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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Power Management - Specialized

NXP Semiconductors MC33FS8430G2KS

Name: MC33FS8430G2KS
Brand: NXP Semiconductors
SKU: MC33FS8430G2KS
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MC33FS8430G2KS

Manufacturer:: NXP Semiconductors

Category:: Power Management - Specialized

Package:: 56-VFQFN Exposed Pad

Datasheet:: MC33FS8430G2KS.pdf

Description:: SAFETY POWER MANAGEMENT IC, QFN5

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Product details

Overview

MC33FS8430G2KS from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating three synchronous buck converters (BUCK1/2/3), one boost converter, two LDOs, voltage supervision, fail-safe output, and SPI/I²C control. It delivers 1.8 V @ 4.5 A (BUCK1), 1.8 V @ 4.5 A (BUCK2), 3.3 V @ 4.5 A (BUCK3), 5.0 V @ 400 mA (LDO1), and 3.3 V @ 400 mA (LDO2), targeting camera power systems with NXP S32V MCUs.

For engineers reviewing the MC33FS8430G2KS datasheet, MC33FS8430G2KS pinout, MC33FS8430G2KS application, or MC33FS8430G2KS equivalent, key selection criteria include its triple-buck architecture with multi-phase capability, ASIL B safety certification per ISO 26262, AEC-Q100 Grade 1 qualification, 60 V input tolerance, and integrated fail-safe state machine for radar/vision domain controllers.

Technical Context

The MC33FS8430G2KS implements a deterministic fail-safe state machine with dedicated monitoring circuitry, challenger watchdog, PGOOD/RSTB outputs, and configurable fault recovery (infinite autoretry). Its power management includes independent sequencing slots for all regulators (BUCK1 in Slot 6, BUCK2 in Slot 2, BUCK3 in Slot 0, LDO1 in Slot 5, LDO2 in Slot 2), enabling precise startup/shutdown timing for S32V-based camera modules.

It supports external frequency synchronization (FIN/FOUT), spread-spectrum modulation, slew-rate control, and EMC-optimized switching at fixed 2.22 MHz for BUCK1/2/3 and BOOST. The device uses OTP-programmed configurations-this variant features VPRE = 5.0 V, BUCK1 = 1.8 V, BUCK2 = 1.8 V, BUCK3 = 3.3 V, LDO1 = 1.8 V, LDO2 = 3.3 V, and I²C address 0x20.

Key Specifications

Parameter	Value and Actual Design Meaning
Input Voltage Range	4.9 V to 60 V - supports 12 V/24 V automotive battery rails with reverse-battery protection diodes on VSUP1/VSUP2.
BUCK1 Output	1.8 V @ 4.5 A peak - dedicated MCU core supply with SVS, soft-start slope 7.81 mV/µs, and TSD shutdown + DFS response.
BUCK2 Output	1.8 V @ 4.5 A peak - enabled, sequenced in Slot 2, supports multiphase operation with BUCK1 for up to 7.2 A on single rail.
BUCK3 Output	3.3 V @ 4.5 A peak - enabled, sequenced in Slot 0, used for image sensor or interface IC supply.
LDO Outputs	LDO1: 1.8 V @ 400 mA; LDO2: 3.3 V @ 400 mA - low-noise supplies for MCU I/Os and ADC reference, both sequenced in Slot 2.
Safety Certification	ASIL B compliant per ISO 26262, AEC-Q100 Grade 1 qualified (−40 °C to +125 °C), MSL3 moisture sensitivity level.
Interface	I²C (address 0x20) and SPI - CRC-protected communication with configurable timeout, used for OTP configuration, real-time monitoring, and fault reporting.

Pinout & Package

MC33FS8430G2KS is housed in a HVQFN56 package (8 mm × 8 mm × 0.85 mm, 0.5 mm pitch, wettable flank), thermally enhanced with exposed pad (EP) connected to GNDFS/GND. Pin count and function mapping match the FS8430 superset configuration.

