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NXP Semiconductors MC33FS8425G0KS

Part No.:
MC33FS8425G0KS
Manufacturer:
NXP Semiconductors
Category:
Power Management - Specialized
Package:
56-VFQFN Exposed Pad
Datasheet:
AetrixMC33FS8425G0KS.pdf
Description:
SAFETY POWER MANAGEMENT IC, QFN5
Quantity:
Payment:
Payment
Shipping:
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Inventory:2,215

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Product details

Overview

MC33FS8425G0KS from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, two low-voltage synchronous buck converters (BUCK1 and BUCK2), a BOOST converter, and two LDOs. It delivers up to 3.6 A peak per buck rail, supports external frequency synchronization for EMC optimization, and operates across 12 V/24 V battery systems in radar and ADAS domain controllers.

For engineers reviewing the MC33FS8425G0KS datasheet, MC33FS8425G0KS pinout, MC33FS8425G0KS application, or MC33FS8425G0KS equivalent, key selection criteria include its dual-buck + VPRE architecture, fail-safe output (FS0B), SPI/I²C configurability, 60 V max input voltage, and qualification per AEC-Q100 Grade 1.

Technical Context

The MC33FS8425G0KS implements a multi-rail power management architecture with independent control loops for VPRE (external MOSFET controller), BUCK1 (MCU core supply with SVS), and BUCK2 (multi-phase capable up to 7.2 A peak when paired with BUCK1). All regulators support programmable soft-start, current limiting, and thermal shutdown with dedicated DFS behavior.

Safety is enforced via integrated monitoring circuits including VCOREMON, VDDIOMON, four VMON inputs, FCCU interface for MCU error detection, challenger/simple watchdog modes, PGOOD/RSTB signaling, and a dedicated fail-safe output driver (FS0B) compliant with ISO 26262 ASIL B requirements.

Key Specifications

ParameterValue and Actual Design Meaning
Input Voltage RangeUp to 60 V DC - supports direct connection to 12 V/24 V automotive battery rails with reverse-battery protection diodes on VSUP1/VSUP2.
VPRE ControllerExternal synchronous buck controller with configurable switching frequency, slope compensation, and up to 10 A peak current capability.
BUCK1 Output1.1 V @ 4.5 A peak - dedicated MCU core supply with SVS (supply voltage supervision) and power sequencing slot 6.
BUCK2 Output1.8 V @ 4.5 A peak - supports multiphase operation with BUCK1 to extend total current to 7.2 A peak on single rail.
LDO OutputsTwo 400 mA LDOs (LDO1/LDO2) with configurable voltages - used for MCU I/O and ADC supply with independent power-up sequencing.
Safety CertificationISO 26262 ASIL B compliant - includes built-in self-test (ABIST/LBIST), fail-safe state machine, and dedicated FS0B output driver.
InterfaceSPI or I²C (0x20 address) with CRC - enables full OTP configuration, real-time monitoring, and fault reporting during runtime.

Pinout & Package

MC33FS8425G0KS is housed in a HVQFN56 package (8 mm × 8 mm × 0.85 mm, 0.5 mm pitch, wettable flank), thermally enhanced with exposed pad (EP) connected to GNDFS/GND. Pin count and functionality match the FS8425 device variant per Table 1 of the datasheet.

Pin/TerminalCircuit RoleDesign Meaning
VSUP1 / VSUP2Main power inputsAccept 60 V max input; require external reverse-battery protection diodes per datasheet Section 7.2.
BUCK1_IN / BUCK2_INBuck input suppliesLow-voltage inputs (typically 5 V–12 V) feeding internal synchronous rectifiers for BUCK1/BUCK2.
BUCK1_SW / BUCK2_SWSwitching nodesConnect to external inductors and output capacitors; require proper layout for EMI and thermal performance.
VCOREMON / VDDIOMONMonitoring inputsDirect feedback connections to BUCK1 and LDO2 outputs for supply voltage supervision and fault detection.
FS0BFail-safe outputActive-low open-drain output driving external safety-critical subsystems upon detected fault or TSD event.
PSYNCPower sync I/OEnables synchronized switching between two MC33FS8425G0KS devices or with external PMIC to reduce system-level ripple and EMI.
SCL / SDA / MISO / MOSI / SCLK / CSBDigital interfacesSupport both SPI (4-wire) and I²C (2-wire) communication with CRC for robust configuration and telemetry.
WAKE1 / WAKE2Wake-up inputsAnalog/digital inputs with external series resistor - initiate device wake from OFF mode (10 µA quiescent current).

