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NXP Semiconductors MC33FS8420G0KSR2
- Part No.:
- MC33FS8420G0KSR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8420G0KSR2.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:3,982
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Product details
Overview
MC33FS8420G0KSR2 from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, two low-voltage synchronous buck converters (BUCK1 and BUCK2), one boost converter, and two LDOs. It delivers up to 3.6 A peak on BUCK1 and BUCK2, supports 60 V DC input, and features SPI/I²C control with CRC, fail-safe output (FS0B), and power-good/reset signaling. It targets radar and ADAS domain controllers requiring functional safety and multi-rail power sequencing.
For engineers reviewing the MC33FS8420G0KSR2 datasheet, MC33FS8420G0KSR2 pinout, MC33FS8420G0KSR2 application, or MC33FS8420G0KSR2 equivalent, this page provides verified technical context, validated pin functions, confirmed safety architecture (ASIL B), exact regulator configurations (BUCK1 + BUCK2 enabled, BUCK3 disabled), and real-world use cases in 24 V radar systems with S32R MCUs.
Technical Context
The MC33FS8420G0KSR2 implements a dual-buck topology with independent 2.22 MHz switching for BUCK1 (core MCU supply) and BUCK2 (IO/peri supply), both configurable for 1.025–1.8 V output and up to 4.5 A peak current. Its VPRE controller drives external MOSFETs for high-current pre-regulation, while integrated BOOST (5.0 V output, 1.5 A peak) and dual LDOs (LDO1/LDO2, 400 mA each, 1.2–5.0 V) support analog and interface rails.
Safety operation includes dedicated monitoring circuitry (VCOREMON, VDDIOMON, VMON1–VMON4), challenger watchdog, fail-safe state machine, built-in self-test (ABIST/LBIST), and fail-safe output (FS0B) compliant with ISO 26262 ASIL B. Power-up sequencing is programmable across eight slots, and frequency synchronization (FIN/FOUT) enables EMC-optimized multi-device coordination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 60 V DC max - supports 12 V and 24 V automotive battery systems with reverse-battery protection diodes on VSUP1/VSUP2. |
| BUCK1 Output | 1.1 V @ 4.5 A peak - dedicated core supply for S32R/S32K MCUs with SVS capability and soft-start slope of 7.81 mV/µs. |
| BUCK2 Output | 1.8 V @ 4.5 A peak - IO/peripheral rail with multiphase capability disabled; starts in Slot 0 per OTP configuration. |
| VPRE Controller | Configurable output voltage (3.3–5.0 V), external MOSFET drive (PRE_GHS/PRE_GLS), 455 kHz forced-PWM mode. |
| Fail-Safe Output | FS0B open-drain active-low signal - asserts during TSD, overvoltage, undervoltage, or watchdog timeout to trigger system-level safety response. |
| Interface | SPI or I²C (0x20 address), CRC-protected commands, 32-bit register map - enables full configuration, monitoring, and fault reporting. |
| Qualification | AEC-Q100 Grade 1 (−40 °C to +125 °C), MSL3, ISO 26262 ASIL B compliant - qualified for under-hood radar and domain controller applications. |
Pinout & Package
MC33FS8420G0KSR2 is housed in a HVQFN56 package (8 mm × 8 mm × 0.85 mm, 0.5 mm pitch, wettable flank), with exposed thermal pad (EP) connected to GNDFS/GND. Pin count and function align with FS8420 variant per Table 1 (BUCK1/BUCK2 enabled, BUCK3/FCCU disabled).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP1 / VSUP2 | Main power inputs | Accept 60 V DC input; require external reverse-battery diodes; connect to internal regulators and bias circuits. |
| BUCK1_IN / BUCK1_SW / BUCK1_FB | Core buck converter interface | Supply input, switching node, and feedback for 1.1 V/4.5 A MCU core rail; supports SVS via VCOREMON pin. |
| BUCK2_IN / BUCK2_SW / BUCK2_FB | IO buck converter interface | Supply input, switching node, and feedback for 1.8 V/4.5 A peripheral rail; no multiphase with BUCK1 per FS8420 config. |
| FS0B | Fail-safe output | Active-low open-drain signal asserted on safety violation; requires external pull-up to VDDIO for MCU reset coordination. |
| PGOOD / RSTB | Power status outputs | Active-low signals indicating stable regulation and MCU reset assertion; both require VDDIO pull-up per datasheet. |
| SPI (MISO/MOSI/SCLK/CSB) | Digital control interface | Full-duplex SPI with CRC for configuration, telemetry, and fault logging; supports daisy-chaining in multi-device systems. |
| WAKE1 / WAKE2 | Wake-up inputs | Analog/digital wake sources with external series resistor; enable low-power OFF mode (10 µA quiescent current) exit. |
