My Inquiry
My Account
NXP Semiconductors MC33FS8430G1KS
- Part No.:
- MC33FS8430G1KS
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8430G1KS.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:2,284
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC33FS8430G1KS from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating three synchronous buck converters (BUCK1/2/3), one boost converter, two LDOs, and comprehensive safety monitoring. It delivers 1.8 V @ 4.5 A (BUCK2), 3.3 V @ 4.5 A (BUCK3), and 1.8 V @ 400 mA (LDO1), with 60 V max input, 2.22 MHz switching, and SPI/I²C control - designed for camera modules with NXP S32V MCU and PF8x PMIC.
For engineers reviewing the MC33FS8430G1KS datasheet, MC33FS8430G1KS pinout, MC33FS8430G1KS application, or MC33FS8430G1KS equivalent, this page provides verified regulator configurations, fail-safe state machine behavior, voltage supervision thresholds (VCOREMON = 1.8 V, VDDIOMON = 3.3 V), thermal shutdown response (BUCK2 shutdown + DFS), and OTP-programmed power sequencing (BUCK2 in Slot 0, BUCK3 in Slot 0).
Technical Context
The MC33FS8430G1KS implements a deterministic fail-safe state machine with deep fail-safe autoretry (infinite cycles), challenger watchdog disabled, and simple watchdog enabled. Its safety architecture includes ABIST1 coverage for VCOREMON, VDDIOMON, VMON1–VMON4, and dedicated FCCU inputs for MCU error monitoring.
Power management features include multi-phase capability between BUCK1 and BUCK2 (not enabled in this OTP variant), external frequency synchronization (FIN/FOUT), PSYNC disabled, and PLL enabled. All regulators use fixed 2.22 MHz switching with DVS soft-start slopes of 7.81 mV/µs (BUCK1/2) and 10.41 mV/µs (BUCK3).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ASIL Level | ASIL B - certified per ISO 26262, qualified to AEC-Q100 Grade 1 |
| Input Voltage Range | 4.9 V to 60 V - supports 12 V/24 V automotive battery rails with reverse-battery protection diodes on VSUP1/VSUP2 |
| BUCK1 Output | 1.8 V @ 4.5 A peak - configured for MCU core supply with SVS capability and power sequencing in Slot 0 |
| BUCK2 Output | 1.8 V @ 4.5 A peak - dedicated low-voltage rail for imaging subsystems; starts/stops in Slot 0 |
| BUCK3 Output | 3.3 V @ 4.5 A peak - supplies camera sensor I/O or interface logic; starts/stops in Slot 0 |
| LDO1/LDO2 | 1.8 V / 3.3 V @ 400 mA each - regulated supplies for MCU I/Os and ADC reference, with independent UV/OV monitoring |
| Fail-Safe Response | Deep fail-safe autoretry (infinite), BUCK2/BUCK3 shutdown + DFS on thermal fault, PGOOD/RSTB assertion on fault |
| Interface | SPI or I²C (0x20 address), CRC-protected commands, 32-bit register map for configuration and monitoring |
Pinout & Package
MC33FS8430G1KS uses HVQFN56 package (8 mm × 8 mm × 0.85 mm, 0.5 mm pitch, wettable flank KS variant), thermally enhanced with exposed pad connected to GNDFS/GND.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 WAKE2 | Wake-up input 2 | Configurable digital/analog wake source; requires external series resistor if used as global wake pin |
| 7 DBG | Debug mode entry | Enables engineering debug mode via pin assertion during power-up |
| 14 FS0B | Fail-safe output 0 | Active-low open-drain signal indicating fail-safe state activation; drives external safety controller |
| 18 PGOOD | Power good output | Active-low status flag requiring external pull-up to VDDIO; asserts only when all monitored rails are in regulation |
| 19 RSTB | Reset output | Active-low MCU reset signal; monitors external reset and internal fault conditions |
| 33 INTB | Interrupt output | Open-drain interrupt signaling regulator faults, watchdog timeouts, or safety events |
| 37 BUCK1_SW | Buck1 switching node | Connects to external high-side MOSFET drain; requires proper layout for EMI and thermal performance |
| 44 PRE_SW | VPRE switching node | Drives external synchronous rectifier in VPRE buck controller stage; supports up to 10 A peak current |
| 54 LDO2 | LDO2 output | 3.3 V regulated supply for MCU I/O banks; current-limited to 400 mA DC |
| 55 LDO1 | LDO1 output | 1.8 V regulated supply for analog/ADC circuitry; current-limited to 400 mA DC |
