NXP Semiconductors MC33FS8420G0ESR2
- Part No.:
- MC33FS8420G0ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8420G0ESR2.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:

- Shipping:

Inventory:4,368
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Product details
Overview
MC33FS8420G0ESR2 from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, two low-voltage synchronous buck converters (BUCK1 and BUCK2), one boost converter, and two LDOs. It delivers up to 3.6 A peak per buck rail, supports 60 V DC input, and features SPI/I²C control with CRC, fail-safe output, and power-up sequencing for radar and ADAS domain controllers.
For engineers reviewing the MC33FS8420G0ESR2 datasheet, MC33FS8420G0ESR2 pinout, MC33FS8420G0ESR2 application, or MC33FS8420G0ESR2 equivalent, key selection criteria include its dual-buck architecture with multi-phase capability (up to 7.2 A peak on BUCK1+BUCK2), ASIL B safety certification per ISO 26262, AEC-Q100 Grade 1 qualification, and integrated voltage supervision with six monitoring inputs (VMON1–VMON4, VCOREMON, VDDIOMON).
Technical Context
The MC33FS8420G0ESR2 implements a hierarchical power management architecture: VPRE controls external high-side/low-side MOSFETs for primary 12 V/24 V conversion; BUCK1 supplies MCU core (configurable 1.025–1.8 V, 2.6–4.5 A); BUCK2 supplies auxiliary loads (1.2–1.8 V, up to 4.5 A); BOOST provides 5.0–5.74 V at ≤1.5 A peak; LDO1/LDO2 deliver 1.2–5.0 V at ≤400 mA each. All regulators support programmable soft-start and thermal shutdown with DFS (fail-safe state machine activation).
Safety logic includes dedicated watchdog (simple WD), FCCU interface for MCU error monitoring, PGOOD/RSTB/INTB outputs, and fail-safe output FS0B (open-drain, active-low). Power synchronization (PSYNC) enables coordinated operation with a second FS85 device or external PMIC, while FSYNC input/output supports system-level EMC optimization via frequency synchronization and spread spectrum.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 60 V DC max - supports both 12 V and 24 V automotive battery systems with reverse-battery protection diodes required on VSUP1/VSUP2. |
| BUCK1 Output | 1.025–1.8 V, up to 4.5 A peak - dedicated MCU core supply with SVS capability and configurable power-up slot (Slot 0 or Slot 6). |
| BUCK2 Output | 1.2–1.8 V, up to 4.5 A peak - secondary buck rail; supports multiphase operation with BUCK1 to extend current capability to 7.2 A peak on single rail. |
| BOOST Output | 5.0–5.74 V, ≤1.5 A peak - integrated low-side switch; used for PHY or sensor biasing with configurable slope compensation and slew rate. |
| LDO Outputs | Two independent LDOs: LDO1 (1.2–5.0 V, ≤400 mA), LDO2 (1.2–5.0 V, ≤400 mA) - supply MCU I/Os, ADC reference, or physical layer interfaces. |
| Safety Certification | ASIL B compliant per ISO 26262 - includes fail-safe state machine, built-in self-test (ABIST/LBIST), PGOOD/RSTB monitoring, and dedicated fault recovery (FLT_RECOVERY enabled). |
| Interface | SPI or I²C (0x20 address) with CRC - enables full configuration, real-time monitoring, and OTP programming during engineering development. |
Pinout & Package
MC33FS8420G0ESR2 is housed in a HVQFN56 package: plastic thermal-enhanced very thin quad flat package with wettable flank, 56 terminals, 0.5 mm pitch, 8 mm × 8 mm × 0.85 mm body, and exposed pad (EP) connected to GNDFS/GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP1 / VSUP2 | Main power inputs | Accept 60 V DC input; require external reverse-battery protection diodes; feed internal regulators and bias circuits. |
| BUCK1_IN / BUCK2_IN / BUCK3_IN | Buck input rails | Supply input to respective synchronous buck stages; BUCK3 is disabled in FS8420 variant per Table 1. |
| BUCK1_SW / BUCK2_SW | Switching nodes | Connect to external inductors and low-side MOSFETs (BUCK1/BUCK2 integrate high-side switches only). |
| PRE_GHS / PRE_GLS / PRE_SW | VPRE gate drivers | Drive external high-side and low-side MOSFETs for primary buck stage; PRE_SW is switching node for VPRE controller. |
| LDO1 / LDO2 | Linear regulator outputs | Provide low-noise, low-quiescent-current regulated voltages for sensitive analog/digital circuitry (e.g., MCU I/O, ADC). |
| FS0B | Fail-safe output | Active-low open-drain signal indicating safety state machine activation; drives external reset or interlock circuits. |
| PGOOD / RSTB / INTB | Status outputs | PGOOD indicates all rails in regulation; RSTB resets MCU on fault; INTB signals configurable events (e.g., overvoltage, thermal). |