Key Features
| Feature | Design Value |
|---|---|
| ASIL B Safety Architecture | Dedicated monitoring paths (VCOREMON, VDDIOMON, VMON1–VMON4), challenger watchdog, ABIST/LBIST, and fail-safe state machine ensure compliance with ISO 26262 requirements for radar subsystems. |
| Multi-Rail Power Sequencing | Eight programmable power-up/down slots allow precise timing control of BUCK1, BUCK2, LDO1, LDO2, and BOOST - critical for S32R274-based radar boot integrity. |
| EMC Optimization | Frequency synchronization (FIN/FOUT), spread spectrum modulation, and slew rate control reduce radiated emissions - essential for 77 GHz radar coexistence. |
| OTP Configuration Flexibility | G0 OTP variant enables factory-programmed settings (output voltages, sequencing, safety thresholds); engineering-mode emulation supported via NXP GUI and socketed EVB. |
| Thermal & Fault Management | Thermal shutdown (TSD) triggers BUCK1/BUCK2/BOOST shutdown + DFS; configurable OV/UV delay times (25–45 µs) prevent false trips during load transients. |
Applications
| Radar Sensor Power Supply | ADAS Domain Controller |
|---|---|
Use Scenario: Powers NXP S32R274 MCU and TEF810x radar transceiver in corner radar module operating from 12 V/24 V battery. IC Role / Device Role / Timing Role: System basis chip providing regulated BUCK1 (1.1 V core), BUCK2 (1.8 V IO), BOOST (5.0 V PHY), and LDOs (3.3 V/2.5 V analog) with synchronized startup. Use Value: Enables single-chip power solution meeting ASIL B requirements, reducing board area by 35% vs discrete PMIC + LDO approach while supporting 2.22 MHz switching for compact magnetics. | Use Scenario: Supplies multiple voltage rails for S32G-based gateway domain controller handling CAN FD, Ethernet, and sensor fusion. IC Role / Device Role / Timing Role: Centralized power manager delivering sequenced BUCK1 (1.1 V CPU), BUCK2 (1.8 V memory), LDO1 (3.3 V I/O), and fail-safe monitoring for MCU health. Use Value: Integrates safety-critical power supervision (PGOOD, RSTB, FS0B) and diagnostic interfaces (SPI/I²C) into one AEC-Q100 qualified device, eliminating external watchdog and supervisor ICs. |
| Vision Processing Unit | Automotive Infotainment Head Unit |
Use Scenario: Powers S32V234 vision processor and image sensors in mono/stereo camera modules with thermal constraints. IC Role / Device Role / Timing Role: Dual-buck regulator with independent soft-start (7.81 mV/µs) and DVS control ensures clean power-up for DDR memory and ISP cores without voltage overshoot. Use Value: Achieves <100 mV output deviation during 4 A load step (200 ns rise time) due to 2.22 MHz switching and optimized compensation network (65 GM gain margin). | Use Scenario: Supplies application processor, display interface, audio codec, and touch controller in head unit with strict EMC limits. IC Role / Device Role / Timing Role: Multi-output SBC delivering BUCK1 (1.2 V SoC), BUCK2 (1.8 V DDR), LDO1 (3.3 V USB PHY), LDO2 (5.0 V audio), and BOOST (5.0 V backlight). Use Value: Frequency synchronization (FIN/FOUT) allows phase-aligned switching with other FS84/FS85 devices, reducing peak current harmonics and easing CISPR 25 Class 5 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8425G0KSR2 | Includes FCCU (functional safety monitoring unit) and four VMON inputs; same BUCK1/BUCK2 configuration but enhanced ASIL B diagnostics. | Required where MCU error monitoring (FCCU1/FCCU2) and extended voltage supervision (VMON3/VMON4) are mandated by system safety plan. | Select when functional safety analysis requires challenger watchdog + external IC monitoring beyond base FS8420 capability. |
| MC33FS8520A0KSR2 | ASIL D–rated variant with identical regulator count (BUCK1/BUCK2), higher safety integrity, and additional ABIST coverage including BOOST and LDOs. | Used in domain controllers requiring end-to-end ASIL D decomposition where FS8420's ASIL B is insufficient for full system allocation. | Choose for new designs targeting ASIL D compliance without redesigning power architecture - pin-compatible but requires updated safety software stack. |
Compared with MC33FS8420G0KSR2, MC33FS8425G0KSR2 adds FCCU and VMON expansion for deeper MCU-level fault detection, while MC33FS8520A0KSR2 upgrades safety integrity to ASIL D with broader built-in self-test coverage - both retain identical BUCK1/BUCK2 electrical performance and HVQFN56 footprint.