| 57 EP | Exposed pad | Thermal and electrical connection point for BUCK1/2/3 low-side grounds; must be soldered to PCB GND plane |
Key Features
| Feature | Design Value |
|---|---|
| Triple synchronous buck regulators | BUCK1 (1.8 V/4.5 A), BUCK2 (1.8 V/4.5 A), BUCK3 (3.3 V/4.5 A) - all operate at 2.22 MHz with independent power sequencing slots |
| Fail-safe state machine | Infinite deep fail-safe autoretry, integrated ABIST1 for VCOREMON/VDDIOMON/VMON1–VMON4, and configurable fault recovery behavior |
| Voltage supervision | Seven independent monitoring channels (VCOREMON, VDDIOMON, VMON1–VMON4) with programmable OV/UV thresholds and deglitch times |
| EMC optimization | Frequency synchronization (FIN/FOUT), spread spectrum disabled, slew rate control on PRE_GHS/PRE_GLS, and manual tuning support |
| OTP-configured operation | G1 OTP variant fixes BUCK2/BUCK3 outputs, disables FCCU, enables PGOOD/VDDIOMON/VMON1–VMON4 monitoring, and sets TSD response to shutdown + DFS |
| Automotive qualification | AEC-Q100 Grade 1 (−40 °C to +125 °C), MSL3, ISO 26262 ASIL B compliant with full safety documentation package |
Applications
| Camera Power Management | Radar Sensor Subsystem |
|---|---|
Use Scenario: Powering NXP S32V-based mono/stereo camera modules with PF8x companion PMIC. IC Role / Device Role / Timing Role: Primary SBC providing core (1.8 V), I/O (3.3 V), and auxiliary (1.8 V) rails; manages startup sequencing and fail-safe response during thermal overload. Use Value: Eliminates discrete regulator count by integrating three high-current bucks and dual LDOs, reducing BOM cost and PCB area while meeting ASIL B requirements. | Use Scenario: Supplying radar transceiver ICs (e.g., TEF810x) in 12 V/24 V vehicle architectures. IC Role / Device Role / Timing Role: Fail-safe power manager delivering clean, sequenced voltages to RF front-end and baseband processors; synchronizes switching frequency across multiple domains via FIN/FOUT. Use Value: Enables system-level EMC compliance through frequency synchronization and reduces design risk via built-in voltage supervision and infinite fail-safe retry. |
| ADAS Domain Controller | Infotainment Head Unit |
Use Scenario: Powering vision- and radar-fused domain controllers requiring functional safety and multi-rail coordination. IC Role / Device Role / Timing Role: Centralized power hub managing MCU core, memory, sensor interface, and communication PHY rails; interfaces with host MCU via SPI/I²C for real-time health reporting. Use Value: Simplifies safety case development with pre-qualified ASIL B architecture, integrated watchdog, and deterministic fault escalation paths. | Use Scenario: Supplying display processor, audio codec, and connectivity modules in automotive infotainment systems. IC Role / Device Role / Timing Role: High-efficiency multi-output SBC delivering stable 1.2–3.3 V rails with low-noise LDOs for sensitive analog circuits and high-current bucks for digital cores. Use Value: Reduces thermal stress and improves system reliability via active thermal management (TSD-triggered DFS) and robust overvoltage/undervoltage protection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8420G0KS | Omits BUCK3; supports only BUCK1 + BUCK2; same ASIL B rating, 2.22 MHz switching, and OTP-programmable sequencing | Targeted at dual-rail camera or radar systems without need for third independent 3.3 V rail | Select when BUCK3 is unnecessary and cost reduction is prioritized over rail flexibility |
| MC33FS8530A1ES | ASIL D rated; adds FCCU, ERRMON, and enhanced ABIST coverage; includes BUCK3 and identical regulator specs | Required for ASIL D domain controllers or safety-critical ADAS functions where fault coverage exceeds ASIL B | Choose when system-level safety goals demand ASIL D compliance and extended monitoring capabilities |
Compared with MC33FS8420G0KS, MC33FS8430G1KS adds a fully featured BUCK3 rail for sensor I/O or interface logic, enabling single-chip power for complex camera modules; versus MC33FS8530A1ES, it trades ASIL D certification and FCCU for lower cost and reduced complexity in ASIL B–constrained applications.
