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NXP Semiconductors MC33FS8425G0ESR2
- Part No.:
- MC33FS8425G0ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8425G0ESR2.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:1,314
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Product details
Overview
MC33FS8425G0ESR2 from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, two low-voltage synchronous buck converters (BUCK1 and BUCK2), one boost converter, and two LDOs. It delivers up to 10 A peak on VPRE, 3.6 A peak on BUCK1 and BUCK2, and supports 60 V DC input for 12 V/24 V radar and ADAS domain controller applications.
For engineers reviewing the MC33FS8425G0ESR2 datasheet, MC33FS8425G0ESR2 pinout, MC33FS8425G0ESR2 application, or MC33FS8425G0ESR2 equivalent, this device offers SPI/I²C-configurable multi-rail power sequencing, fail-safe output with deep fail-safe autoretry, frequency synchronization I/O for EMC optimization, and integrated voltage supervision for VCORE, VDDIO, and four external rails - critical for functional safety validation in radar ECU designs.
Technical Context
The MC33FS8425G0ESR2 implements a hierarchical safety architecture with independent monitoring circuitry, challenger watchdog, FCCU inputs for MCU error detection, and built-in self-test (ABIST/LBIST). Its power management state machine enforces strict power-up sequencing across six configurable slots, with TSD-triggered shutdown + DFS (deep fail-safe) response on all regulators except those disabled by OTP configuration.
It features dual communication interfaces (SPI and I²C, address 0x20), programmable slew rate control on gate drivers, spread-spectrum modulation, and phase-shifting capability between BUCK1 and BUCK2 to reduce input ripple. The device uses OTP-programmed settings for regulator voltages, current limits, soft-start slopes, and safety thresholds - with factory programming required for production units.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 60 V DC max; supports reverse-battery-protected 12 V and 24 V automotive battery rails via VSUP1/VSUP2 inputs. |
| VPRE Output Capability | Configurable synchronous buck controller driving external MOSFETs; up to 10 A peak current, 455 kHz forced PWM switching. |
| BUCK1 Output | 1.1 V @ 4.5 A peak; dedicated MCU core supply with SVS (supply voltage supervisor) and DVS soft-start (7.81 mV/µs). |
| BUCK2 Output | 1.8 V @ 4.5 A peak; enabled in FS8425 variant; multiphase-capable with BUCK1 to extend rail current to 7.2 A peak. |
| LDO Outputs | Two 400 mA LDOs (LDO1/LDO2); configurable voltages (e.g., 1.8 V, 3.3 V) for MCU I/O and ADC supply with independent UV/OV monitoring. |
| Safety Certification | ASIL B compliant per ISO 26262; AEC-Q100 Grade 1 qualified; includes fail-safe output (FS0B), PGOOD, RSTB, and integrated self-test. |
| Interface & Control | SPI/I²C (0x20), 32-bit command structure with CRC; PSYNC pin enables synchronized operation with second FS85 or external PMIC. |
Pinout & Package
MC33FS8425G0ESR2 is housed in a HVQFN56 package (8 mm × 8 mm × 0.85 mm body, 0.5 mm pitch, wettable flank), with exposed thermal pad (EP) connected to GNDFS/GND. Pin count and function align with the FS8425 device option defined in Table 1 of the datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP1 / VSUP2 | Main power inputs | Accept reverse-battery-protected 12 V/24 V supply; require external series diodes per datasheet requirement. |
| BUCK1_IN / BUCK2_IN | Buck input rails | Low-voltage inputs (typically 5 V) feeding integrated synchronous buck converters for MCU core and I/O domains. |
| BUCK1_SW / BUCK2_SW | Switching nodes | Connect to external inductors and output capacitors; require careful layout to minimize EMI and ringing. |
| VCOREMON / VDDIOMON | Supervision inputs | Monitor BUCK1 and LDO2 outputs respectively; trigger fault responses if UV/OV thresholds exceeded (e.g., 88%/112% window). |
| FS0B | Fail-safe output | Active-low open-drain signal indicating system-level failure; drives external safety-critical logic or MCU interrupt. |
| PSYNC | Power sync I/O | Configurable as input or output to synchronize switching frequencies across multiple FS85/FS84 devices for EMC reduction. |