Pin/Terminal	Circuit Role	Design Meaning
BUCK1_IN (36)	Power Input	Low-voltage input for BUCK1 regulator; connects to intermediate rail or local bulk capacitor.
BUCK1_SW (37)	Switch Node	High-frequency switching node for BUCK1; requires careful layout to minimize EMI and ringing.
BUCK1_FB (39)	Feedback Input	Resistive divider input for closed-loop regulation of BUCK1 output voltage (1.8 V).
BUCK2_IN (35)	Power Input	Input for BUCK2; shares same rail as BUCK1_IN in typical camera designs.
BUCK2_SW (34)	Switch Node	Switching node for BUCK2; supports phase-shifted operation with BUCK1 for current sharing.
BUCK3_IN (6)	Power Input	Input for BUCK3; routed separately to avoid coupling with core rails.
BUCK3_SW (7)	Switch Node	Switch node for 3.3 V BUCK3; connects to output filter inductor and capacitor network.
LDO1 (55), LDO2 (54)	Regulated Outputs	Stable 1.8 V and 3.3 V outputs for noise-sensitive peripherals; each rated 400 mA DC.
VCOREMON (17)	Monitoring Input	Direct connection to BUCK1 output for core voltage supervision and SVS functionality.
PGOOD (18), RSTB (19)	Status Outputs	Active-low open-drain signals indicating valid power and asserting MCU reset during fault conditions.
FOUT (24), FIN (20)	Sync Interface	Enables synchronized switching across multiple MC33FS8430G2KS or with external PMICs to reduce system-level EMI.
INTB (33), FS0B (14)	Fault Outputs	Interrupt assertion and fail-safe output activation upon detected faults (TSD, OV/UV, watchdog timeout).
SCL (10), SDA (11)	I²C Interface	Standard two-wire bus (0x20 address) for configuration, telemetry, and safety status readback.
WAKE1 (49), WAKE2 (1)	Wake Inputs	Configurable wake-up sources with external series resistors; support low-power OFF mode (10 µA quiescent current).

Key Features

Feature	Design Value
Triple Synchronous Buck Regulators	Independent 2.22 MHz switching with programmable soft-start, phase-shifting, and thermal shutdown + DFS behavior per rail.
Fail-Safe State Machine	Dedicated hardware FSM with infinite autoretry, configurable PGOOD/RSTB/FS0B assertion, and ABIST/LBIST self-test coverage.
ASIL B Safety Architecture	Includes challenger watchdog, dual FCCU inputs (FCCU1/FCCU2), ERRMON, VMON1–VMON4 supervision, and ISO 26262-compliant diagnostics.
EMC Optimization	Integrated spread spectrum, slew rate control, manual frequency tuning, and FSYNC I/O for synchronized multi-device operation.
OTP-Programmed Configuration	Factory-programmed settings for VPRE=5.0 V, BUCK1=1.8 V, BUCK2=1.8 V, BUCK3=3.3 V, LDO1=1.8 V, LDO2=3.3 V, and I²C address 0x20.
Camera-Optimized Sequencing	Predefined power-up sequence (Slot 6 → Slot 2 → Slot 0 → Slot 5 → Slot 2) aligns with S32V MCU boot requirements and sensor initialization timing.

