NXP Semiconductors MC33FS8430G4KS
- Part No.:
- MC33FS8430G4KS
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8430G4KS.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC33FS8430G4KS from NXP Semiconductors is an ASIL B–capable automotive power management IC for radar, vision, and ADAS domain controllers. It integrates a 60 V input VPRE buck controller (up to 10 A peak), dual low-voltage synchronous buck converters (BUCK1/BUCK2 at 1.03125 V/3.6 A peak each), BOOST (4.1 V/1.5 A), two LDOs (3.3 V/400 mA and 5.0 V/150 mA), and failsafe monitoring with SPI/I²C interface.
For engineers reviewing the MC33FS8430G4KS datasheet, MC33FS8430G4KS pinout, MC33FS8430G4KS application, or MC33FS8430G4KS equivalent, key selection criteria include OTP-configured rail voltages (1.03125 V, 1.35 V, 3.3 V, 4.1 V, 5.0 V, 5.74 V), 2.22 MHz switching frequency across BUCK1/BUCK2/BUCK3, HVQFN56 thermal package, and fail-safe output behavior per ISO 26262 ASIL B compliance.
Technical Context
The MC33FS8430G4KS implements a multi-rail power architecture with hardware-configurable sequencing slots (e.g., BUCK1/BUCK2 start in Slot 4, LDO1 in Slot 6) and dedicated safety monitors for VCOREMON, VDDIOMON, VMON1, and VMON2. Its fail-safe logic asserts RSTB at 3.2 V or 4.9 V depending on VPRE level and supports deep fail-safe (DFS) shutdown with autoretry disabled.
OTP programming defines fixed functional parameters: VBOOST enabled at 4.1 V, BUCK3 output at 1.35 V with 2.6 A current limit and 1 µH inductor, and PSYNC disabled. All SMPS use slope compensation (65 GM), slew rate control (125 mV/µs high-side, 100 mV/µs low-side), and soft-start ramp (7.81 mV/µs for BUCK1/BUCK2).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 60 V DC max - supports 12 V and 24 V automotive battery rails with transient tolerance. |
| VPRE Buck Controller | Configurable output up to 10 A peak - drives external MOSFETs for high-current pre-regulation before integrated bucks. |
| BUCK1 Output | 1.03125 V / 3.6 A peak - dedicated MCU core supply with SVS capability and multiphase support with BUCK2. |
| BUCK2 Output | 1.03125 V / 3.6 A peak - synchronized with BUCK1 for 7.2 A peak combined current on single rail. |
| BOOST Output | 4.1 V / 1.5 A peak - integrated low-side switch enables compact camera sensor or RF bias supply. |
| LDO1/LDO2 | 3.3 V @ 400 mA / 5.0 V @ 150 mA - supplies MCU I/O and ADC reference with independent sequencing and DFS shutdown. |
| Fail-Safe Output | RSTB asserted at 3.2 V or 4.9 V - provides system reset aligned with VPRE voltage threshold per OTP configuration. |
Pinout & Package
HVQFN56 (SOT684-23) package: 8 mm × 8 mm × 0.85 mm body, 0.5 mm pitch, thermally enhanced wettable flanks for automated optical inspection and solder joint reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | Main power input | Accepts 60 V DC max; feeds internal regulators and VPRE controller. |
| VPRE_OUT | VPRE buck controller output | Drives external high-side/lower-side MOSFETs; not internally regulated. |
| BUCK1_OUT | Core supply output | Delivers 1.03125 V to MCU core with SVS monitoring and multiphase capability. |
| BUCK2_OUT | Secondary buck output | 1.03125 V rail synchronized with BUCK1; extends current capacity to 7.2 A peak when combined. |
| BOOST_OUT | Boost converter output | 4.1 V supply for sensors or RF front-end; uses integrated low-side switch. |
| LDO1_OUT | IO supply output | 3.3 V @ 400 mA for MCU I/O banks; sequenced in Slot 6 with DFS shutdown on fault. |
| LDO2_OUT | ADC/PHY supply | 5.0 V @ 150 mA for analog peripherals; independent monitoring and sequencing. |
| RSTB | Failsafe reset output | Open-drain active-low reset signal asserted at 3.2 V or 4.9 V depending on VPRE level. |
| PSYNC | Power synchronization input | Disabled per OTP; used to synchronize switching frequency across multiple PMICs when enabled. |
| SPI_SCLK / SPI_MOSI / SPI_MISO / SPI_CS | Digital interface | 32-bit SPI with CRC for configuration, monitoring, and fault reporting; I²C also supported. |
Key Features
| Feature | Design Value |
