Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Power Management - Specialized

NXP Semiconductors MC33FS8430G0KSR2

Name: MC33FS8430G0KSR2
Brand: NXP Semiconductors
SKU: MC33FS8430G0KSR2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: MC33FS8430G0KSR2

Manufacturer:: NXP Semiconductors

Category:: Power Management - Specialized

Package:: 56-VFQFN Exposed Pad

Datasheet:: MC33FS8430G0KSR2.pdf

Description:: SAFETY POWER MANAGEMENT IC, QFN5

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:2,840

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

MC33FS8430G0KSR2 from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating three synchronous buck converters (BUCK1/2/3), one boost converter, two LDOs, and comprehensive safety monitoring. It delivers up to 3.6 A per buck rail, supports 60 V DC input, and features SPI/I²C control, fail-safe output (FS0B), power-good (PGOOD), reset (RSTB), and frequency synchronization (FIN/FOUT). It targets radar and camera power systems requiring functional safety and multi-rail sequencing.

For engineers reviewing the MC33FS8430G0KSR2 datasheet, MC33FS8430G0KSR2 pinout, MC33FS8430G0KSR2 application, or MC33FS8430G0KSR2 equivalent, key selection criteria include its triple-buck topology with configurable 1.03–3.3 V outputs, 2.22 MHz switching frequency, integrated fail-safe state machine, ASIL B compliance per ISO 26262, and HVQFN56 wettable flank package for automotive-grade thermal and reliability performance.

Technical Context

The MC33FS8430G0KSR2 implements a deterministic safety architecture with dedicated monitoring circuits for VCOREMON, VDDIOMON, VMON1–VMON4, and built-in self-test (ABIST/LBIST). Its fail-safe output (FS0B) asserts on detected faults including overvoltage, undervoltage, thermal shutdown, or watchdog timeout - enabling safe system partitioning in ASIL B domains.

Power management includes programmable power-up sequencing across six slots, dynamic voltage scaling (DVS) for BUCK1/2/3, and external frequency synchronization (FIN/FOUT) to reduce EMI. The device supports multi-phase operation between BUCK1 and BUCK2 (up to 7.2 A peak), and integrates a VPRE synchronous buck controller with external MOSFET gate drivers (PRE_GHS/PRE_GLS).

Key Specifications

Parameter	Value and Actual Design Meaning
Input Voltage Range	4.9 V to 60 V DC - supports 12 V and 24 V automotive battery systems with reverse-battery protection diode requirement on VSUP1/VSUP2.
BUCK1 Output	1.8 V @ 4.5 A peak - dedicated MCU core supply with SVS capability and soft-start slope of 7.81 mV/µs.
BUCK2 Output	1.8 V @ 4.5 A peak - configurable low-voltage rail; supports multiphase operation with BUCK1 for extended current capability.
BUCK3 Output	3.3 V @ 4.5 A peak - independently sequenced rail with 10.41 mV/µs DVS soft-start and TSD-triggered shutdown + DFS.
LDO1 / LDO2	1.8 V / 3.3 V @ 400 mA each - supplies MCU I/Os and ADC reference; both support independent power sequencing and UV/OV monitoring.
Fail-Safe Output	FS0B active-low open-drain - asserts on monitored fault conditions (e.g., VCOREMON UV/UV_DGLT = 15 µs) to initiate system-level safe state.
Interface	SPI or I²C (0x20 address) with CRC - enables real-time configuration, status readback, and safety-critical register access with error detection.

Pinout & Package

HVQFN56 package: plastic thermal-enhanced very thin quad flat no-lead package, 8 mm × 8 mm × 0.85 mm body, 0.5 mm pitch, wettable flank (KS suffix), exposed pad (EP) connected to GNDFS/GND.

