NXP Semiconductors MC33FS8425G0ES
- Part No.:
- MC33FS8425G0ES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8425G0ES.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:

- Shipping:

Inventory:1,017
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC33FS8425G0ES from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, two low-voltage synchronous buck converters (BUCK1 and BUCK2), one boost converter, and two linear regulators (LDO1, LDO2). It delivers up to 3.6 A peak per buck rail, supports 60 V DC input, and features SPI/I²C control with CRC, fail-safe output (FS0B), and power-good/reset signaling - designed for radar and ADAS domain controller power management.
For engineers reviewing the MC33FS8425G0ES datasheet, MC33FS8425G0ES pinout, MC33FS8425G0ES application, or MC33FS8425G0ES equivalent, this device serves as a multi-rail, functionally safe PMIC with configurable sequencing, thermal shutdown protection, voltage supervision across six monitoring inputs (VMON1–VMON4, VCOREMON, VDDIOMON), and EMC-optimized frequency synchronization (FIN/FOUT/PSYNC).
Technical Context
The MC33FS8425G0ES implements a hierarchical safety architecture compliant with ISO 26262 ASIL B, including dedicated watchdog (simple WD), fault detection and recovery logic (FLT_RECOVERY), ABIST/LBIST, and fail-safe state machine driving FS0B. Its power management integrates three independent switching regulators (VPRE, BUCK1, BUCK2) plus BOOST and dual LDOs, all coordinated via OTP-programmed power-up sequencing across eight time slots.
Control is executed through 32-bit SPI or I²C with CRC error checking; configuration includes programmable over/under-voltage thresholds (e.g., VCOREMON UVTH = 88 %, OVTH = 112 %), slew rate control, spread spectrum modulation, and phase-shifting capability between BUCK1 and BUCK2 to reduce input ripple. The device supports external MOSFETs for VPRE and internal FETs for all other SMPS rails.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 60 V DC max - supports 12 V and 24 V automotive battery systems with reverse-battery diode protection on VSUP1/VSUP2. |
| VPRE Controller | External MOSFET synchronous buck - configurable output voltage, 455 kHz forced-PWM switching, up to 10 A peak current capability. |
| BUCK1 Output | 1.1 V @ 4.5 A peak - dedicated MCU core supply with SVS capability and soft-start slope of 7.81 mV/µs. |
| BUCK2 Output | 1.8 V @ 4.5 A peak - low-voltage rail with multiphase capability enabled (phase shift delay 0), sequenced in Slot 6. |
| LDO1 / LDO2 | Configurable outputs up to 400 mA each - LDO1 = 1.8 V, LDO2 = 3.3 V; used for MCU I/O and ADC supply with independent UV/OV monitoring. |
| Safety Certification | ISO 26262 ASIL B compliant; AEC-Q100 Grade 1 qualified (−40 °C to +125 °C junction); includes fail-safe output (FS0B), PGOOD, RSTB, and integrated self-test (ABIST/LBIST). |
| Interface | SPI or I²C (address 0x20) with CRC - enables full register access, OTP programming during engineering mode, and real-time fault reporting via INTB and ERRMON. |
Pinout & Package
MC33FS8425G0ES is housed in a HVQFN56 package (8 mm × 8 mm × 0.85 mm, 0.5 mm pitch, wettable flank), with exposed thermal pad (EP) connected to GNDFS/GND. Pin count and functionality match the FS8425 variant per Table 1 - enabling BUCK1, BUCK2, BOOST, LDO1/LDO2, VPRE control, six analog monitoring inputs (VMON1–VMON4, VCOREMON, VDDIOMON), and dual communication interfaces (SPI/I²C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BUCK1_FB | Voltage feedback input | Closes regulation loop for BUCK1 output (1.1 V); connects to resistor divider on BUCK1 output rail. |
| BUCK2_SW | Switching node output | Drives external inductor for BUCK2; requires low-ESR ceramic output capacitor and proper layout for EMI control. |
| FS0B | Fail-safe open-drain output | Asserted low during fault (TSD, UV/OV, watchdog timeout); drives external safety-critical circuitry or MCU interrupt. |
| PGOOD | Power-good status signal | Active-low indicator confirming all regulated outputs are within tolerance; requires external pull-up to VDDIO. |
| RSTB | Reset output | Active-low reset pulse to MCU upon startup or fault; monitors external reset assertion and internal fault conditions. |
| FIN / FOUT / PSYNC | Frequency sync I/O | Enables synchronized switching across multiple FS84/FS85 devices or external PMICs to minimize system-level conducted emissions. |
| VCOREMON | Core voltage monitor input | Direct connection to BUCK1 output required for SVS and fault detection; threshold set to 88 % / 112 % of nominal. |
