33FS8420G0ES is housed in a HVQFN56 package (8 mm × 8 mm × 0.85 mm, 0.5 mm pitch, wettable flank), thermally enhanced with exposed pad connected to GNDFS/GND.

Pin/TerminalCircuit RoleDesign Meaning
VSUP1 / VSUP2Main power inputsAccept 4.9–60 V DC; require external reverse-battery diodes; feed internal bias and regulator inputs.
BUCK1_IN / BUCK2_INBuck input nodesSupply input to respective synchronous buck stages; tied to VSUP internally via internal switches during startup.
BUCK1_SW / BUCK2_SWSwitching nodesConnect to external inductors and low-side MOSFETs; define switching waveform and EMI profile.
VCOREMON / VMON1–VMON4Voltage monitoring inputsMonitor regulated outputs (e.g., VCOREMON tied to BUCK1 FB); trigger fail-safe response on OV/UV violation with configurable delay.
FS0BFail-safe outputActive-low open-drain signal asserting system-level fault; requires external pull-up to VDDIO.
PGOOD / RSTBPower-good and reset outputsActive-low signals indicating stable regulation and initiating MCU reset; both require VDDIO pull-up.
SPI/I²C pins (MISO/MOSI/SCLK/CSB, SCL/SDA)Digital interfacesEnable configuration, telemetry, and safety status readback; support CRC-protected transactions.
WAKE1 / WAKE2Wake-up inputsEdge-triggered inputs enabling exit from OFF mode; require external series resistor if used as global wake sources.

Key Features

FeatureDesign Value
ASIL B functional safety complianceDeveloped per ISO 26262 process with built-in self-test (ABIST/LBIST), challenger watchdog, and dedicated FCCU monitoring interface.
Configurable multi-rail power sequencingIndependent start/stop slots for each regulator (e.g., BUCK1 in Slot 0, BUCK2 in Slot 0, LDO1 in Slot 1) programmed via OTP or runtime SPI.
EMC-optimized switchingSupports frequency synchronization (FIN/FOUT), spread spectrum, and manual slew-rate tuning to reduce radiated emissions in radar/ADAS bands.
Fail-safe state machine integrationFS0B output directly drives external safety-critical logic; deep fail-safe autoretry enabled with infinite retry count per OTP setting.
Low-power OFF mode10 µA quiescent current with wake-up capability via WAKE1/WAKE2; maintains fail-safe monitoring while minimizing battery drain.

Applications

Radar Sensor Power ManagementADAS Domain Controller Supply

Use Scenario: Powers NXP S32R274-based corner radar modules requiring tightly regulated 1.1 V (core), 1.8 V (I/O), and 3.3 V (PHY) rails under wide battery voltage swings.

IC Role / Device Role / Timing Role: System basis chip providing primary power conversion, safety monitoring, and fail-safe signaling to radar MCU and transceiver.

Use Value: Enables ASIL B–compliant operation with integrated TSD, OV/UV detection on all rails, and FS0B assertion within 25 µs of fault detection.

Use Scenario: Supplies multiple voltage domains in centralized ADAS domain controllers integrating vision, radar, and vehicle networking subsystems.

IC Role / Device Role / Timing Role: Centralized power manager coordinating BUCK1 (MCU core), BUCK2 (peripheral I/O), LDO1/LDO2 (ADC/analog), and BOOST (CAN transceiver).

Use Value: Reduces board area and BOM count by consolidating six regulated supplies with synchronized switching and shared safety logic.

Automotive Camera ModuleInfotainment Head Unit

Use Scenario: Delivers clean, sequenced power to S32V-based mono/stereo camera modules with image signal processor, MIPI interface, and ISP sensors.

IC Role / Device Role / Timing Role: Primary SBC managing power-up timing, voltage supervision, and fail-safe shutdown for vision processing chain.

Use Value: Ensures deterministic boot sequence with DVS-controlled soft-start (7.81 mV/µs) and PGOOD assertion only after all rails stabilize.

Use Scenario: Powers infotainment head units with application processors, audio codecs, display drivers, and USB/CAN peripherals across 12 V/24 V platforms.

IC Role / Device Role / Timing Role: Multi-output PMIC supplying core (1.1 V), I/O (1.8 V), analog (3.3 V), and boosted (5.0 V) rails with thermal derating and load-step response optimization.

Use Value: Supports hot-plug resilience and battery dip recovery via 60 V input rating and fast UV recovery (<15 µs detection window).