Pin/Terminal	Circuit Role	Design Meaning
BUCK1_FB	Voltage feedback input	Connects to BUCK1 output via resistor divider to regulate 1.8 V output with ±1.5% accuracy over temp and line.
FS0B	Fail-safe output	Active-low open-drain signal asserting on safety violation; requires external pull-up to VDDIO for MCU interrupt or system shutdown logic.
PGOOD	Power-good indicator	Active-low output confirming all regulated rails are within tolerance; must be pulled up to VDDIO to drive MCU reset or enable logic.
RSTB	Reset output	Active-low MCU reset signal synchronized to internal power sequencing; monitors external reset voltage for fault detection.
FIN / FOUT	Frequency sync I/O	Enables daisy-chained EMC optimization: FIN accepts external clock (e.g., from MCU); FOUT drives adjacent FS84/FS85 devices or PMICs.
VCOREMON	Core voltage monitor input	Direct connection to BUCK1 output enables precise UV/OV detection (thresholds: 88%/112%) with 25 µs deglitch for glitch immunity.
WAKE1 / WAKE2	Wake-up inputs	Analog/digital wake sources with external series resistor; trigger device exit from OFF mode (10 µA quiescent current) upon battery voltage threshold crossing.

Key Features

Feature	Design Value
Triple synchronous buck regulators	BUCK1/2/3 deliver 1.8 V/1.8 V/3.3 V at up to 4.5 A each, with independent sequencing slots and soft-start control for stable MCU and sensor power-up.
Integrated fail-safe state machine	Monitors 7 voltage domains (VCOREMON, VDDIOMON, VMON1–VMON4), thermal shutdown, and watchdog; asserts FS0B to enforce ASIL B safe state without MCU intervention.
EMC-optimized switching	2.22 MHz fixed-frequency operation + spread spectrum + slew rate control + external frequency sync (FIN/FOUT) reduces radiated emissions in radar/camera ECU designs.
Configurable power sequencing	6-slot sequencing engine enables precise start/stop timing across all regulators (e.g., BUCK1 in Slot 0, BUCK3 in Slot 6) to meet SoC boot requirements.
OTP-programmable safety settings	Factory-configured ASIL B safety level, UV/OV thresholds, deglitch times, and fail-safe behavior stored in one-time-programmable memory - no runtime reconfiguration needed.

Applications

Radar Power Management	Automotive Camera ECU
Use Scenario: Powers NXP S32R274/S32R294 radar SoCs with multiple voltage rails (core, I/O, PHY, RF bias) in corner or imaging radar modules. IC Role / Device Role / Timing Role: System basis chip providing regulated BUCK1 (1.03–1.8 V core), BUCK2 (1.2–1.8 V I/O), BUCK3 (3.3 V PHY), LDO1/LDO2 (ADC/ref), and fail-safe supervision. Use Value: Enables single-chip power solution meeting ASIL B requirements while reducing board area and eliminating discrete supervisor ICs.	Use Scenario: Supplies NXP S32V234 vision processor and image sensor in mono/stereo camera modules for ADAS lane departure or AEB functions. IC Role / Device Role / Timing Role: Delivers sequenced 1.8 V (core), 1.2 V (memory), 3.3 V (interface), and 1.8 V/3.3 V (I/O/ADC) rails with PGOOD/RSTB coordination for deterministic boot. Use Value: Integrates power, safety, and monitoring to simplify design of compact, thermally constrained camera ECUs compliant with AEC-Q100 Grade 1.
ADAS Domain Controller	Infotainment Head Unit
Use Scenario: Centralized power management for multi-SoC domain controllers integrating radar, vision, and vehicle network interfaces (CAN FD, Ethernet). IC Role / Device Role / Timing Role: Provides isolated, sequenced rails for heterogeneous compute (ARM Cortex-A/R cores), communication peripherals, and safety co-processors. Use Value: Reduces bill-of-materials by consolidating up to 8 power rails and safety monitoring into one AEC-Q100 qualified IC with PSYNC for inter-device timing alignment.	Use Scenario: Powers infotainment SoCs (e.g., i.MX 8 series) and display/audio subsystems in head units requiring robust startup and fault containment. IC Role / Device Role / Timing Role: Generates 1.0–1.8 V core, 1.8 V/3.3 V I/O, and 5.0 V analog rails; uses FS0B to isolate faulty subsystems during brown-out or overtemperature events. Use Value: Prevents cascading failures in complex infotainment systems by enforcing safe shutdown of non-critical domains while maintaining essential CAN bus operation.