Availability
MC33FS8430G1KS is available at Aetrix Electronics and suitable for automotive camera modules, radar sensor subsystems, and ADAS domain controllers requiring stable component supply, long-term lifecycle support, and AEC-Q100–qualified power management.
Supply support for MC33FS8430G1KS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The FS84 product line delivers ASIL B–compliant system basis chips optimized for radar, vision, and infotainment systems - integrating multi-rail power conversion, fail-safe monitoring, and automotive-grade reliability in compact HVQFN packages.
FAQ
What is the primary application target for MC33FS8430G1KS?
The MC33FS8430G1KS is specifically targeted at camera modules using the NXP S32V MCU and PF8x PMIC. Its OTP configuration delivers 1.8 V for the MCU core (BUCK1), 1.8 V for imaging subsystems (BUCK2), and 3.3 V for sensor I/O or interface logic (BUCK3), all with ASIL B safety compliance and precise power sequencing.
Does MC33FS8430G1KS support both SPI and I²C interfaces?
Yes, MC33FS8430G1KS supports both SPI and I²C interfaces for device configuration and monitoring. The I²C address is fixed at 0x20, and both interfaces implement CRC protection for command integrity. Interface selection is determined by hardware strapping or firmware initialization - no shared pins require multiplexing.
What safety features are enabled in the G1 OTP configuration of MC33FS8430G1KS?
The G1 OTP configuration of MC33FS8430G1KS enables PGOOD and RSTB assertion on fault, infinite deep fail-safe autoretry, ABIST1 coverage for VCOREMON, VDDIOMON, and VMON1–VMON4, and thermal shutdown with DFS escalation. FCCU and ERRMON inputs are disabled, and the watchdog operates in simple mode - aligning with ASIL B system partitioning requirements.
How does MC33FS8430G1KS handle thermal faults across its regulators?
On thermal fault detection, MC33FS8430G1KS shuts down BUCK2 and BUCK3 while asserting deep fail-safe (DFS) - triggering the fail-safe state machine to drive FS0B low and optionally assert RSTB. BUCK1 also shuts down with DFS, and all affected regulators remain off until reset or autoretry cycle completion, ensuring predictable fault containment.
What is the role of the PSYNC pin on MC33FS8430G1KS?
The PSYNC pin on MC33FS8430G1KS is disabled in the G1 OTP configuration. It is reserved for future use in multi-device synchronization (e.g., coordinating two FS85 devices or FS84 with an external PMIC), but no functionality is active in this part variant - leaving it unconnected or pulled to a defined state per board design guidelines.
MC33FS8430G1KS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8430G1KS FAQ
1.How can I place an order for MC33FS8430G1KS through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8430G1KS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8430G1KS reliable?
The price and inventory of MC33FS8430G1KS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8430G1KS is usually 5 days.
3.What payment methods are accepted for MC33FS8430G1KS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8430G1KS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33FS8430G1KS?
MC33FS8430G1KS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8430G1KS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8430G1KS?
For technical support, including MC33FS8430G1KS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8430G1KS requirements.
6.How does Aetrix verify that MC33FS8430G1KS is sourced from the original manufacturer or authorized distributors?
All MC33FS8430G1KS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8430G1KS meets industry standards.
7.What is the process for return or replacement of MC33FS8430G1KS?
All MC33FS8430G1KS units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8430G1KS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8430G1KS part is unused and in its original packaging.
Return procedure for MC33FS8430G1KS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC33FS8430G1KS Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