|---|---|
| ASIL B functional safety compliance | Meets ISO 26262 requirements with built-in self-test (ABIST/LBIST), dedicated monitoring circuits, and fail-safe output behavior. |
| OTP-configured power-up sequencing | Fixed slot-based startup order (e.g., BUCK1/BUCK2 in Slot 4, LDO1 in Slot 6) eliminates external timing components and ensures repeatable boot behavior. |
| EMC-optimized switching | 2.22 MHz fixed frequency + slew rate control (125/100 mV/µs) + spread spectrum reduces radiated emissions in radar/vision ECU designs. |
| Multi-phase BUCK1+BUCK2 operation | Enables 7.2 A peak current on single 1.03125 V rail for high-performance ADAS processors without external phase interleaving circuitry. |
| Deep Fail-Safe (DFS) shutdown | Independent per-rail shutdown (e.g., BUCK3 Shutdown + DFS) isolates faults while preserving critical system functions during thermal or overvoltage events. |
Applications
| Radar ECU Power Supply | Vision Processing Unit |
|---|---|
Use Scenario: High-frequency 77 GHz radar module requiring clean, sequenced, and monitored power rails for RF transceivers, DSP, and memory. IC Role / Device Role / Timing Role: Primary power management IC delivering VPRE (for RF front-end), BUCK1 (DSP core), BUCK2 (memory I/O), and LDOs (analog bias). Use Value: 2.22 MHz switching and slew rate control minimize interference with radar chirp signals; fail-safe RSTB ensures deterministic reset during voltage droop. | Use Scenario: Automotive camera ECU with image sensor, ISP, and AI accelerator needing tightly regulated, low-noise supplies with thermal resilience. IC Role / Device Role / Timing Role: Central PMIC providing 1.03125 V core (BUCK1), 1.35 V ISP (BUCK3), 4.1 V sensor bias (BOOST), and 3.3 V I/O (LDO1). Use Value: OTP-configured 1.03125 V/1.35 V outputs match SoC voltage requirements; DFS shutdown prevents thermal runaway during sustained AI inference loads. |
| ADAS Domain Controller | Infotainment Head Unit |
Use Scenario: Zonal or central domain controller integrating radar, vision, and ultrasonic processing with unified power architecture. IC Role / Device Role / Timing Role: Multi-rail power source supporting heterogeneous compute (MCU, GPU, NPU) with independent sequencing and monitoring per subsystem. Use Value: Slot-based sequencing (Slot 4 for BUCK1/BUCK2, Slot 5 for BUCK3, Slot 6 for LDO1) ensures deterministic boot order across mixed-voltage domains. | Use Scenario: In-vehicle infotainment system with display processor, audio codec, and connectivity modules requiring robust, low-quiescent power delivery. IC Role / Device Role / Timing Role: System PMIC supplying 5.0 V (LDO2) for USB PHY, 3.3 V (LDO1) for touch controller, and 1.03125 V (BUCK1) for application processor core. Use Value: 10 µA standby current enables always-on functionality; I²C/SPI interface allows runtime voltage scaling and health monitoring by head unit MCU. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-rail automotive PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8530G4KS | ASIL D capable; identical pinout and OTP structure but higher safety integrity with redundant monitoring paths. | Required for ASIL D–rated systems (e.g., steering/braking domain controllers); not drop-in due to stricter diagnostic coverage requirements. | Select when full ASIL D compliance is mandated; otherwise MC33FS8430G4KS suffices for ASIL B radar/vision ECUs. |
| MPQ4436-AEC1 | Single-channel 60 V buck regulator (no integrated multi-rail architecture, no fail-safe outputs, no ISO 26262 certification). | Used for isolated pre-regulation only; requires external LDOs, sequencers, and safety monitors to replicate MC33FS8430G4KS functionality. | Choose only for cost-sensitive non-safety applications where full PMIC integration is unnecessary. |
Compared with MC33FS8430G4KS, MC33FS8530G4KS adds ASIL D diagnostics but increases BOM complexity, while MPQ4436-AEC1 lacks integrated sequencing, safety logic, and multi-rail capability-requiring significant external circuitry to approach equivalent functionality.