Radar Power Management

Automotive Camera ECU

Use Scenario: Powers NXP S32R274/S32R294 radar SoCs with multiple voltage rails (core, I/O, PHY, RF bias) in corner or imaging radar modules.

IC Role / Device Role / Timing Role: System basis chip providing regulated BUCK1 (1.03–1.8 V core), BUCK2 (1.2–1.8 V I/O), BUCK3 (3.3 V PHY), LDO1/LDO2 (ADC/ref), and fail-safe supervision.

Use Value: Enables single-chip power solution meeting ASIL B requirements while reducing board area and eliminating discrete supervisor ICs.

Use Scenario: Supplies NXP S32V234 vision processor and image sensor in mono/stereo camera modules for ADAS lane departure or AEB functions.

IC Role / Device Role / Timing Role: Delivers sequenced 1.8 V (core), 1.2 V (memory), 3.3 V (interface), and 1.8 V/3.3 V (I/O/ADC) rails with PGOOD/RSTB coordination for deterministic boot.

Use Value: Integrates power, safety, and monitoring to simplify design of compact, thermally constrained camera ECUs compliant with AEC-Q100 Grade 1.

ADAS Domain Controller

Infotainment Head Unit

Use Scenario: Centralized power management for multi-SoC domain controllers integrating radar, vision, and vehicle network interfaces (CAN FD, Ethernet).

IC Role / Device Role / Timing Role: Provides isolated, sequenced rails for heterogeneous compute (ARM Cortex-A/R cores), communication peripherals, and safety co-processors.

Use Value: Reduces bill-of-materials by consolidating up to 8 power rails and safety monitoring into one AEC-Q100 qualified IC with PSYNC for inter-device timing alignment.

Use Scenario: Powers infotainment SoCs (e.g., i.MX 8 series) and display/audio subsystems in head units requiring robust startup and fault containment.

IC Role / Device Role / Timing Role: Generates 1.0–1.8 V core, 1.8 V/3.3 V I/O, and 5.0 V analog rails; uses FS0B to isolate faulty subsystems during brown-out or overtemperature events.

Use Value: Prevents cascading failures in complex infotainment systems by enforcing safe shutdown of non-critical domains while maintaining essential CAN bus operation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive SBC applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MC33FS8420G0KSR2	Omits BUCK3 regulator; supports only BUCK1 + BUCK2 (dual-buck variant); identical ASIL B safety architecture and pinout.	Suitable for dual-rail applications (e.g., MCU + PHY only), not for triple-rail vision/radar SoCs requiring independent 3.3 V domain.	Select when BUCK3 is unnecessary to reduce cost and complexity; retains full compatibility for BUCK1/BUCK2 use cases.
MC33FS8530A0KSR2	ASIL D–rated version with enhanced FCCU monitoring, additional VMON channels, and challenger watchdog; same triple-buck topology and HVQFN56 package.	Required for ASIL D–compliant domain controllers or safety-critical ADAS functions where fault coverage exceeds ASIL B thresholds.	Choose for higher-integrity systems needing certified ASIL D decomposition; not drop-in due to stricter diagnostic requirements and OTP configuration.

Compared with MC33FS8420G0KSR2, the MC33FS8430G0KSR2 adds a fully sequenced third buck regulator for independent 3.3 V supply - critical for radar PHY or camera interface rails - while maintaining identical safety architecture and footprint. Against MC33FS8530A0KSR2, it trades ASIL D diagnostics and FCCU depth for lower cost and simpler qualification in ASIL B–only applications.

Availability

MC33FS8430G0KSR2 is available at Aetrix Electronics and suitable for radar sensor modules, automotive camera ECUs, and ADAS domain controllers requiring stable component supply, AEC-Q100 Grade 1 qualification, and long-term automotive lifecycle support.

Supply support for MC33FS8430G0KSR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade power management.