Applications

Automotive Camera Power System	Radar Sensor Power Management
Use Scenario: Powers NXP S32V MCU, image sensor, ISP, and interface ICs in front/rear/surround-view camera modules. IC Role / Device Role / Timing Role: Primary SBC providing regulated core (1.8 V), I/O (3.3 V), and sensor (3.3 V) rails with synchronized startup and fail-safe monitoring. Use Value: Eliminates discrete power components, reduces board area by >40%, and ensures ASIL B compliance for ISO 26262 camera domain controllers.	Use Scenario: Supplies NXP S32R274/S32R294 radar processors, RF transceivers (TEF810x), and signal conditioning circuits. IC Role / Device Role / Timing Role: Integrated power hub delivering VPRE (5.0 V), BUCK1 (1.3–1.8 V), BUCK3 (3.3 V), and LDOs with precise sequencing for RF stability. Use Value: Enables single-chip radar power solution with <±1% output accuracy, <10 µs fault response, and built-in voltage supervision for critical RF bias rails.
ADAS Domain Controller Supply	Infotainment Head Unit Power
Use Scenario: Powers heterogeneous compute platforms (e.g., S32G + companion MCUs) in centralized ADAS domain controllers. IC Role / Device Role / Timing Role: Multi-rail SBC managing core, memory, I/O, and peripheral supplies with slot-based sequencing and inter-rail dependency handling. Use Value: Supports dynamic voltage scaling (DVS) across rails, reduces thermal hotspots via phase-shifted buck operation, and simplifies safety case documentation.	Use Scenario: Delivers clean, sequenced power to application processors, display drivers, audio codecs, and connectivity modules in automotive head units. IC Role / Device Role / Timing Role: Centralized power manager with fail-safe output for system-level reset coordination and brown-out detection across multiple voltage domains. Use Value: Provides robust 60 V transient protection, <10 µA OFF-mode current, and diagnostic logging via SPI/I²C to meet OEM infotainment reliability KPIs.

Automotive Camera Power System

Radar Sensor Power Management

Use Scenario: Powers NXP S32V MCU, image sensor, ISP, and interface ICs in front/rear/surround-view camera modules.

IC Role / Device Role / Timing Role: Primary SBC providing regulated core (1.8 V), I/O (3.3 V), and sensor (3.3 V) rails with synchronized startup and fail-safe monitoring.

Use Value: Eliminates discrete power components, reduces board area by >40%, and ensures ASIL B compliance for ISO 26262 camera domain controllers.

Use Scenario: Supplies NXP S32R274/S32R294 radar processors, RF transceivers (TEF810x), and signal conditioning circuits.

IC Role / Device Role / Timing Role: Integrated power hub delivering VPRE (5.0 V), BUCK1 (1.3–1.8 V), BUCK3 (3.3 V), and LDOs with precise sequencing for RF stability.

Use Value: Enables single-chip radar power solution with <±1% output accuracy, <10 µs fault response, and built-in voltage supervision for critical RF bias rails.

ADAS Domain Controller Supply

Infotainment Head Unit Power

Use Scenario: Powers heterogeneous compute platforms (e.g., S32G + companion MCUs) in centralized ADAS domain controllers.

IC Role / Device Role / Timing Role: Multi-rail SBC managing core, memory, I/O, and peripheral supplies with slot-based sequencing and inter-rail dependency handling.

Use Value: Supports dynamic voltage scaling (DVS) across rails, reduces thermal hotspots via phase-shifted buck operation, and simplifies safety case documentation.

Use Scenario: Delivers clean, sequenced power to application processors, display drivers, audio codecs, and connectivity modules in automotive head units.

IC Role / Device Role / Timing Role: Centralized power manager with fail-safe output for system-level reset coordination and brown-out detection across multiple voltage domains.

Use Value: Provides robust 60 V transient protection, <10 µA OFF-mode current, and diagnostic logging via SPI/I²C to meet OEM infotainment reliability KPIs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive SBC applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MC33FS8430G1KS	Same FS8430 base; differs in OTP: BUCK1 = 1.8 V, BUCK2 = 1.8 V, BUCK3 = 3.3 V, but LDO1 = 1.8 V, LDO2 = 3.3 V, VPRE = 4.1 V, and I²C address 0x20 - identical pinout and sequencing.	Targeted for camera systems with NXP S32V + PF8x PMIC; shares same application scope but optimized for hybrid PMIC+SBC architectures.	Select G1KS when interfacing with external PF8x for auxiliary rails; G2KS is preferred for fully integrated camera power without secondary PMIC.
MC33FS8530A0ES	FS8530 superset variant; ASIL D certified, adds FCCU, ERRMON, and enhanced ABIST coverage; same HVQFN56 package and pin-compatible with FS8430 family.	Required for ASIL D domain controllers (e.g., zonal ECUs); supports higher safety integrity with dual-channel monitoring and extended diagnostic coverage.	Choose A0ES only when full ASIL D decomposition is mandated; G2KS remains optimal for ASIL B camera nodes where cost, footprint, and qualification scope are prioritized.

