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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Power Management - Specialized

NXP Semiconductors MC33FS8430G1KSR2

Name: MC33FS8430G1KSR2
Brand: NXP Semiconductors
SKU: MC33FS8430G1KSR2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MC33FS8430G1KSR2

Manufacturer:: NXP Semiconductors

Category:: Power Management - Specialized

Package:: 56-VFQFN Exposed Pad

Datasheet:: MC33FS8430G1KSR2.pdf

Description:: SAFETY POWER MANAGEMENT IC, QFN5

Quantity:: RFQ Add To RFQ list

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Product details

Overview

MC33FS8430G1KSR2 from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating three synchronous buck converters (BUCK1/2/3), one boost converter, two LDOs, voltage supervision, fail-safe output, and SPI/I²C control. It delivers up to 3.6 A per buck rail, supports 60 V DC input, and targets camera systems with NXP S32V MCU and PF8x PMIC. Its integrated safety features include configurable power-good, reset, interrupt, watchdog, and deep fail-safe autoretry.

For engineers reviewing the MC33FS8430G1KSR2 datasheet, MC33FS8430G1KSR2 pinout, MC33FS8430G1KSR2 application, or MC33FS8430G1KSR2 equivalent, key selection criteria include its triple-buck topology, OTP-configured 1.8 V BUCK1 output, 3.3 V BUCK3 output, 1.8 V LDO1/LDO2 outputs, HVQFN56 package with wettable flanks, and functional safety compliance for ASIL B radar/vision subsystems.

Technical Context

The MC33FS8430G1KSR2 implements a multi-rail power management architecture with independent switching frequency (2.22 MHz) across all three integrated bucks, phase-shifting capability between BUCK1 and BUCK2, and external synchronization via FIN/FOUT pins for EMC optimization. Its fail-safe state machine monitors VCOREMON, VDDIOMON, VMON1–VMON4, and thermal conditions, triggering DFS or controlled shutdown with configurable delay and retry count.

Control is executed via 32-bit SPI or I²C interface with CRC protection; configuration is stored in one-time-programmable (OTP) memory. The device supports power sequencing across eight slots, dynamic voltage scaling (DVS), and external monitoring of MCU error signals (FCCU1/FCCU2) and external IC faults (ERRMON).

Key Specifications

Parameter	Value and Actual Design Meaning
Input Voltage Range	4.9 V to 60 V DC - supports 12 V and 24 V automotive battery rails with reverse-battery diode protection on VSUP1/VSUP2.
BUCK1 Output	1.8 V @ 4.5 A peak - dedicated core supply for NXP S32V MCU with SVS capability and soft-start slope of 7.81 mV/µs.
BUCK2 Output	1.8 V @ 4.5 A peak - enabled, multiphase-capable with BUCK1 to extend current to 7.2 A on single rail.
BUCK3 Output	3.3 V @ 4.5 A peak - enabled, sequenced in Slot 0, with DVS soft-start slope of 10.41 mV/µs.
LDO1 / LDO2	1.8 V / 1.8 V @ 400 mA each - supplies MCU I/Os and ADC reference with independent voltage monitoring and thermal shutdown.
Safety Certification	ASIL B compliant per ISO 26262 - includes fail-safe output (FS0B), PGOOD/RSTB signals, challenger watchdog, ABIST/LBIST, and deep fail-safe autoretry (infinite cycles).
Interface	SPI or I²C (0x20 address) with CRC - enables real-time regulation control, fault reporting, and OTP configuration during engineering mode.
Package	HVQFN56 (8 mm × 8 mm × 0.85 mm), wettable flank (KS variant), MSL3, AEC-Q100 Grade 1 qualified.

Pinout & Package

HVQFN56 plastic thermal enhanced very thin quad flat package with 56 terminals, 0.5 mm pitch, exposed pad (EP) for thermal and ground connection. Wettable flank (KS suffix) supports automated optical inspection (AOI) of solder joints.

