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NXP Semiconductors MC33FS8430G4KSR2
- Part No.:
- MC33FS8430G4KSR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8430G4KSR2.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:2,003
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Product details
Overview
MC33FS8430G4KSR2 from NXP Semiconductors is an ASIL B–capable automotive multi-output power management IC for radar, vision, and ADAS domain controllers. It integrates a 60 V input VPRE buck controller (10 A peak), low-voltage synchronous BUCK1 (1.03125 V, 3.6 A peak), BUCK2 (1.03125 V, 3.6 A peak), BUCK3 (1.35 V, 2.6 A peak), BOOST (4.1 V, 1.5 A peak), and two LDOs (3.3 V/5.0 V, up to 400 mA). It supports SPI/I²C control, fail-safe output, and 2.22 MHz switching frequency.
For engineers reviewing the MC33FS8430G4KSR2 datasheet, MC33FS8430G4KSR2 pinout, MC33FS8430G4KSR2 application, or MC33FS8430G4KSR2 equivalent, key selection criteria include ASIL B safety compliance, OTP-configured power sequencing slots (e.g., BUCK1/BUCK2 in Slot 4), thermal shutdown behavior, fail-safe output activation, and HVQFN56 package compatibility with wettable flanks for automotive PCB assembly.
Technical Context
The MC33FS8430G4KSR2 implements a functionally safe power architecture with independent monitoring circuitry for VCOREMON, VDDIOMON, VMON1, and VMON2, all configured via OTP to meet ISO 26262 ASIL B requirements. Its fail-safe output is activated on monitored rail faults with configurable OV/UV thresholds (e.g., VCOREMON OVTH = 106%, UVTH = 94%) and deglitch times (45 µs).
Power sequencing is fully OTP-defined across seven slots: BUCK1/BUCK2 start/stop in Slot 4, LDO1 in Slot 6, LDO2 in Slot 3, and RSTB assertion at 3.2 V or 4.9 V. The device uses 2.22 MHz fixed-frequency PWM operation for BUCK1/BUCK2/BUCK3/BOOST, with slope compensation and soft-start ramp (7.81 mV/µs) enabled per OTP configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 60 V DC max - supports both 12 V and 24 V automotive battery rails with robust overvoltage tolerance. |
| VPRE Buck Controller | Configurable external MOSFET driver; 10 A peak current capability enables high-power pre-regulation for downstream converters. |
| BUCK1 Output | 1.03125 V @ 3.6 A peak - dedicated MCU core supply with SVS (supply voltage supervision) and multiphase support with BUCK2. |
| BUCK2/BUCK3 Outputs | 1.03125 V / 1.35 V @ 3.6 A / 2.6 A peak - independently configurable low-voltage rails for auxiliary processors or sensors. |
| BOOST Converter | 4.1 V @ 1.5 A peak - integrated low-side switch supplies analog front-ends or RF biasing circuits. |
| LDO Outputs | 3.3 V / 5.0 V @ 400 mA / 150 mA - dual linear regulators for noise-sensitive MCU I/O and ADC reference domains. |
| Interface & Control | SPI or I²C (0x20/0x21 addresses) with CRC - enables real-time configuration, fault reporting, and fail-safe state management. |
| Standby Current | 10 µA typical - ultra-low sleep current supports always-on vehicle modules with strict quiescent power budgets. |
Pinout & Package
HVQFN56 (SOT684-23) package: 8 mm × 8 mm × 0.85 mm body, 0.5 mm pitch, thermally enhanced with wettable flanks for automated optical inspection (AOI) and solder joint reliability in automotive applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | Main power input | Accepts up to 60 V DC; feeds internal regulators and VPRE controller stage. |
| VPRE_OUT | VPRE gate drive output | Drives external high-side and low-side MOSFETs for primary buck conversion. |
| BUCK1_OUT | Core supply output | Delivers 1.03125 V to MCU core; includes SVS monitoring and multiphase sync capability. |
| BUCK2_OUT | Auxiliary supply output | Provides 1.03125 V rail; phase-shifted relative to BUCK1 for current sharing up to 7.2 A peak. |
| BUCK3_OUT | Secondary auxiliary output | Supplies 1.35 V at up to 2.6 A; independently sequenced in Slot 5. |
| BOOST_OUT | Boost converter output | Generates 4.1 V for analog/RF subsystems; includes slew rate control (500 V/µs) for EMC optimization. |
| LDO1_OUT / LDO2_OUT | Linear regulator outputs | 3.3 V / 5.0 V low-noise supplies for MCU I/O banks and physical layer interfaces. |
| FS_OUT | Fail-safe output | Open-drain signal asserted during critical fault conditions (e.g., thermal shutdown, OV/UV on monitored rails). |
| PSYNC | Power synchronization input | Enables synchronized switching across multiple FS84/FS85 devices to reduce system-level EMI peaks. |
| WAKE1 / WAKE2 | Wake-up detection inputs | Edge-triggered pins supporting low-power wake-from-sleep via external event detection. |
| SPI_SCLK / SPI_MOSI / SPI_MISO / SPI_CS | SPI interface signals | Full-duplex 32-bit SPI with CRC for secure register access and OTP readback (e.g., G4 rev A configuration ID). |