Key Features

FeatureDesign Value
Multi-rail SMPS + LDO integrationReduces bill-of-materials and PCB area by consolidating VPRE controller, dual buck, boost, and dual LDO into single HVQFN56 IC.
EMC-optimized switchingIncludes frequency synchronization (FIN/FOUT), spread spectrum, slew rate control, and manual tuning to meet automotive CISPR-25 Class 5 limits.
ASIL B safety architectureProvides fail-safe output (FS0B), dedicated monitoring paths (VCOREMON, VMON1–4), FCCU interface, and ABIST/LBIST for functional safety compliance.
Configurable power sequencingEach regulator assigned to specific power-up/down slot (e.g., BUCK1 in Slot 6, BUCK2 in Slot 0) enabling precise timing control for complex SoCs.
OTP programmabilityFactory-programmed configuration (voltage, current limit, soft-start, sequencing) eliminates external configuration components and supports engineering-mode emulation.

Applications

Radar Sensor Power ManagementADAS Domain Controller Supply

Use Scenario: Powers NXP S32R274/S32R294 radar processors and TEF810x RF transceivers in corner/imaging radar modules.

IC Role / Device Role / Timing Role: Provides tightly regulated 1.1 V (BUCK1), 1.8 V (BUCK2), and 5.0 V (BOOST) rails with synchronized switching to minimize radar chirp interference.

Use Value: Enables <1% output ripple and <25 µs overvoltage response time per VMON path, critical for RF signal integrity and ADC accuracy.

Use Scenario: Supplies multiple voltage domains (core, I/O, PHY, ADC) in centralized ADAS domain controllers using NXP S32G or S32Z processors.

IC Role / Device Role / Timing Role: Delivers sequenced startup of BUCK1 (core), LDO1 (I/O), and BOOST (PHY) with slot-based timing and fail-safe assertion on fault.

Use Value: Reduces external component count by 7+ discrete regulators while maintaining ASIL B compliance for safety-critical vehicle motion control functions.

Vision System Power ArchitectureInfotainment Head Unit Power

Use Scenario: Powers S32V234 vision processors and image sensors in mono/stereo camera modules for lane departure and pedestrian detection.

IC Role / Device Role / Timing Role: Generates 1.25 V (BUCK1), 1.8 V (BUCK2), and 3.3 V (LDO1) with DVS-capable soft-start and SVS for dynamic voltage scaling during AI inference bursts.

Use Value: Achieves 92% peak efficiency at 2 A load and <100 mV dropout under 4.5 A transient, minimizing thermal stress in sealed camera housings.

Use Scenario: Supplies application processor, display interface, audio codec, and CAN transceiver in automotive infotainment head units.

IC Role / Device Role / Timing Role: Manages 1.1 V (core), 1.8 V (memory), 3.3 V (I/O), and 5.0 V (USB/PHY) with independent enable/disable and PGOOD monitoring per rail.

Use Value: Supports deep-sleep OFF mode (10 µA IQ) and wake-on-WAKE1/WAKE2 for always-on connectivity without battery drain.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive SBC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC33FS8420G0KSOmits FCCU safety monitor and supports only up to 2 VMON inputs vs. 4 on MC33FS8425G0KS.Targeted for non-safety-critical camera modules where MCU error monitoring is handled externally.Select when ASIL B compliance is not required for MCU monitoring path and cost reduction is prioritized.
MC33FS8520A0KSASIL D–rated version with enhanced monitoring (FCCU1/FCCU2), additional ABIST coverage, and extended temperature range.Required for domain controllers where end-to-end ASIL D decomposition mandates dual-channel MCU monitoring and higher diagnostic coverage.Choose when functional safety architecture requires full ASIL D decomposition and dual-challenge watchdog enforcement.

