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NXP Semiconductors MC33FS8430G2KSR2
- Part No.:
- MC33FS8430G2KSR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8430G2KSR2.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:3,105
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Product details
Overview
MC33FS8430G2KSR2 from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating three synchronous buck converters (BUCK1/2/3), one boost converter, two LDOs, and comprehensive safety monitoring. It delivers 1.1 V @ 4.5 A (BUCK1), 1.8 V @ 4.5 A (BUCK2), 3.3 V @ 4.5 A (BUCK3), 5.0 V @ 1.5 A (BOOST), and dual 400 mA LDOs - all with configurable sequencing, soft-start, and thermal shutdown response. It targets camera modules with NXP S32V MCUs.
For engineers reviewing the MC33FS8430G2KSR2 datasheet, MC33FS8430G2KSR2 pinout, MC33FS8430G2KSR2 application, or MC33FS8430G2KSR2 equivalent, this device requires attention to its HVQFN56 package, SPI/I²C configuration interface, fail-safe output (FS0B), power-good/reset signaling, and voltage supervision inputs (VCOREMON, VMON1–VMON4) for functional safety compliance in vision-based ADAS systems.
Technical Context
The MC33FS8430G2KSR2 implements a deterministic fail-safe state machine with dedicated watchdog (Simple WD), built-in self-test (ABIST/LBIST), and independent voltage supervision per rail (VCOREMON, VDDIOMON, VMON1–VMON4). Its safety architecture supports ISO 26262 ASIL B partitioning via configurable fault detection latency (UV_DGLT/ OV_DGLT), deep fail-safe autoretry (x15), and fail-safe output driver (FS0B) tied to internal error conditions.
Power management includes external frequency synchronization (FIN/FOUT), spread-spectrum modulation, slew-rate control, and multi-phase capability between BUCK1 and BUCK2 (up to 7.2 A peak on single rail). All regulators operate at 2.22 MHz switching frequency except VPRE controller (455 kHz), enabling compact magnetics and optimized EMC performance in radar/vision ECU designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 60 V DC max - supports 12 V and 24 V automotive battery rails with reverse-battery protection diodes required on VSUP1/VSUP2. |
| BUCK1 Output | 1.1 V @ 4.5 A peak - MCU core supply with SVS capability and slot-6 power sequencing for S32V processors. |
| BUCK2 Output | 1.8 V @ 4.5 A peak - dedicated IO supply; multiphase-capable with BUCK1 to extend current to 7.2 A on shared rail. |
| BUCK3 Output | 3.3 V @ 4.5 A peak - configured for camera sensor or PHY interface supply with slot-0 start/stop sequencing. |
| BOOST Output | 5.0 V @ 1.5 A peak - supplies external CAN transceivers or analog front-ends; enabled by OTP configuration. |
| LDO1/LDO2 | 1.8 V / 3.3 V @ 400 mA each - low-noise supplies for MCU I/Os and ADC reference; independently monitored and sequenced. |
| Safety Certification | ISO 26262 ASIL B compliant; AEC-Q100 Grade 1 qualified; includes fail-safe output, PGOOD/RSTB, and integrated monitoring circuits. |
Pinout & Package
HVQFN56 package: plastic thermal-enhanced very thin quad flat package, 8 mm × 8 mm × 0.85 mm body, 0.5 mm pitch, wettable flank (KS suffix), exposed pad (EP) for thermal and GND connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BUCK1_FB | Voltage feedback input | Closes regulation loop for BUCK1; connects to resistor divider on 1.1 V output for precision setting and monitoring. |
| VCOREMON | Core voltage monitor input | Directly connected to BUCK1 output to enable SVS (supply voltage supervisor) functionality for MCU core domain. |
| FS0B | Fail-safe output | Active-low open-drain signal asserting system-level fault condition; drives external safety-critical logic or MCU interrupt. |
| PGOOD | Power-good indicator | Active-low output confirming all regulated outputs are within tolerance; requires external pull-up to VDDIO. |
| RSTB | Reset output | Active-low reset signal for MCU; monitors external reset sources and internal faults to initiate safe restart sequence. |
| INTB | Interrupt output | Active-low general-purpose interrupt indicating regulator faults, watchdog timeout, or safety events; configurable via SPI/I²C. |
| SCL/SDA | I²C interface | Standard bidirectional I²C bus (address 0x20) for configuration, telemetry, and real-time status readback. |
| MOSI/MISO/SCLK/CSB | SPI interface | 4-wire SPI (mode 0, CPOL=0, CPHA=0) supporting CRC-8 for robust register access and firmware updates. |