| WAKE1 / WAKE2 | Wake-up inputs | Analog/digital wake sources - require external series resistor if used as global wake pins; support low-power OFF mode (10 µA typ). |
Key Features
| Feature | Design Value |
|---|---|
| ASIL B functional safety architecture | Includes dedicated fail-safe state machine, challenger/simple watchdog, ABIST/LBIST, FCCU interface, and FLT_RECOVERY for autonomous fault handling. |
| Multi-rail power sequencing | Eight-slot programmable startup/shutdown timing - BUCK1 starts in Slot 0, BUCK2 in Slot 6, LDO1 in Slot 1, LDO2 in Slot 2 - ensures deterministic power-up order. |
| EMC optimization suite | Combines spread spectrum, slew rate control, manual frequency tuning, and FIN/FOUT/PSYNC synchronization to meet automotive CISPR 25 Class 5 limits. |
| OTP-based configuration | Factory-programmed settings for output voltages, current limits, sequencing, UV/OV thresholds, and safety features - supports engineering-mode emulation via GUI and socketed EVB. |
| Thermal and electrical supervision | Six independent analog monitors (VMON1–VMON4, VCOREMON, VDDIOMON) with configurable OV/UV thresholds and deglitch times (e.g., VCOREMON UV_DGLT = 25 µs). |
Applications
| Radar Sensor Power Management | ADAS Domain Controller Supply |
|---|---|
|
Use Scenario: Powers NXP S32R274/S32R294 radar SoCs in corner or imaging radar modules requiring tightly regulated, sequenced, and monitored supplies. IC Role / Device Role / Timing Role: Primary system basis chip delivering VPRE (for RF front-end), BUCK1 (core), BUCK2 (I/O), LDO1/LDO2 (ADC/PHY), and fail-safe signaling to radar MCU. Use Value: Enables single-chip power solution with ASIL B compliance, eliminating discrete supervisors and reducing BOM count by ≥4 components versus legacy designs. |
Use Scenario: Supplies multi-core domain controllers (e.g., S32Z/S32E) in centralized ADAS ECUs managing camera, radar, and vehicle dynamics. IC Role / Device Role / Timing Role: Integrates all critical power rails (core, memory, I/O, PHY) with synchronized startup, dynamic voltage scaling, and real-time fault reporting via SPI. Use Value: Reduces design complexity through OTP-configured sequencing and eliminates need for external voltage supervisors or discrete reset ICs. |
| Automotive Camera Module | Infotainment Head Unit |
|
Use Scenario: Powers S32V-based mono/stereo camera modules with image sensor, ISP, and MIPI interface requiring low-noise, low-ripple supplies. IC Role / Device Role / Timing Role: Delivers clean BUCK1 (1.1 V core), BUCK2 (1.8 V I/O), LDO1 (1.8 V sensor bias), and LDO2 (3.3 V MIPI PHY) with independent UV/OV monitoring. Use Value: Achieves <15 mVpp output ripple at 2.22 MHz switching, meeting CISPR 25 radiated emission requirements without additional filtering. |
Use Scenario: Supplies infotainment head units with application processors, audio codecs, display drivers, and CAN transceivers. IC Role / Device Role / Timing Role: Provides isolated, sequenced rails (e.g., 1.1 V core, 1.8 V memory, 3.3 V I/O, 5.0 V display backlight) with fail-safe output tied to system watchdog. Use Value: Supports deep-sleep OFF mode (10 µA quiescent current) and wake-on-CAN/WAKE1/WAKE2, extending battery runtime in key-off scenarios. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8420G0ES | Same package and pinout; lacks FCCU (Fault Collection and Control Unit) and supports only up to 2 VMON inputs vs. 4 on MC33FS8425G0ES. | Targeted at simpler radar or camera modules without MCU-level error monitoring or extended voltage supervision. | Select when ASIL B compliance is required but full FCCU and quad VMON monitoring are unnecessary - reduces cost and software overhead. |
| MC33FS8520A0ES | ASIL D–rated version; identical regulator topology and pinout; adds enhanced safety features including dual-channel FCCU, ERRMON, and deeper ABIST coverage. | Required for ASIL D–compliant domain controllers or safety-critical gateway applications where fault containment must meet highest integrity level. | Choose when system-level ASIL decomposition mandates ASIL D hardware partitioning - no PCB change needed, but safety software integration increases. |
Compared with MC33FS8420G0ES, MC33FS8425G0ES adds FCCU and two extra VMON inputs for robust MCU error monitoring and extended voltage supervision; compared with MC33FS8520A0ES, it provides ASIL B assurance at lower verification burden while retaining identical power architecture and footprint.
Availability