The FS84 product line delivers ASIL B–certified system basis chips optimized for radar, vision, and ADAS domain controllers - integrating multi-rail power conversion, fail-safe supervision, and automotive EMC resilience in a single HVQFN package.

FAQ

What is the maximum output current capability of each buck regulator in the MC33FS8430G0KSR2?

The MC33FS8430G0KSR2 supports up to 4.5 A peak current on BUCK1, BUCK2, and BUCK3. BUCK1 is configured for 1.8 V at 4.5 A in this variant, BUCK2 delivers 1.8 V at 4.5 A, and BUCK3 provides 3.3 V at 4.5 A - all with independent current limiting and thermal shutdown protection. These values are confirmed in the device options table and OTP configuration data for MC33FS8430G0KSR2.

Does the MC33FS8430G0KSR2 support multiphase operation between its buck regulators?

Yes, the MC33FS8430G0KSR2 supports multiphase operation between BUCK1 and BUCK2 to extend total current capability to 7.2 A peak on a single rail. This is enabled via phase-shifting control (delay 0 for BUCK1, delay 2 for BUCK2 in this OTP variant) and coordinated current sharing - verified in the "BUCK2" section of the OTP flavor table and block diagram.

How does the fail-safe output (FS0B) of the MC33FS8430G0KSR2 behave during thermal shutdown?

During thermal shutdown (TSD), the MC33FS8430G0KSR2 asserts FS0B (active-low) and initiates deep fail-safe (autoretry) with infinite retry cycles. This behavior is documented in the "Behavior in case of TSD" rows for BUCK1/BUCK2/BUCK3 and confirmed in the fail-safe OTP flavor table - ensuring immediate system-level response without MCU dependency.

What is the purpose of the PSYNC pin on the MC33FS8430G0KSR2, and is it enabled in this variant?

The PSYNC pin on the MC33FS8430G0KSR2 serves as a bidirectional power synchronization interface to coordinate switching frequencies across multiple FS84/FS85 devices or with external PMICs for EMC optimization. In this variant (MC33FS8430G0KSR2), PSYNC is disabled per the "Other" OTP table - meaning it functions as a standard input-only pin unless reconfigured via factory OTP programming.

Which voltage monitoring inputs are active and configured for overvoltage/undervoltage detection in the MC33FS8430G0KSR2?

The MC33FS8430G0KSR2 actively monitors VCOREMON (BUCK1 output), VDDIOMON (LDO2 output), VMON1, VMON2, VMON3, and VMON4 with configurable OV/UV thresholds and deglitch timers. Per the PGOOD table, all six are enabled for PGOOD assertion, and the OTP flavor table confirms OVTH/UVTH settings (e.g., 112%/88% for VCOREMON) with 25–45 µs deglitch windows.

MC33FS8430G0KSR2 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 56-VFQFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Applications:: System Basis Chip

Current - Supply:: 15mA

Voltage - Supply:: 60V

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount, Wettable Flank

Supplier Device Package:: 56-HVQFN (8x8)

MC33FS8430G0KSR2 FAQ

1.How can I place an order for MC33FS8430G0KSR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for MC33FS8430G0KSR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC33FS8430G0KSR2 reliable?

The price and inventory of MC33FS8430G0KSR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8430G0KSR2 is usually 5 days.

3.What payment methods are accepted for MC33FS8430G0KSR2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8430G0KSR2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC33FS8430G0KSR2?

MC33FS8430G0KSR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC33FS8430G0KSR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC33FS8430G0KSR2?

For technical support, including MC33FS8430G0KSR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8430G0KSR2 requirements.

6.How does Aetrix verify that MC33FS8430G0KSR2 is sourced from the original manufacturer or authorized distributors?

All MC33FS8430G0KSR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8430G0KSR2 meets industry standards.

7.What is the process for return or replacement of MC33FS8430G0KSR2?

All MC33FS8430G0KSR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8430G0KSR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC33FS8430G0KSR2 part is unused and in its original packaging.

Return procedure for MC33FS8430G0KSR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-03 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-01 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…