Key Features
| Feature | Design Value |
|---|---|
| Triple synchronous buck + boost + dual LDO | Enables full power tree integration for camera ECUs - eliminating discrete PMICs and reducing BOM count by ≥4 ICs. |
| Configurable power sequencing (slots 0–6) | Allows precise startup/shutdown timing across 7 rails to meet S32V MCU boot requirements and avoid latch-up during brown-out. |
| Fail-safe state machine with x15 autoretry | Provides deterministic recovery behavior after fault detection - critical for vision systems requiring graceful degradation rather than hard shutdown. |
| EMC optimization suite | Includes frequency synchronization (FIN/FOUT), spread spectrum, and slew-rate control - reduces peak radiated emissions by >10 dBµV/m in 150 kHz–108 MHz band. |
| OTP-programmable safety parameters | Enables project-specific UV/OV thresholds, delay times, and monitoring enablement without hardware change - accelerating functional safety validation. |
Applications
| Camera Module Power Management | Radar Sensor Power Subsystem |
|---|---|
Use Scenario: Powering NXP S32V-based mono/stereo camera modules with image signal processor, MIPI interface, and ISP peripherals. IC Role / Device Role / Timing Role: Central SBC providing core (1.1 V), IO (1.8 V), sensor bias (3.3 V), and CAN PHY (5.0 V) rails with synchronized startup and fault containment. Use Value: Eliminates need for external sequencers and discrete supervisors; enables ASIL B-compliant vision ECU with single-chip power + safety integration. | Use Scenario: Supplying NXP S32R274/S32R294 radar SoCs with RF front-end, DSP, and CAN FD communication interfaces. IC Role / Device Role / Timing Role: Fail-safe power manager delivering VPRE-controlled 5.0 V, BUCK1 core (1.1 V), BUCK3 analog (3.3 V), and BOOST for TEF810x transceivers. Use Value: Meets stringent radar EMC requirements via FIN/FOUT sync and spread spectrum; supports functional safety decomposition with FCCU monitoring inputs. |
| ADAS Domain Controller Power Hub | Infotainment Head Unit Power System |
Use Scenario: Consolidating power delivery for multi-core domain controllers integrating perception, planning, and vehicle control functions. IC Role / Device Role / Timing Role: Primary SBC supplying multiple voltage domains (core, memory, IO, PHY) with independent supervision and fail-safe coordination. Use Value: Reduces inter-IC communication overhead vs. distributed regulators; enables centralized safety state reporting via FS0B and INTB signals. | Use Scenario: Powering infotainment head units with display drivers, audio codecs, Bluetooth/WiFi modules, and touch controllers. IC Role / Device Role / Timing Role: High-integration SBC delivering low-noise LDOs for analog blocks and efficient SMPS for digital subsystems with thermal derating. Use Value: Supports extended temperature operation (−40 °C to +125 °C ambient) and meets AEC-Q100 Grade 1 reliability for 15-year automotive lifecycle. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8430G1ES | Different OTP configuration: BUCK1 = 1.8 V (vs. 1.1 V), BUCK3 = 3.3 V, LDO1 = 1.8 V, LDO2 = 3.3 V; same HVQFN56 package and pinout. | Targeted for camera modules with different MCU core voltage requirements (e.g., non-S32V platforms). | Select G1ES when 1.8 V core supply is needed instead of 1.1 V; otherwise G2KSR2 is optimal for S32V-based vision systems. |
| MC33FS8530A0ES | ASIL D–rated variant with enhanced FCCU monitoring, additional VMON inputs, and deeper fail-safe diagnostics; identical regulator topology and 2.22 MHz switching frequency. | Required for domain controllers or radar systems demanding full ASIL D decomposition and challenger watchdog support. | Choose A0ES only if ASIL D compliance is mandated; G2KSR2 satisfies ASIL B requirements with lower cost and simpler safety validation. |
Compared with MC33FS8430G1ES, MC33FS8430G2KSR2 provides tighter core voltage matching for S32V MCUs and optimized sequencing slots, while versus MC33FS8530A0ES it trades ASIL D diagnostics for reduced complexity and cost in ASIL B–constrained vision applications.
Availability
MC33FS8430G2KSR2 is available at Aetrix Electronics and suitable for automotive camera modules, radar sensor subsystems, and ADAS domain controllers requiring stable component supply, long-term lifecycle support, and AEC-Q100–qualified power management.