| VMON1–VMON4 / VCOREMON / VDDIOMON | Voltage monitoring inputs | Monitor up to six external rails; enable precise supervision of MCU core, I/O, and peripheral supplies with programmable OV/UV thresholds and delay times. |
Key Features
| Feature | Design Value |
|---|---|
| Dual synchronous buck with multi-phase support | BUCK1 + BUCK2 can operate in phase-shifted mode to deliver up to 7.2 A peak on a single output rail, reducing ripple and thermal stress. |
| Configurable power-up sequencing | Each regulator assigned to a specific power slot (Slot 0–6); enables deterministic startup order for complex SoC-based systems like radar processors. |
| Integrated fail-safe state machine | Monitors internal faults (TSD, OV/UV), external MCU errors (via FCCU1/FCCU2), and system-level conditions to assert FS0B and enter safe state without MCU intervention. |
| EMC-optimized switching | Supports frequency synchronization (FIN/FOUT), spread spectrum modulation, and manual slew-rate tuning to meet stringent automotive radiated emission requirements. |
| Low-power OFF mode | Quiescent current ≤10 µA typical in power-down state - enables always-on wake-up capability while minimizing battery drain in parked vehicle scenarios. |
Applications
| Radar Sensor Power Management | ADAS Domain Controller Supply |
|---|---|
Use Scenario: Powers NXP S32R274/S32R294 radar microcontrollers and TEF810x/TEF82xx RF transceivers in corner or imaging radar modules. IC Role / Device Role / Timing Role: Provides tightly regulated, sequenced, and monitored rails for radar SoC core (BUCK1), I/O (LDO1/LDO2), and RF bias (BOOST), with fail-safe assertion on fault. Use Value: Enables ASIL B-compliant power delivery with <25 µs overvoltage detection latency and automatic fail-safe response, meeting ISO 26262 diagnostic coverage requirements for radar subsystems. | Use Scenario: Supplies centralized ADAS domain controller (e.g., NXP S32G) integrating compute, networking, and safety MCU cores. IC Role / Device Role / Timing Role: Delivers independent, programmable rails: BUCK1 for safety island core, BUCK2 for application core, LDOs for SerDes/PCIe I/O, and BOOST for Ethernet PHY. Use Value: Reduces bill-of-materials by consolidating six regulators and safety monitors into one IC, while supporting functional safety decomposition across ASIL B partitions. |
| Vision System Power Architecture | Automotive Gateway Power Solution |
Use Scenario: Powers mono/stereo camera modules based on NXP S32V processors with PF8x companion PMICs. IC Role / Device Role / Timing Role: Generates VCORE (BUCK1), VDDIO (LDO1), and sensor bias (BOOST); sequences startup to avoid inrush current conflicts with image sensor initialization. Use Value: Achieves <10.41 mV/µs DVS ramp rate on BUCK3 (disabled in FS8420) and <7.81 mV/µs on BUCK1/BUCK2 - ensures clean power-up for pixel arrays and ISP blocks. | Use Scenario: Supplies NXP MPC5748G-based gateway ECUs managing CAN FD, Ethernet, and LIN communication stacks. IC Role / Device Role / Timing Role: Delivers isolated, supervised rails for MCU core (BUCK1), communication PHYs (BOOST), and interface buffers (LDO2), with wake-up via WAKE1/WAKE2 pins. Use Value: Supports ultra-low quiescent current (<10 µA) in sleep mode and fast wake-up (<250 µs Tslot) - critical for always-on network gateways meeting UNECE R156 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8425G0ESR2 | Includes FCCU (Fault Collection and Control Unit) for enhanced MCU error monitoring; adds VMONx count up to 4; same BUCK1/BUCK2/BOOST/LDO topology. | Required for designs needing ASIL B–compliant MCU health monitoring beyond basic watchdog; supports more complex safety partitioning. | Select MC33FS8425G0ESR2 when FCCU-driven error collection and extended voltage monitoring (VMON3/VMON4) are needed for higher diagnostic coverage. |
| MC33FS8520A0ESR2 | ASIL D–rated version with identical regulator count and pinout; adds challenger watchdog, ERRMON input, and deeper fail-safe autoretry (infinite vs. x15). | Targeted at ASIL D–level subsystems (e.g., central domain controllers); requires stricter hardware/software safety analysis per ISO 26262 Part 5/6. | Choose MC33FS8520A0ESR2 for ASIL D–mandated applications where end-to-end fault tolerance and redundant monitoring are required. |
Compared with MC33FS8420G0ESR2, MC33FS8425G0ESR2 adds FCCU-based MCU error correlation without changing power architecture, while MC33FS8520A0ESR2 upgrades safety integrity to ASIL D with enhanced watchdog and fail-safe depth - both retain pin-to-pin compatibility but differ in OTP-configured safety features and monitoring scope.