Availability
MC33FS8430G4KS is available at Aetrix Electronics and suitable for radar ECUs, vision processing units, and ADAS domain controllers requiring stable component supply, automotive-grade lifecycle support, and ASIL B–compliant power management.
Supply support for MC33FS8430G4KS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive functional safety and radar technology.
The MC33FS8430G4KS belongs to the FS84/FS85 family of functional safety–certified PMICs, designed specifically for next-generation automotive ADAS and autonomous driving systems requiring integrated, sequenced, and monitored multi-rail power delivery.
FAQ
What safety standard does the MC33FS8430G4KS comply with?
The MC33FS8430G4KS is developed in compliance with ISO 26262 and certified for ASIL B functional safety. It includes built-in self-test (ABIST/LBIST), dedicated monitoring circuits for VCOREMON, VDDIOMON, VMON1, and VMON2, and a fail-safe RSTB output that asserts at 3.2 V or 4.9 V depending on VPRE level. These features enable its use in radar, vision, and ADAS domain controllers where ASIL B integrity is required. The MC33FS8430G4KS meets all specified safety mechanisms defined in its configuration report (R_MC33FS8430G4KS_Rev_A).
What are the OTP-configured output voltages for MC33FS8430G4KS?
The MC33FS8430G4KS has factory-programmed OTP settings defining fixed output voltages: BUCK1 and BUCK2 at 1.03125 V, BUCK3 at 1.35 V, BOOST at 4.1 V, LDO1 at 3.3 V, LDO2 at 5.0 V, and VPRE reference at 5.74 V. These values are confirmed in the Configuration Report for FS8430 OTP program ID: G4 rev A (dated 29-Dec-2023). No field reprogramming is supported; voltage selection is locked at manufacture.
Does MC33FS8430G4KS support multi-phase operation between BUCK1 and BUCK2?
Yes, the MC33FS8430G4KS supports multi-phase operation between BUCK1 and BUCK2, enabling combined peak current delivery up to 7.2 A on a single 1.03125 V rail. This capability is enabled via OTP configuration and requires matching inductor values (1 µH each) and proper PCB layout for phase interleaving. The feature is explicitly documented in the FS84_FS85 datasheet and verified in the OTP configuration report for MC33FS8430G4KS.
What is the switching frequency of MC33FS8430G4KS SMPS regulators?
All integrated SMPS regulators in the MC33FS8430G4KS - BUCK1, BUCK2, BUCK3, and BOOST - operate at a fixed 2.22 MHz switching frequency, as defined in the OTP configuration report. This frequency is selected to balance efficiency, EMI performance, and component size for automotive radar and vision applications. VPRE is a controller only and does not define a fixed frequency; its switching frequency is set externally by the user-selected MOSFETs and compensation network.
How is power-up sequencing implemented in MC33FS8430G4KS?
Power-up sequencing in the MC33FS8430G4KS is implemented via OTP-defined time slots: BUCK1 and BUCK2 start in Slot 4, BUCK3 in Slot 5, LDO1 in Slot 6, and LDO2 in Slot 3. Each slot has a duration of 250 µs, and regulators are enabled/disabled within their assigned slots. This hard-coded sequencing eliminates external timing components and ensures repeatable boot behavior across temperature and voltage conditions, as verified in the MC33FS8430G4KS Configuration Report Rev 1.0.
MC33FS8430G4KS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8430G4KS FAQ
1.How can I place an order for MC33FS8430G4KS through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8430G4KS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8430G4KS reliable?
The price and inventory of MC33FS8430G4KS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8430G4KS is usually 5 days.
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MC33FS8430G4KS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8430G4KS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8430G4KS?
For technical support, including MC33FS8430G4KS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8430G4KS requirements.
6.How does Aetrix verify that MC33FS8430G4KS is sourced from the original manufacturer or authorized distributors?
All MC33FS8430G4KS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8430G4KS meets industry standards.
7.What is the process for return or replacement of MC33FS8430G4KS?
All MC33FS8430G4KS units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8430G4KS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8430G4KS part is unused and in its original packaging.
Return procedure for MC33FS8430G4KS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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