Pin	Circuit Role	Design Meaning
1, 49	WAKE1 / WAKE2	Dual wake-up inputs with external series resistor support - enable low-power OFF mode (10 µA IQ) recovery on battery voltage or signal edge.
3, 6, 7, 9	BUCK3_INQ / BUCK3_IN / BUCK3_SW / BUCK3_FB	Quiet input, main input, switching node, and feedback for 3.3 V/4.5 A BUCK3 - supports precise regulation and EMI reduction.
14	FS0B	Active-low open-drain fail-safe output - asserts on critical fault (TSD, OV/UV, watchdog timeout) to trigger system-level safety response.
17, 15–16, 12–13	VCOREMON / VMON1–VMON4	Analog monitoring inputs for MCU core voltage, I/O supply, and up to four external rails - configurable OV/UV thresholds and deglitch times.
18, 19	PGOOD / RSTB	Active-low power-good and reset outputs - require external pull-up to VDDIO; RSTB monitors external reset assertion and internal faults.
25–28	MISO / MOSI / SCLK / CSB	Full-duplex SPI interface - enables register read/write, fault logging, and real-time parameter adjustment without MCU reboot.
31–32, 40	FCCU1 / FCCU2 / ERRMON	Dedicated MCU error monitoring and external IC fault detection inputs - feed into fail-safe state machine for coordinated response.
54–55	LDO2 / LDO1	1.8 V linear regulator outputs - deliver low-noise, low-ripple supply for sensitive analog/ADC circuits with independent current limiting.

Key Features

Feature	Design Value
Triple integrated synchronous bucks	Enables compact, high-efficiency power tree for camera SoCs - BUCK1 (1.8 V/4.5 A), BUCK2 (1.8 V/4.5 A), BUCK3 (3.3 V/4.5 A) with independent 2.22 MHz operation.
Fail-safe state machine with DFS	Provides deterministic response to faults including thermal shutdown, overvoltage, undervoltage, and watchdog timeout - infinite autoretry prevents permanent lockup.
Configurable power sequencing	Eight-slot sequencing engine allows precise start/stop timing across all regulators - critical for S32V-based camera boot integrity and voltage ramp control.
EMC-optimized SMPS control	Includes frequency synchronization (FIN/FOUT), spread spectrum, slew rate control, and manual tuning - reduces radiated emissions in dense ADAS PCB layouts.
OTP programming with engineering mode	Factory-programmed G1 configuration sets BUCK1=1.8 V, BUCK3=3.3 V, LDO1/LDO2=1.8 V, and ASIL B safety level - customer emulation supported pre-production.
Multi-interface communication	SPI (primary) and I²C (0x20) with CRC ensure robust command transmission - supports diagnostics, calibration, and field firmware updates without protocol collision.

Applications

Camera Power Management	Radar Sensor Subsystem
Use Scenario: Powers NXP S32V234 vision processor and companion PF8x PMIC in mono/stereo camera modules. IC Role / Device Role / Timing Role: Primary SBC delivering core (1.8 V), I/O (1.8 V), and interface (3.3 V) rails with synchronized startup and fail-safe monitoring. Use Value: Eliminates discrete buck controllers and safety logic, reducing BOM count by ≥7 components while meeting ASIL B requirements.	Use Scenario: Supplies NXP S32R294 radar MCU and TEF810x RF transceiver in 12 V/24 V corner radar units. IC Role / Device Role / Timing Role: Centralized power manager with BUCK1 for MCU core, BUCK3 for PHY interface, and LDOs for analog front-end biasing. Use Value: Enables single-chip power + safety solution with PSYNC support for dual-FS84 coordination and reduced system-level EMC filtering.
ADAS Domain Controller	Infotainment Head Unit
Use Scenario: Provides regulated supplies to heterogeneous compute clusters (e.g., S32G + S32V) in zonal domain controllers. IC Role / Device Role / Timing Role: Multi-rail SBC with programmable sequencing slots and voltage supervision across six monitored rails (VCOREMON, VMON1–VMON4). Use Value: Simplifies power architecture by consolidating three bucks, two LDOs, boost, and safety logic into one AEC-Q100 Grade 1 component.	Use Scenario: Powers display controller, audio codec, and connectivity SoC in automotive infotainment head units. IC Role / Device Role / Timing Role: High-integration SBC delivering stable 1.8 V, 3.3 V, and 5.0 V-equivalent rails (via BOOST) with low quiescent current in OFF mode. Use Value: Reduces standby power consumption to 10 µA while maintaining fast wake-up (<100 µs) and seamless transition from sleep to full operation.