Availability
MC33FS8420G0ESR2 is available at Aetrix Electronics and suitable for radar sensor modules, ADAS domain controllers, and automotive vision systems requiring stable component supply, long-term automotive lifecycle support, and AEC-Q100 qualified power management ICs.
Supply support for MC33FS8420G0ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive MCUs, radar transceivers, and functional safety power management.
The FS84 product line delivers ASIL B–certified system basis chips optimized for radar, vision, and domain controller power architectures - integrating multiple SMPS, LDOs, safety monitors, and fail-safe logic in a single HVQFN package.
FAQ
What is the safety qualification level of the MC33FS8420G0ESR2?
The MC33FS8420G0ESR2 is ASIL B–capable and developed in compliance with ISO 26262 for automotive functional safety. It is qualified per AEC-Q100 Grade 1 (−40 °C to +125 °C) and includes integrated fail-safe state machine, PGOOD/RSTB outputs, and voltage supervision with programmable OV/UV thresholds - all verified for ASIL B diagnostic coverage requirements.
Does the MC33FS8420G0ESR2 support multi-phase operation between BUCK1 and BUCK2?
Yes, the MC33FS8420G0ESR2 supports multi-phase operation between BUCK1 and BUCK2 to extend peak current capability to 7.2 A on a single rail. Phase shifting is configurable via OTP programming (e.g., delay 0 or delay 2), and both regulators share synchronized switching frequency (2.22 MHz) and soft-start ramp rates (7.81 mV/µs) to minimize input ripple and thermal imbalance.
What are the key differences between MC33FS8420G0ESR2 and MC33FS8425G0ESR2?
The MC33FS8425G0ESR2 adds FCCU (Fault Collection and Control Unit) functionality for advanced MCU error monitoring, supports up to four voltage monitoring inputs (VMON1–VMON4), and includes additional safety diagnostics versus MC33FS8420G0ESR2. Both share identical regulator topology, pinout, and ASIL B rating, but MC33FS8425G0ESR2 enables higher diagnostic coverage for complex safety partitions.
Can the MC33FS8420G0ESR2 be used in 24 V commercial vehicle applications?
Yes, the MC33FS8420G0ESR2 supports up to 60 V DC input and is qualified for automotive environments including 24 V commercial vehicles. External reverse-battery protection diodes are mandatory on VSUP1 and VSUP2 pins, and thermal design must accommodate ambient temperatures up to +125 °C per AEC-Q100 Grade 1 requirements.
How is the fail-safe output (FS0B) triggered on the MC33FS8420G0ESR2?
The FS0B output on MC33FS8420G0ESR2 is asserted active-low by the integrated fail-safe state machine upon detection of internal faults (e.g., thermal shutdown, overvoltage), external supervision violations (VCOREMON/VMONx), or MCU-reported errors via FCCU inputs. It remains latched until cleared by power cycle or SPI command, providing deterministic safe-state signaling to downstream systems.
MC33FS8420G0ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- -
- Current - Supply:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8420G0ESR2 FAQ
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7.What is the process for return or replacement of MC33FS8420G0ESR2?
All MC33FS8420G0ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8420G0ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8420G0ESR2 part is unused and in its original packaging.
Return procedure for MC33FS8420G0ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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