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NXP Semiconductors MC33FS8425G0KSR2
- Part No.:
- MC33FS8425G0KSR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8425G0KSR2.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:2,578
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Product details
Overview
MC33FS8425G0KSR2 from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, two low-voltage synchronous buck converters (BUCK1 and BUCK2), one boost converter, and two LDOs. It delivers up to 3.6 A peak per buck rail, supports 60 V DC input, and features SPI/I²C control, fail-safe output, and power synchronization for radar and ADAS domain controllers.
For engineers reviewing the MC33FS8425G0KSR2 datasheet, MC33FS8425G0KSR2 pinout, MC33FS8425G0KSR2 application, or MC33FS8425G0KSR2 equivalent, key selection criteria include its dual-buck + VPRE architecture, ASIL B safety certification, 2.22 MHz switching frequency, integrated fault monitoring (VCOREMON, VMONx), and HVQFN56 wettable flank package compatibility with automotive thermal and EMC requirements.
Technical Context
The MC33FS8425G0KSR2 implements a multi-rail power management architecture with independent control loops for VPRE (external MOSFET controller), BUCK1 (MCU core supply with SVS), and BUCK2 (multi-phase capable up to 7.2 A peak when synchronized with BUCK1). All regulators support programmable soft-start, DVS, and thermal shutdown with dedicated DFS response.
Safety logic includes a fail-safe state machine, challenger watchdog, FCCU interface for MCU error monitoring, and configurable PGOOD/RSTB outputs. It complies with ISO 26262 ASIL B and AEC-Q100 Grade 1, with built-in ABIST/LBIST, voltage supervision on six analog inputs (VCOREMON, VMON1–VMON4), and fail-safe output (FS0B) driven by internal fault detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 60 V DC max - supports 12 V and 24 V automotive battery systems with reverse-battery protection diodes on VSUP1/VSUP2. |
| VPRE Controller Output | Configurable output voltage, 455 kHz fixed-frequency PWM mode - drives external high-side/low-side MOSFETs for primary high-power rail. |
| BUCK1 Output | 1.1 V @ 4.5 A peak - dedicated MCU core supply with SVS capability and slot-based power sequencing (Slot 6). |
| BUCK2 Output | 1.8 V @ 4.5 A peak - supports multiphase operation with BUCK1; enables extended current delivery without external phase-interleaving circuitry. |
| Switching Frequency | 2.22 MHz - enables compact passive filtering and reduces EMI in radar/ADAS applications requiring tight EMC compliance. |
| Safety Certification | ISO 26262 ASIL B compliant - includes dedicated monitoring circuits, fail-safe output (FS0B), and configurable fault recovery behavior (infinite autoretry). |
| Interface | SPI or I²C (0x20 address) with CRC - enables real-time configuration, telemetry readback, and safety-critical register lock protection. |
Pinout & Package
HVQFN56 plastic thermal enhanced very thin quad flat package; 8 mm × 8 mm × 0.85 mm body; 0.5 mm pitch; wettable flank (dimple variant for KS suffix); exposed pad (EP) connected to GNDFS/GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BUCK1_FB (39) | Voltage feedback input | Connects to BUCK1 output via resistor divider to set 1.1 V regulated output with ±1% accuracy. |
| BUCK2_FB (32) | Voltage feedback input | Configures BUCK2 output to 1.8 V; supports dynamic voltage scaling and soft-start ramp rate of 7.81 mV/µs. |
| VCOREMON (17) | Core voltage monitor input | Direct connection to BUCK1 output enables SVS (supply voltage supervisor) with OV/UV thresholds at 112%/88% and 45 µs/40 µs delay. |
| FS0B (14) | Fail-safe output | Open-drain active-low signal asserting system-level fail-safe state upon detected fault (TSD, OV, UV, watchdog timeout). |
| PSYNC (38) | Power sync I/O | Enables synchronization of two MC33FS8425G0KSR2 devices or coordination with external PMIC to reduce beat-frequency EMI. |
| INTB (33) | Interrupt output | Active-low interrupt signaling regulator faults, watchdog events, or safety state transitions to host MCU. |
| WAKE1 / WAKE2 (49, 1) | Wake-up inputs | Analog/digital inputs with external series resistor - trigger device wake from OFF mode (10 µA quiescent current) on battery voltage transition. |
Key Features
| Feature | Design Value |
|---|---|