| SPI/I²C pins (MOSI, MISO, SCLK, CSB, SCL, SDA) | Digital interface | Enable full configuration, real-time monitoring, and fault reporting; support CRC-protected command frames. |
Key Features
| Feature | Design Value |
|---|---|
| Multi-phase BUCK1+BUCK2 operation | Extends single-rail current capability to 7.2 A peak while reducing input capacitor RMS current and improving thermal distribution. |
| Programmable soft-start slope | Configurable DVS ramp rates (e.g., 7.81 mV/µs for BUCK1) prevent inrush current and ensure controlled power-up timing. |
| Deep fail-safe autoretry | Configured for infinite retry cycles on critical faults (e.g., overtemperature), enabling automatic recovery without MCU intervention. |
| FCCU monitoring inputs | Dual digital inputs (FCCU1/FCCU2) allow MCU to signal internal errors directly to the SBC's safety state machine for coordinated fail-safe response. |
| EMC optimization suite | Includes frequency synchronization (FIN/FOUT), spread spectrum, slew rate control, and manual tuning - reducing peak radiated emissions by >10 dBµV/m in 150 kHz–108 MHz band. |
Applications
| Radar ECU Power Management | ADAS Domain Controller |
|---|---|
Use Scenario: Powers NXP S32R294 radar processor and TEF810x RF transceiver in 12 V/24 V corner radar modules. IC Role / Device Role / Timing Role: System basis chip providing sequenced, monitored, and fail-safe power to radar SoC, PHY, and analog front-end. Use Value: Enables ASIL B compliance with integrated VCORE/VDDIO supervision, fail-safe output (FS0B), and TSD-triggered DFS recovery - eliminating need for discrete safety monitors. | Use Scenario: Supplies core, I/O, and peripheral rails in centralized ADAS domain controllers integrating camera, radar, and ultrasonic sensor fusion. IC Role / Device Role / Timing Role: Centralized multi-output PMIC managing power sequencing, voltage scaling, and fault containment across heterogeneous compute domains. Use Value: Reduces BOM count by consolidating six regulated rails (VPRE, BUCK1, BUCK2, BOOST, LDO1, LDO2) with shared safety logic and single-point diagnostics. |
| Vision Processing Unit Supply | Automotive Infotainment Head Unit |
Use Scenario: Delivers tightly regulated 1.03125 V core and 1.8 V I/O supplies to NXP S32V vision processors in mono/stereo camera modules. IC Role / Device Role / Timing Role: Safety-aware power manager ensuring deterministic startup, brown-out immunity, and graceful shutdown during battery transients. Use Value: Achieves <10 µA quiescent current in OFF mode and supports wake-on-WAKE1/WAKE2 for low-power parking-mode operation. | Use Scenario: Powers application processor, display interface, audio codec, and CAN transceiver in infotainment head units requiring high reliability and thermal robustness. IC Role / Device Role / Timing Role: Automotive-grade SBC delivering stable, supervised power with fail-safe signaling to MCU and external safety gate drivers. Use Value: Integrates PGOOD, RSTB, and AMUX-based analog monitoring (e.g., battery voltage, temperature) into single package - simplifying board-level safety architecture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8420G0ESR2 | Disables FCCU monitoring and VMON3/VMON4 inputs; no BOOST converter; BUCK3 omitted. | Targeted at simpler ADAS ECUs without external IC monitoring or auxiliary boost requirements. | Select when safety monitoring depth and boost capability are unnecessary - reduces cost and complexity. |
| MC33FS8520A0ESR2 | ASIL D rated; adds ERRMON input, enhanced ABIST coverage, and additional VMON channels; same pinout and software compatibility. | Required for ASIL D domain controllers where end-to-end fault coverage must meet highest automotive safety integrity level. | Choose when system-level ASIL D decomposition mandates full diagnostic coverage beyond ASIL B scope. |
Compared with MC33FS8420G0ESR2, the MC33FS8425G0ESR2 adds FCCU monitoring and BOOST functionality for enhanced system-level safety and flexibility; versus MC33FS8520A0ESR2, it provides ASIL B compliance at lower diagnostic overhead and cost - ideal for radar ECUs where ASIL D is not mandated.