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive SBC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC33FS8410G0ESIncludes BUCK3 (1.8 V @ 4.5 A) but omits BUCK2; same ASIL B rating, identical package and pinout.Targeted at radar systems needing three regulated rails (e.g., S32R274 + TEF810x) instead of dual-buck + LDO configurations.Select when third buck rail is required and BUCK2 is unnecessary; shares same OTP programming flow and safety diagnostics.
MC33FS8425G0ESAdds FCCU (functional safety control unit) monitoring capability and extends VMON inputs to four; otherwise identical BUCK1/BUCK2/LDO configuration.Required for designs needing MCU error monitoring (FCCU1/FCCU2) and enhanced voltage supervision across additional subsystems.Choose when system-level safety architecture mandates external MCU health monitoring beyond basic PGOOD/RSTB signaling.

Compared with MC33FS8410G0ES and MC33FS8425G0ES, the MC33FS8420G0ES provides optimal balance of dual-buck flexibility and ASIL B safety without added complexity-ideal for domain controllers where BUCK2 supports peripheral I/O while BUCK1 powers the main MCU core.

Availability

MC33FS8420G0ES is available at Aetrix Electronics and suitable for radar sensor modules, ADAS domain controllers, and automotive infotainment systems requiring stable component supply, long-term automotive qualification, and ISO 26262-compliant power management.

Supply support for MC33FS8420G0ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade power management.

The FS84 product line delivers ASIL B–rated system basis chips optimized for radar, vision, and domain controller power architectures-designed to simplify safety-certified design while reducing bill-of-materials and PCB footprint.

FAQ

What is the maximum input voltage supported by the MC33FS8420G0ES?

The MC33FS8420G0ES supports a maximum input voltage of 60 V DC across VSUP1 and VSUP2 pins. This allows operation in both 12 V and 24 V automotive battery systems, provided external reverse-battery protection diodes are installed in series with each supply input as specified in the datasheet.

Does the MC33FS8420G0ES include integrated MOSFETs for all its buck converters?

No. The MC33FS8420G0ES integrates synchronous rectifiers only for BUCK1 and BUCK2. The VPRE controller (pin 43/45/46/48) requires external high-side and low-side MOSFETs, while BOOST (pin 5) integrates only the low-side switch. BUCK3 is not present in this variant per FS8420 device option table.

How is functional safety implemented in the MC33FS8420G0ES?

The MC33FS8420G0ES implements ASIL B functional safety through hardware-enforced mechanisms: a dedicated fail-safe state machine, ABIST/LBIST, simple watchdog, voltage/temperature monitors (VCOREMON, VMON1–VMON4), and FS0B output. It is developed per ISO 26262 and qualified to AEC-Q100 Grade 1, with no software-only safety elements.

Can the MC33FS8420G0ES be configured for different power-up sequences?

Yes. The MC33FS8420G0ES supports fully configurable power-up and power-down sequencing via OTP programming or runtime SPI commands. Each regulator (BUCK1, BUCK2, LDO1, LDO2) is assigned to a specific slot (e.g., BUCK1 in Slot 0, BUCK2 in Slot 0, LDO1 in Slot 1), enabling precise timing control for complex SoC boot requirements.

What communication interfaces does the MC33FS8420G0ES support?

The MC33FS8420G0ES supports both SPI (4-wire, CSB-active-low) and I²C (SCL/SDA, 7-bit address 0x20) interfaces with CRC protection for register access, status reporting, and OTP configuration. Interface selection is determined at power-up via pin strapping or firmware initialization.

MC33FS8420G0ES Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
56-VFQFN Exposed Pad
Packaging:
Tray
Product Status:
Active
Applications:
-
Current - Supply:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
56-HVQFN (8x8)

MC33FS8420G0ES FAQ

1.How can I place an order for MC33FS8420G0ES through Aetrix?

Please submit a Request for Quotation (RFQ) for MC33FS8420G0ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC33FS8420G0ES reliable?

The price and inventory of MC33FS8420G0ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8420G0ES is usually 5 days.

3.What payment methods are accepted for MC33FS8420G0ES?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8420G0ES transactions.

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4.How is shipping managed for MC33FS8420G0ES?

MC33FS8420G0ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC33FS8420G0ES order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC33FS8420G0ES?

For technical support, including MC33FS8420G0ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8420G0ES requirements.

6.How does Aetrix verify that MC33FS8420G0ES is sourced from the original manufacturer or authorized distributors?

All MC33FS8420G0ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8420G0ES meets industry standards.

7.What is the process for return or replacement of MC33FS8420G0ES?

All MC33FS8420G0ES units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8420G0ES, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC33FS8420G0ES part is unused and in its original packaging.

Return procedure for MC33FS8420G0ES:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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