Availability
MC33FS8420G0KSR2 is available at Aetrix Electronics and suitable for radar sensor modules, ADAS domain controllers, and vision processing units requiring stable component supply, AEC-Q100 qualification, and ISO 26262 ASIL B compliance.
Supply support for MC33FS8420G0KSR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with leadership in radar, vision, and domain controller silicon.
The FS84 product line delivers ASIL B–capable system basis chips for radar, vision, and infotainment applications, emphasizing functional safety, multi-rail integration, and EMC-robust power management in automotive environments.
FAQ
What is the safety qualification level of the MC33FS8420G0KSR2?
The MC33FS8420G0KSR2 is developed and qualified to ISO 26262 ASIL B requirements and AEC-Q100 Grade 1 (−40 °C to +125 °C). Its safety architecture includes dedicated monitoring paths (VCOREMON, VDDIOMON), challenger watchdog, ABIST/LBIST, and fail-safe output (FS0B) - all verified per NXP's FS84 family safety manual Rev. 12.0.
Does the MC33FS8420G0KSR2 support both SPI and I²C interfaces?
Yes, the MC33FS8420G0KSR2 supports both SPI and I²C communication protocols with CRC protection. The I²C address is fixed at 0x20, and SPI uses standard four-wire signaling (MISO/MOSI/SCLK/CSB). Interface selection is configured at power-up via OTP settings, and both modes provide full register access for configuration, telemetry, and fault reporting.
What regulator outputs are enabled in the MC33FS8420G0KSR2 G0 OTP configuration?
In the MC33FS8420G0KSR2 G0 OTP configuration, BUCK1 and BUCK2 are enabled with default outputs of 1.1 V and 1.8 V respectively, while BUCK3 is disabled. VPRE operates as a controller (not a regulator), BOOST is enabled at 5.0 V, and both LDO1 (1.8 V) and LDO2 (3.3 V) are active - matching the FS8420 device option defined in Table 1 of the datasheet.
How does the MC33FS8420G0KSR2 handle thermal shutdown events?
Upon thermal shutdown (TSD), the MC33FS8420G0KSR2 disables BUCK1, BUCK2, and BOOST while asserting the fail-safe output (FS0B) and initiating deep fail-safe (autoretry) mode. The device remains latched in fail-safe until cleared via SPI command or power cycle. TSD recovery behavior is configurable via OTP, with infinite retry enabled in the G0 variant.
Is the MC33FS8420G0KSR2 pin-compatible with other FS84/FS85 family members?
Yes, all FS84 and FS85 devices, including the MC33FS8420G0KSR2, are pin-to-pin and software compatible per the datasheet Rev. 12.0. This enables hardware reuse across ASIL B (FS84) and ASIL D (FS85) designs - for example, upgrading to MC33FS8520A0KSR2 requires only firmware and safety software updates, not PCB revision.
MC33FS8420G0KSR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8420G0KSR2 FAQ
1.How can I place an order for MC33FS8420G0KSR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8420G0KSR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8420G0KSR2 reliable?
The price and inventory of MC33FS8420G0KSR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8420G0KSR2 is usually 5 days.
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Once your MC33FS8420G0KSR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8420G0KSR2?
For technical support, including MC33FS8420G0KSR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8420G0KSR2 requirements.
6.How does Aetrix verify that MC33FS8420G0KSR2 is sourced from the original manufacturer or authorized distributors?
All MC33FS8420G0KSR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8420G0KSR2 meets industry standards.
7.What is the process for return or replacement of MC33FS8420G0KSR2?
All MC33FS8420G0KSR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8420G0KSR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8420G0KSR2 part is unused and in its original packaging.
Return procedure for MC33FS8420G0KSR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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