| Dual synchronous buck + VPRE controller | Enables scalable power tree: VPRE for high-current pre-regulation, BUCK1 for MCU core, BUCK2 for I/O or auxiliary rails - all with independent sequencing and fault handling. |
| EMC-optimized switching | 2.22 MHz fixed-frequency operation plus spread spectrum, slew rate control, and FSYNC input/output - reduces radiated emissions in radar front-end designs. |
| ASIL B safety subsystem | Includes challenger watchdog, FCCU interface, ABIST/LBIST, and fail-safe output (FS0B) - satisfies functional safety requirements without external safety monitor IC. |
| OTP-configurable power-up sequence | Regulator start/stop slots (e.g., BUCK1 in Slot 6, BUCK2 in Slot 0) are factory-programmed - eliminates need for external sequencing IC or firmware delays. |
| Multi-input voltage supervision | Monitors VCOREMON, VMON1–VMON4 with independently configurable OV/UV thresholds and deglitch times - supports complex power domain validation in domain controllers. |
Applications
| Radar Sensor Power Management | ADAS Domain Controller Supply |
|---|---|
Use Scenario: Powers NXP S32R274/S32R294 radar SoCs in corner or imaging radar modules with strict EMC and thermal constraints. IC Role / Device Role / Timing Role: Primary SBC delivering VPRE (for RF front-end bias), BUCK1 (1.1 V core), BUCK2 (1.8 V I/O), LDO1/LDO2 (ADC/PHY supplies), and fail-safe signaling. Use Value: Integrated VPRE controller eliminates external gate drivers; 2.22 MHz switching enables small 1 µH inductors; PSYNC synchronizes multiple FS84 devices to suppress beat frequencies. | Use Scenario: Supplies heterogeneous compute clusters (e.g., Cortex-R5F + accelerators) in centralized ADAS domain controllers requiring coordinated power sequencing and safety monitoring. IC Role / Device Role / Timing Role: Centralized power manager providing five regulated rails, voltage supervision across six domains, and fail-safe assertion to MCU reset and safety co-processor. Use Value: OTP-programmed slot-based sequencing ensures deterministic startup; FCCU interface enables bidirectional error reporting with host MCU; infinite autoretry on TSD maintains system availability. |
| Vision System Camera Module | Automotive Infotainment Head Unit |
Use Scenario: Powers NXP S32V-based mono/stereo camera modules with image sensor, ISP, and MIPI interface - operating in high-temperature cabin environments. IC Role / Device Role / Timing Role: Dual-buck regulator supplying 1.1 V core and 1.8 V I/O, plus BOOST (5.0 V) for MIPI PHY and LDOs for analog sensors. Use Value: BUCK1's SVS capability monitors core voltage in real time; thermal shutdown with DFS prevents latch-up during sustained ambient >105 °C; wettable flank HVQFN56 ensures reliable reflow inspection. | Use Scenario: Delivers clean, sequenced power to application processors, audio codecs, display interfaces, and CAN transceivers in head units with infotainment and telematics functions. IC Role / Device Role / Timing Role: Multi-rail SBC generating 1.1 V (AP core), 1.8 V (I/O), 3.3 V (LDO2), 5.0 V (BOOST), and 2.5 V (LDO1) - all supervised and synchronized. Use Value: I²C interface (0x20) allows runtime rail reconfiguration; AMUX output feeds MCU ADC for real-time voltage telemetry; OFF mode (10 µA) supports low-power sleep states. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8420G0KSR2 | Omits FCCU safety monitoring block and limits VMON inputs to two (VMON1/VMON2); no ERRMON pin. | Targeted at non-safety-critical vision or infotainment modules where ASIL B compliance is not required. | Select when full FCCU/ERRMON functionality is unnecessary and cost optimization is prioritized over safety feature depth. |
| MC33FS8520A0KSR2 | ASIL D certified; adds third VMON input (VMON3), enhanced ABIST coverage, and dual-challenger watchdog; identical pinout and regulator specs. | Required for domain controllers or radar systems demanding ASIL D decomposition across power management and host MCU. | Choose when system-level ASIL D allocation mandates safety-critical power supervision beyond ASIL B scope. |
Compared with MC33FS8420G0KSR2, the MC33FS8425G0KSR2 adds FCCU and four VMON inputs for robust MCU error coupling and multi-domain voltage supervision; versus MC33FS8520A0KSR2, it provides ASIL B assurance at lower verification overhead while retaining identical regulator performance and thermal design.