Availability
MC33FS8425G0ESR2 is available at Aetrix Electronics and suitable for radar ECU, ADAS domain controller, and vision processing unit designs requiring stable component supply, long-term automotive lifecycle support, and AEC-Q100 qualified performance.
Supply support for MC33FS8425G0ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive microcontrollers and power management.
The FS84 product line delivers ASIL B–capable system basis chips optimized for radar, vision, and ADAS domain controllers - integrating safety-critical power regulation, supervision, and communication in a single package to accelerate functional safety certification.
FAQ
What is the primary safety qualification of the MC33FS8425G0ESR2?
The MC33FS8425G0ESR2 is developed in compliance with ISO 26262 and qualified to ASIL B safety integrity level. It includes fail-safe output (FS0B), power-good (PGOOD), reset (RSTB), dual watchdog modes, built-in self-test (ABIST/LBIST), and voltage supervision for VCORE, VDDIO, and four external rails - all validated per ASIL B requirements in the FS84 family.
Does the MC33FS8425G0ESR2 support multi-phase operation between its buck converters?
Yes, the MC33FS8425G0ESR2 supports multi-phase operation between BUCK1 and BUCK2 to extend peak current capability to 7.2 A on a single rail. This is enabled via OTP configuration and requires matching inductor values and phase-shifted switching (e.g., 0° and 180° delay) to reduce input capacitor stress and improve thermal balance.
What communication interfaces does the MC33FS8425G0ESR2 support, and what are their addresses?
The MC33FS8425G0ESR2 supports both SPI and I²C interfaces. Its I²C address is fixed at 0x20, and SPI uses standard 4-wire protocol (MOSI, MISO, SCLK, CSB) with CRC-protected 32-bit command framing. Both interfaces provide full register access for configuration, monitoring, and fault reporting.
How is the fail-safe behavior configured on the MC33FS8425G0ESR2?
The MC33FS8425G0ESR2 fail-safe behavior is configured via OTP programming and includes deep fail-safe (DFS) autoretry mode set to infinite cycles, active-low FS0B output, and configurable fault response per regulator (e.g., BUCK1 shutdown + DFS on overtemperature). Safety parameters like OV/UV thresholds and deglitch times are also OTP-defined.
What package type and thermal characteristics does the MC33FS8425G0ESR2 use?
The MC33FS8425G0ESR2 uses the HVQFN56 package (8 mm × 8 mm × 0.85 mm, 0.5 mm pitch) with exposed thermal pad (EP) connected to GNDFS/GND. It is rated for AEC-Q100 Grade 1 (−40 °C to +125 °C ambient), and thermal design requires soldering the EP to a minimum 200 mm² copper pour for effective heat dissipation under full load.
MC33FS8425G0ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8425G0ESR2 FAQ
1.How can I place an order for MC33FS8425G0ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8425G0ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8425G0ESR2 reliable?
The price and inventory of MC33FS8425G0ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8425G0ESR2 is usually 5 days.
3.What payment methods are accepted for MC33FS8425G0ESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8425G0ESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33FS8425G0ESR2?
MC33FS8425G0ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8425G0ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8425G0ESR2?
For technical support, including MC33FS8425G0ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8425G0ESR2 requirements.
6.How does Aetrix verify that MC33FS8425G0ESR2 is sourced from the original manufacturer or authorized distributors?
All MC33FS8425G0ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8425G0ESR2 meets industry standards.
7.What is the process for return or replacement of MC33FS8425G0ESR2?
All MC33FS8425G0ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8425G0ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8425G0ESR2 part is unused and in its original packaging.
Return procedure for MC33FS8425G0ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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