Supply support for MC33FS8430G2KSR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and automotive-grade power management.
The FS84 product line delivers ASIL B–compliant system basis chips targeting vision, radar, and infotainment ECUs - designed to consolidate power, safety, and communication functions into a single scalable IC for next-generation ADAS platforms.
FAQ
What is the primary application target for the MC33FS8430G2KSR2?
The MC33FS8430G2KSR2 is specifically configured for camera modules using NXP S32V MCUs. Its OTP settings deliver 1.1 V @ 4.5 A (BUCK1) for the S32V core, 1.8 V @ 4.5 A (BUCK2) for I/O, 3.3 V @ 4.5 A (BUCK3) for sensors, and 5.0 V BOOST for PHY interfaces - all with sequencing aligned to S32V boot requirements. This makes MC33FS8430G2KSR2 ideal for mono/stereo/night-vision camera ECUs needing ASIL B compliance.
Does the MC33FS8430G2KSR2 support both SPI and I²C interfaces?
Yes, the MC33FS8430G2KSR2 supports both SPI and I²C for configuration and telemetry. It uses standard 4-wire SPI (MOSI/MISO/SCLK/CSB) with CRC-8 for robust register access, and a separate I²C interface (SCL/SDA) with fixed address 0x20. Both interfaces allow real-time monitoring of rail voltages, temperature, fault status, and safety flags - enabling flexible integration with host MCUs regardless of preferred serial protocol.
What safety features does the MC33FS8430G2KSR2 include for ASIL B compliance?
The MC33FS8430G2KSR2 includes dedicated ASIL B safety features: a deterministic fail-safe state machine, Simple Watchdog, ABIST/LBIST self-tests, independent voltage supervision on VCOREMON, VDDIOMON, and VMON1–VMON4 inputs, programmable UV/OV thresholds with configurable delay times (UV_DGLT/OV_DGLT), and fail-safe output (FS0B). These features are validated per ISO 26262 and supported by AEC-Q100 Grade 1 qualification - making MC33FS8430G2KSR2 suitable for ASIL B–decomposed vision systems.
How is power sequencing controlled on the MC33FS8430G2KSR2?
Power sequencing on the MC33FS8430G2KSR2 is controlled via OTP-programmable slots (0–6), assigning each regulator to a specific startup/shutdown order. For MC33FS8430G2KSR2: BUCK1 starts/stops in Slot 6, BUCK2 in Slot 0, BUCK3 in Slot 0, LDO1 in Slot 4, and LDO2 in Slot 2. This ensures correct voltage ramping for S32V MCUs - e.g., delaying core (BUCK1) until IO (BUCK2) and sensor (BUCK3) rails are stable - preventing initialization faults and ensuring reliable boot.
What package type and thermal characteristics does the MC33FS8430G2KSR2 use?
The MC33FS8430G2KSR2 uses the HVQFN56 package: 8 mm × 8 mm × 0.85 mm body, 0.5 mm pitch, with wettable flank (KS suffix) and exposed thermal pad (EP). The EP connects BUCK1/BUCK2/BUCK3 low-side grounds and must be soldered to a large PCB copper pour for thermal dissipation. This package supports junction temperatures up to +150 °C and meets AEC-Q100 Grade 1 requirements (−40 °C to +125 °C ambient), making MC33FS8430G2KSR2 suitable for under-hood and dashboard-mounted camera ECUs.
MC33FS8430G2KSR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8430G2KSR2 FAQ
1.How can I place an order for MC33FS8430G2KSR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8430G2KSR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8430G2KSR2 reliable?
The price and inventory of MC33FS8430G2KSR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8430G2KSR2 is usually 5 days.
3.What payment methods are accepted for MC33FS8430G2KSR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8430G2KSR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33FS8430G2KSR2?
MC33FS8430G2KSR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8430G2KSR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8430G2KSR2?
For technical support, including MC33FS8430G2KSR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8430G2KSR2 requirements.
6.How does Aetrix verify that MC33FS8430G2KSR2 is sourced from the original manufacturer or authorized distributors?
All MC33FS8430G2KSR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8430G2KSR2 meets industry standards.
7.What is the process for return or replacement of MC33FS8430G2KSR2?
All MC33FS8430G2KSR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8430G2KSR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8430G2KSR2 part is unused and in its original packaging.
Return procedure for MC33FS8430G2KSR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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