Camera Power Management

Radar Sensor Subsystem

Use Scenario: Powers NXP S32V234 vision processor and companion PF8x PMIC in mono/stereo camera modules.

IC Role / Device Role / Timing Role: Primary SBC delivering core (1.8 V), I/O (1.8 V), and interface (3.3 V) rails with synchronized startup and fail-safe monitoring.

Use Value: Eliminates discrete buck controllers and safety logic, reducing BOM count by ≥7 components while meeting ASIL B requirements.

Use Scenario: Supplies NXP S32R294 radar MCU and TEF810x RF transceiver in 12 V/24 V corner radar units.

IC Role / Device Role / Timing Role: Centralized power manager with BUCK1 for MCU core, BUCK3 for PHY interface, and LDOs for analog front-end biasing.

Use Value: Enables single-chip power + safety solution with PSYNC support for dual-FS84 coordination and reduced system-level EMC filtering.

ADAS Domain Controller

Infotainment Head Unit

Use Scenario: Provides regulated supplies to heterogeneous compute clusters (e.g., S32G + S32V) in zonal domain controllers.

IC Role / Device Role / Timing Role: Multi-rail SBC with programmable sequencing slots and voltage supervision across six monitored rails (VCOREMON, VMON1–VMON4).

Use Value: Simplifies power architecture by consolidating three bucks, two LDOs, boost, and safety logic into one AEC-Q100 Grade 1 component.

Use Scenario: Powers display controller, audio codec, and connectivity SoC in automotive infotainment head units.

IC Role / Device Role / Timing Role: High-integration SBC delivering stable 1.8 V, 3.3 V, and 5.0 V-equivalent rails (via BOOST) with low quiescent current in OFF mode.

Use Value: Reduces standby power consumption to 10 µA while maintaining fast wake-up (<100 µs) and seamless transition from sleep to full operation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive SBC applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MC33FS8425G0KSR2	Omits BUCK3; retains BUCK1/BUCK2, BOOST, LDO1/LDO2, and ASIL B safety features.	Targeted at dual-rail camera or radar systems where third buck is unnecessary - e.g., S32V with external 3.3 V supply.	Select when BUCK3 is not required to reduce cost and simplify layout; verify sequencing compatibility with existing MCU boot flow.
MC33FS8530A1ESR2	ASIL D–rated superset with identical pinout, triple buck, BOOST, dual LDOs, and extended safety features (FCCU, ERRMON, ABIST).	Required for ASIL D domain controllers or safety-critical radar fusion units where end-to-end fault coverage is mandated.	Choose for higher safety integrity; note that OTP configuration differs (e.g., BUCK1=1.35 V, VBOOST=5.0 V) and requires validation against system voltage map.

Compared with MC33FS8425G0KSR2, MC33FS8430G1KSR2 adds BUCK3 for independent 3.3 V rail generation, enabling tighter voltage control in camera sensor interfaces; compared with MC33FS8530A1ESR2, it provides ASIL B compliance at lower complexity and cost while retaining identical HVQFN56 footprint and SPI/I²C register mapping.

Availability

MC33FS8430G1KSR2 is available at Aetrix Electronics and suitable for automotive camera modules, radar sensor subsystems, and ADAS domain controllers requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle support.

Supply support for MC33FS8430G1KSR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The FS84 product line delivers ASIL B–certified system basis chips for radar, vision, and infotainment systems, integrating multiple SMPS, LDOs, safety monitors, and fail-safe logic to simplify automotive power architecture design.

FAQ

What is the primary function of the MC33FS8430G1KSR2 in automotive systems?

The MC33FS8430G1KSR2 serves as a fail-safe system basis chip that integrates three synchronous buck converters, one boost converter, two LDOs, voltage supervision, and safety monitoring for ASIL B automotive applications. It powers and safeguards vision processors like the NXP S32V in camera modules, providing tightly regulated 1.8 V, 1.8 V, and 3.3 V rails while asserting FS0B on critical faults. Its OTP-configured G1 variant is optimized for camera use cases with NXP S32V and PF8x PMIC.