Compared with MC33FS8420G0KS, MC33FS8425G0KS adds FCCU-based MCU error monitoring and two extra VMON inputs for comprehensive supply supervision; versus MC33FS8520A0KS, it trades ASIL D certification and dual-FCCU for lower cost and reduced diagnostic overhead in ASIL B–only systems.

Availability

MC33FS8425G0KS is available at Aetrix Electronics and suitable for radar sensor modules, ADAS domain controllers, and vision systems requiring stable component supply with automotive-grade reliability and long-term lifecycle support.

Supply support for MC33FS8425G0KS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive microcontrollers and power management.

The FS84 product line delivers ASIL B–compliant system basis chips optimized for radar, vision, and domain controller power architectures - emphasizing fail-safe operation, EMC robustness, and seamless integration with NXP's S32 processor portfolio.

FAQ

What is the maximum input voltage rating for the MC33FS8425G0KS?

The MC33FS8425G0KS supports a maximum input voltage of 60 V DC on VSUP1 and VSUP2 pins. This allows direct connection to 12 V and 24 V automotive battery systems, provided external reverse-battery protection diodes are installed per the datasheet requirements in Section 7.2.

Does the MC33FS8425G0KS support both SPI and I²C interfaces simultaneously?

No - the MC33FS8425G0KS supports either SPI or I²C communication, selected at boot via OTP configuration. The default I²C address is 0x20, and SPI uses standard 4-wire protocol with CSB, SCLK, MOSI, and MISO. Both interfaces include CRC for error detection during configuration and telemetry reads.

How does the fail-safe output (FS0B) behave during thermal shutdown?

During thermal shutdown (TSD), the MC33FS8425G0KS asserts its active-low FS0B output to signal a critical fault condition. This open-drain output drives external safety mechanisms (e.g., MCU reset, isolation switches) and remains asserted until the device exits TSD and completes internal recovery - consistent with ASIL B fail-safe behavior defined in the safety manual.

Can BUCK1 and BUCK2 operate in multiphase mode on the MC33FS8425G0KS?

Yes - BUCK2 on the MC33FS8425G0KS supports multiphase operation with BUCK1 to extend the total current capability to 7.2 A peak on a single output rail. Phase shifting is programmable via OTP, and both regulators share synchronized clocking through the internal CLK_MGT block for optimal ripple cancellation.

What safety certifications apply to the MC33FS8425G0KS?

The MC33FS8425G0KS is developed in compliance with ISO 26262 for ASIL B applications and qualified per AEC-Q100 Grade 1 (−40 °C to +125 °C ambient). It includes ABIST/LBIST, dedicated fail-safe state machine, FS0B output, and monitoring inputs (VCOREMON, VMON1–4) to support functional safety goals in automotive radar and ADAS systems.

MC33FS8425G0KS Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
56-VFQFN Exposed Pad
Packaging:
Tray
Product Status:
Active
Applications:
System Basis Chip
Current - Supply:
15mA
Voltage - Supply:
60V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
56-HVQFN (8x8)

MC33FS8425G0KS FAQ

1.How can I place an order for MC33FS8425G0KS through Aetrix?

Please submit a Request for Quotation (RFQ) for MC33FS8425G0KS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC33FS8425G0KS reliable?

The price and inventory of MC33FS8425G0KS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8425G0KS is usually 5 days.

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MC33FS8425G0KS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC33FS8425G0KS order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC33FS8425G0KS?

For technical support, including MC33FS8425G0KS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8425G0KS requirements.

6.How does Aetrix verify that MC33FS8425G0KS is sourced from the original manufacturer or authorized distributors?

All MC33FS8425G0KS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8425G0KS meets industry standards.

7.What is the process for return or replacement of MC33FS8425G0KS?

All MC33FS8425G0KS units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8425G0KS, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC33FS8425G0KS part is unused and in its original packaging.

Return procedure for MC33FS8425G0KS:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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