MC33FS8425G0ES is available at Aetrix Electronics and suitable for radar sensor modules, ADAS domain controllers, and automotive camera systems requiring stable component supply, long-term automotive qualification, and ASIL B–compliant power management.
Supply support for MC33FS8425G0ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade power management.
The FS84 product line delivers ASIL B–capable system basis chips optimized for radar, vision, and domain controller power architectures - emphasizing integrated safety, EMC robustness, and configurability via OTP and serial interface.
FAQ
What is the primary safety certification level of the MC33FS8425G0ES?
The MC33FS8425G0ES is certified to ISO 26262 ASIL B and qualified per AEC-Q100 Grade 1 (−40 °C to +125 °C). It includes fail-safe output (FS0B), power-good (PGOOD), reset (RSTB), watchdog, ABIST/LBIST, and FCCU monitoring - all implemented in hardware to meet ASIL B fault-tolerance requirements without requiring external safety elements.
Does the MC33FS8425G0ES support both SPI and I²C interfaces simultaneously?
No - the MC33FS8425G0ES supports either SPI or I²C, not both concurrently. Interface selection is determined by strap pins or OTP configuration; default I²C address is 0x20. Both interfaces provide full register access, CRC-protected command execution, and real-time status reporting via INTB, with identical functional coverage for configuration, monitoring, and fault handling.
How many voltage rails does the MC33FS8425G0ES generate, and what are their key specifications?
The MC33FS8425G0ES generates five regulated rails: VPRE (external buck controller), BUCK1 (1.1 V / 4.5 A), BUCK2 (1.8 V / 4.5 A), BOOST (5.0 V / 1.5 A peak), LDO1 (1.8 V / 400 mA), and LDO2 (3.3 V / 400 mA). All SMPS rails operate at 2.22 MHz (BUCK1/BUCK2/BOOST) or 455 kHz (VPRE), with programmable soft-start, current limiting, and thermal shutdown behavior.
What is the role of the PSYNC pin on the MC33FS8425G0ES?
The PSYNC pin on the MC33FS8425G0ES serves as a bidirectional power synchronization interface - it can accept an external clock (input mode) or output a synchronized clock (output mode) to coordinate switching frequencies across multiple FS84/FS85 devices or external PMICs. This minimizes beat frequencies and reduces system-level conducted EMI, especially critical in multi-SBC radar or domain controller designs.
Can the MC33FS8425G0ES be used in OFF mode, and what is its quiescent current?
Yes - the MC33FS8425G0ES supports OFF mode with typical quiescent current of 10 µA. In this state, all SMPS and LDOs are disabled, but wake-up inputs (WAKE1/WAKE2), fail-safe state machine, and basic monitoring remain active. Wake events trigger controlled power-up sequencing, making it suitable for always-on automotive subsystems requiring ultra-low standby consumption.
MC33FS8425G0ES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8425G0ES FAQ
1.How can I place an order for MC33FS8425G0ES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8425G0ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8425G0ES reliable?
The price and inventory of MC33FS8425G0ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8425G0ES is usually 5 days.
3.What payment methods are accepted for MC33FS8425G0ES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8425G0ES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33FS8425G0ES?
MC33FS8425G0ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8425G0ES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8425G0ES?
For technical support, including MC33FS8425G0ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8425G0ES requirements.
6.How does Aetrix verify that MC33FS8425G0ES is sourced from the original manufacturer or authorized distributors?
All MC33FS8425G0ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8425G0ES meets industry standards.
7.What is the process for return or replacement of MC33FS8425G0ES?
All MC33FS8425G0ES units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8425G0ES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8425G0ES part is unused and in its original packaging.
Return procedure for MC33FS8425G0ES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC33FS8425G0ES Tags

-
TPS2511DGNR
Texas Instruments

-
UTC2000/MG
Microchip Technology

-
TUSB320HAIRWBR
Texas Instruments

-
TPS61252DSGR
Texas Instruments

-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments

-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments

-
STUSB1600AQTR
STMicroelectronics

-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments

-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