| I2C_SDA / I2C_SCL | I²C interface signals | Alternate 7-bit address interface (0x20/0x21) for simplified integration in resource-constrained systems. |
Key Features
| Feature | Design Value |
|---|---|
| ASIL B functional safety certification | Fully compliant with ISO 26262 process requirements; includes built-in self-test (ABIST/LBIST), dedicated monitoring circuitry, and fail-safe output activation. |
| OTP-programmable power sequencing | Seven configurable power-up/down slots enable precise timing control of 6 regulators and reset assertion - no external sequencing IC required. |
| EMC-optimized switching | 2.22 MHz fixed-frequency operation, spread spectrum, slew rate control (100–500 V/µs), and PSYNC input minimize conducted/radiated emissions in radar/vision systems. |
| Multi-phase BUCK1+BUCK2 operation | Phase shifting between BUCK1 and BUCK2 extends single-rail current capability to 7.2 A peak while reducing output ripple and thermal stress. |
| Ultra-low standby current | 10 µA typical sleep current enables always-on functionality in ADAS domain controllers without compromising battery drain budgets. |
| Dual-interface configurability | SPI (32-bit with CRC) and I²C (dual-address: 0x20/0x21) provide flexibility for safety-critical diagnostics and production-line programming. |
Applications
| Radar Signal Processing Unit | Vision Processing Module |
|---|---|
Use Scenario: High-resolution 77 GHz radar ECU requiring stable, low-noise, and precisely sequenced power rails for DSP, RF transceivers, and memory. IC Role / Device Role / Timing Role: Primary PMIC managing VPRE pre-regulation, BUCK1 core supply (1.03125 V), BUCK2 auxiliary (1.03125 V), BOOST (4.1 V), and LDOs - all with ASIL B–compliant fault handling. Use Value: Enables deterministic power-up sequence (Slot 4 for BUCK1/BUCK2), fail-safe output assertion on VCOREMON fault, and 2.22 MHz switching synchronized via PSYNC to avoid radar band interference. | Use Scenario: Automotive camera ECU powering image sensor, ISP, and MIPI interface with tight voltage accuracy and low ripple. IC Role / Device Role / Timing Role: Multi-rail power source delivering BUCK3 (1.35 V for sensor analog), LDO1 (3.3 V for I/O), LDO2 (5.0 V for PHY), and BOOST (4.1 V for lens actuator). Use Value: Achieves <±1% output voltage accuracy, <10 mVpp ripple, and slot-based sequencing (LDO2 in Slot 3, BUCK3 in Slot 5) to prevent sensor initialization conflicts. |
| ADAS Domain Controller | Infotainment Head Unit |
Use Scenario: Centralized vehicle compute platform integrating multiple SoCs, CAN FD, Ethernet AVB, and safety monitors. IC Role / Device Role / Timing Role: Safety-capable power hub providing isolated, monitored rails for main SoC core (BUCK1), companion MCU (BUCK2), and communication PHYs (LDO2, BOOST). Use Value: Supports deep fail-safe (DFS) recovery, VCOREMON/VMON1/VMON2 monitoring with 45 µs deglitch, and fail-safe output driving external watchdog or system-level reset logic. | Use Scenario: Multimedia head unit requiring robust 12 V–to–low-voltage conversion with thermal resilience and wake-on-event capability. IC Role / Device Role / Timing Role: Main PMIC supplying BUCK1 (1.03125 V), BUCK2 (1.03125 V), LDO1 (3.3 V), and LDO2 (5.0 V); WAKE1/WAKE2 detect CAN or USB activity. Use Value: Delivers 10 µA standby current for always-on audio/video decoding, plus thermal shutdown with BUCK3/LDO1/LDO2 shutdown + DFS behavior per OTP configuration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive multi-output PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8500G5KSR2 | ASIL D–rated; adds redundant monitoring paths, dual-core lockstep safety controller, and extended diagnostic coverage vs. MC33FS8430G4KSR2's ASIL B architecture. | Required for full ASIL D system partitioning (e.g., Level 3+ autonomous driving controllers); not drop-in due to higher pin count and different OTP structure. | Select when end-system ASIL target exceeds B; requires updated layout and safety software stack. |
| MPQ4333GR-AEC1 | Single-channel 60 V synchronous buck (3.5 A); lacks multi-rail integration, safety features, OTP sequencing, or fail-safe output - discrete solution requiring external LDOs and sequencing logic. | Suitable only for non-safety-critical 12 V accessory modules (e.g., HVAC control); cannot replace MC33FS8430G4KSR2 in radar/vision ECUs. | Consider only for cost-sensitive, non-ASIL applications where full PMIC integration and safety are unnecessary. |
Compared with MC33FS8430G4KSR2, MC33FS8500G5KSR2 provides higher safety integrity but demands more complex validation and board space, while MPQ4333GR-AEC1 offers lower integration and zero functional safety - making MC33FS8430G4KSR2 the optimal balance of ASIL B compliance, multi-rail density, and automotive qualification for radar and vision ECUs.