Availability
MC33FS8425G0KSR2 is available at Aetrix Electronics and suitable for radar sensor modules, ADAS domain controllers, and automotive vision systems requiring stable component supply, long-term automotive qualification, and fail-safe power integrity.
Supply support for MC33FS8425G0KSR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive MCUs, radar SoCs, and functional safety-certified power management.
The FS84 product line delivers ASIL B–certified system basis chips optimized for radar, vision, and ADAS domain controllers - integrating high-efficiency SMPS, safety monitoring, and automotive-grade reliability in a single HVQFN56 package.
FAQ
What is the primary safety certification level of the MC33FS8425G0KSR2?
The MC33FS8425G0KSR2 is certified to ISO 26262 ASIL B and qualified per AEC-Q100 Grade 1. Its safety features include a dedicated fail-safe state machine, challenger watchdog, FCCU interface for MCU error monitoring, and fail-safe output (FS0B) that asserts on detected faults including thermal shutdown, overvoltage, undervoltage, and watchdog timeout. The MC33FS8425G0KSR2 does not support ASIL D.
Does the MC33FS8425G0KSR2 support multiphase operation between BUCK1 and BUCK2?
Yes, the MC33FS8425G0KSR2 supports multiphase operation between BUCK1 and BUCK2 to extend peak current capability to 7.2 A on a single rail. This is enabled via internal phase-shifting control - BUCK2 is configured with a 0° delay relative to BUCK1 in the default OTP setting, allowing interleaved switching that reduces input/output ripple and thermal stress without external timing components.
What are the key differences between MC33FS8425G0KSR2 and MC33FS8420G0KSR2?
The MC33FS8425G0KSR2 includes FCCU (functional safety monitoring interface) and four voltage monitor inputs (VMON1–VMON4), whereas MC33FS8420G0KSR2 supports only VMON1/VMON2 and omits FCCU/ERRMON pins. Both share identical regulator specs (BUCK1/BUCK2 output voltages, current capability, and 2.22 MHz frequency), but MC33FS8425G0KSR2 enables deeper safety integration for ASIL B–compliant systems requiring MCU-coupled fault detection.
How is the MC33FS8425G0KSR2 configured for power sequencing?
The MC33FS8425G0KSR2 uses factory-programmed OTP to assign each regulator to a specific power sequencing slot - BUCK1 starts/stops in Slot 6, BUCK2 in Slot 0, LDO1 in Slot 1, and LDO2 in Slot 2. Sequencing is fully autonomous and requires no external control or MCU intervention. Slot assignments are fixed per OTP configuration and cannot be modified in-system.
What package type and thermal characteristics does the MC33FS8425G0KSR2 use?
The MC33FS8425G0KSR2 uses the HVQFN56 package (8 mm × 8 mm × 0.85 mm, 0.5 mm pitch) with dimple wettable flank (KS suffix) and exposed thermal pad (EP) connected to GNDFS/GND. This package supports high-power dissipation in automotive under-hood environments and enables automated optical inspection (AOI) of solder joints due to the wettable flank geometry.
MC33FS8425G0KSR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8425G0KSR2 FAQ
1.How can I place an order for MC33FS8425G0KSR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8425G0KSR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8425G0KSR2 reliable?
The price and inventory of MC33FS8425G0KSR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8425G0KSR2 is usually 5 days.
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MC33FS8425G0KSR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8425G0KSR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8425G0KSR2?
For technical support, including MC33FS8425G0KSR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8425G0KSR2 requirements.
6.How does Aetrix verify that MC33FS8425G0KSR2 is sourced from the original manufacturer or authorized distributors?
All MC33FS8425G0KSR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8425G0KSR2 meets industry standards.
7.What is the process for return or replacement of MC33FS8425G0KSR2?
All MC33FS8425G0KSR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8425G0KSR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8425G0KSR2 part is unused and in its original packaging.
Return procedure for MC33FS8425G0KSR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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