Does the MC33FS8430G1KSR2 support both SPI and I²C communication interfaces?

Yes, the MC33FS8430G1KSR2 supports both SPI and I²C interfaces for configuration and monitoring. It uses SPI as the primary interface with MISO/MOSI/SCLK/CSB pins and also provides I²C-compatible SCL/SDA pins with fixed address 0x20. Both interfaces include CRC protection for data integrity. The choice between them depends on system architecture - SPI offers higher bandwidth for register access and fault logging, while I²C simplifies integration in mixed-vendor designs where I²C is already dominant.

What safety certifications and features does the MC33FS8430G1KSR2 provide?

The MC33FS8430G1KSR2 is ASIL B–compliant per ISO 26262 and qualified to AEC-Q100 Grade 1. It includes a dedicated fail-safe state machine with deep fail-safe (DFS) autoretry, active-low FS0B output, PGOOD/RSTB signals, challenger watchdog, ABIST/LBIST, and monitoring of VCOREMON, VDDIOMON, and four external voltage rails (VMON1–VMON4). Its OTP-programmed G1 configuration enables infinite DFS retry cycles and configurable OV/UV thresholds with deglitch timers, ensuring deterministic response to faults without MCU intervention.

How does the MC33FS8430G1KSR2 manage power sequencing for multi-rail systems?

The MC33FS8430G1KSR2 implements an eight-slot power sequencing engine that assigns each regulator (BUCK1/2/3, LDO1/2, BOOST) to a specific start/stop slot. For example, BUCK1 starts in Slot 6, BUCK3 in Slot 0, and LDO1 in Slot 5 - enabling precise voltage ramp timing critical for S32V boot integrity. Sequencing is fully configurable via OTP or runtime SPI commands, supporting dynamic reconfiguration during development. This eliminates external sequencing ICs and ensures reliable power-up/down order across complex SoC-based camera systems.

What is the significance of the 'G1' in MC33FS8430G1KSR2 and how does it affect configuration?

The 'G1' suffix denotes a factory-programmed OTP configuration optimized for camera applications with NXP S32V MCU and PF8x PMIC. It sets BUCK1 to 1.8 V (4.5 A), BUCK2 to 1.8 V (4.5 A), BUCK3 to 3.3 V (4.5 A), LDO1/LDO2 to 1.8 V (400 mA), VBOOST to 5.0 V, and enables ASIL B safety features including infinite DFS retry. Unlike unprogrammed G0 variants, G1 requires no field OTP programming - configuration is locked at manufacture, ensuring consistency across production batches and eliminating risk of misconfiguration during assembly.

MC33FS8430G1KSR2 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 56-VFQFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Applications:: System Basis Chip

Current - Supply:: 15mA

Voltage - Supply:: 60V

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount, Wettable Flank

Supplier Device Package:: 56-HVQFN (8x8)

MC33FS8430G1KSR2 FAQ

1.How can I place an order for MC33FS8430G1KSR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for MC33FS8430G1KSR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC33FS8430G1KSR2 reliable?

The price and inventory of MC33FS8430G1KSR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8430G1KSR2 is usually 5 days.

3.What payment methods are accepted for MC33FS8430G1KSR2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8430G1KSR2 transactions.

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4.How is shipping managed for MC33FS8430G1KSR2?

MC33FS8430G1KSR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC33FS8430G1KSR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC33FS8430G1KSR2?

For technical support, including MC33FS8430G1KSR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8430G1KSR2 requirements.

6.How does Aetrix verify that MC33FS8430G1KSR2 is sourced from the original manufacturer or authorized distributors?

All MC33FS8430G1KSR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8430G1KSR2 meets industry standards.

7.What is the process for return or replacement of MC33FS8430G1KSR2?

All MC33FS8430G1KSR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8430G1KSR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC33FS8430G1KSR2 part is unused and in its original packaging.

Return procedure for MC33FS8430G1KSR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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