Compared with MC33FS8430G1KS, the MC33FS8430G2KS offers identical regulator configuration and sequencing but targets standalone camera systems without companion PMICs; versus MC33FS8530A0ES, it provides ASIL B compliance at lower complexity and cost while retaining full pin and software compatibility for scalable platform design.

Availability

MC33FS8430G2KS is available at Aetrix Electronics and suitable for automotive camera modules, radar sensor subsystems, and ADAS domain controllers requiring stable component supply, long-term lifecycle support, and AEC-Q100–qualified power management ICs.

Supply support for MC33FS8430G2KS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and power management ICs.

The FS84 product line delivers ASIL B–certified system basis chips for radar, vision, and infotainment domains, designed to consolidate power, safety, and communication functions into a single automotive-grade IC for simplified ECU architecture.

FAQ

What is the primary safety certification level of the MC33FS8430G2KS?

The MC33FS8430G2KS is ASIL B–capable and developed in compliance with ISO 26262 for automotive functional safety. It is qualified per AEC-Q100 Grade 1 (−40 °C to +125 °C ambient), includes built-in self-test (ABIST/LBIST), challenger watchdog, and failsafe output (FS0B) for use in camera and radar subsystems requiring ASIL B decomposition.

Does the MC33FS8430G2KS support multi-phase operation between its buck regulators?

Yes, the MC33FS8430G2KS supports multi-phase operation between BUCK1 and BUCK2 to extend current capability up to 7.2 A peak on a single rail. This is enabled via configurable phase-shifting delay (0–7 steps) and synchronized PWM control, allowing interleaved switching that reduces input/output ripple and improves thermal distribution in high-current camera core supply applications.

What are the configured output voltages and current capabilities for each regulator in the MC33FS8430G2KS?

The MC33FS8430G2KS is OTP-programmed with BUCK1 = 1.8 V @ 4.5 A peak, BUCK2 = 1.8 V @ 4.5 A peak, BUCK3 = 3.3 V @ 4.5 A peak, LDO1 = 1.8 V @ 400 mA, and LDO2 = 3.3 V @ 400 mA. All buck regulators operate at 2.22 MHz with soft-start slope 7.81 mV/µs (BUCK1/2) or 10.41 mV/µs (BUCK3), and feature independent thermal shutdown with DFS response.

How does the MC33FS8430G2KS handle power sequencing for automotive camera systems?

The MC33FS8430G2KS implements slot-based power sequencing: BUCK1 starts/stops in Slot 6, BUCK2 in Slot 2, BUCK3 in Slot 0, LDO1 in Slot 5, and LDO2 in Slot 2. This preconfigured sequence aligns with NXP S32V MCU boot timing and image sensor initialization requirements, ensuring stable core voltage before I/O and sensor rails are enabled - critical for deterministic camera startup.

Can the MC33FS8430G2KS be synchronized with other power devices to reduce system EMI?

Yes, the MC33FS8430G2KS supports external frequency synchronization via FIN (input) and FOUT (output) pins, enabling synchronized switching across multiple MC33FS8430G2KS devices or with external PMICs. It also includes spread-spectrum modulation and slew-rate control to further suppress conducted and radiated emissions - essential for meeting CISPR 25 Class 5 automotive EMC requirements.

MC33FS8430G2KS Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 56-VFQFN Exposed Pad

Packaging:: Tray

Product Status:: Active

Applications:: System Basis Chip

Current - Supply:: 15mA

Voltage - Supply:: 60V

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount, Wettable Flank

Supplier Device Package:: 56-HVQFN (8x8)

MC33FS8430G2KS FAQ

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6.How does Aetrix verify that MC33FS8430G2KS is sourced from the original manufacturer or authorized distributors?

All MC33FS8430G2KS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8430G2KS meets industry standards.

7.What is the process for return or replacement of MC33FS8430G2KS?

All MC33FS8430G2KS units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8430G2KS, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC33FS8430G2KS part is unused and in its original packaging.

Return procedure for MC33FS8430G2KS:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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