Availability
MC33FS8430G4KSR2 is available at Aetrix Electronics and suitable for radar signal processing units, vision processing modules, and ADAS domain controllers requiring stable component supply, automotive-grade reliability, and ASIL B–certified power management.
Supply support for MC33FS8430G4KSR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MC33FS8430G4KSR2 belongs to NXP's FS84/FS85 functional safety PMIC family, designed specifically to deliver integrated, ASIL-certified power regulation for next-generation radar, vision, and domain controller ECUs in ISO 26262–compliant vehicles.
FAQ
What safety standard does the MC33FS8430G4KSR2 comply with?
The MC33FS8430G4KSR2 is developed in compliance with ISO 26262 and certified for ASIL B functional safety. It includes fail-safe output, built-in self-test (ABIST/LBIST), dedicated monitoring circuitry for VCOREMON, VDDIOMON, VMON1, and VMON2, and OTP-configurable OV/UV thresholds with deglitch timers - all verified per ASIL B requirements in the FS84/FS85 product family.
What is the configured output voltage and current capability of BUCK1 in the MC33FS8430G4KSR2?
The MC33FS8430G4KSR2 has BUCK1 configured to deliver 1.03125 V at up to 3.6 A peak current, as defined in its OTP program ID G4 rev A. This rail is assigned to Slot 4 for power-up sequencing and supports static voltage scaling (SVS) and multiphase operation with BUCK2 to extend total current to 7.2 A peak.
Does the MC33FS8430G4KSR2 support external frequency synchronization?
Yes, the MC33FS8430G4KSR2 supports external frequency synchronization via its PSYNC pin, enabling coordinated switching across multiple FS84/FS85 devices or with external PMICs. This feature reduces system-level EMI peaks and improves EMC performance - especially critical in radar and vision applications operating near sensitive RF bands.
How is power sequencing controlled in the MC33FS8430G4KSR2?
Power sequencing in the MC33FS8430G4KSR2 is fully controlled by one-time programmable (OTP) memory. Seven sequencing slots define precise start/stop timing for each regulator: BUCK1 and BUCK2 activate in Slot 4, LDO2 in Slot 3, BUCK3 in Slot 5, and LDO1 in Slot 6 - eliminating need for external sequencing ICs and ensuring repeatable, production-ready startup behavior.
What package type and mounting features does the MC33FS8430G4KSR2 use?
The MC33FS8430G4KSR2 uses the HVQFN56 (SOT684-23) package: 8 mm × 8 mm × 0.85 mm body with 0.5 mm pitch and wettable flanks. This thermally enhanced, leadless design supports automated optical inspection (AOI) and ensures reliable solder joint formation in automotive reflow processes - critical for long-term under-hood reliability.
MC33FS8430G4KSR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8430G4KSR2 FAQ
1.How can I place an order for MC33FS8430G4KSR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8430G4KSR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8430G4KSR2 reliable?
The price and inventory of MC33FS8430G4KSR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8430G4KSR2 is usually 5 days.
3.What payment methods are accepted for MC33FS8430G4KSR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8430G4KSR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33FS8430G4KSR2?
MC33FS8430G4KSR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8430G4KSR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8430G4KSR2?
For technical support, including MC33FS8430G4KSR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8430G4KSR2 requirements.
6.How does Aetrix verify that MC33FS8430G4KSR2 is sourced from the original manufacturer or authorized distributors?
All MC33FS8430G4KSR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8430G4KSR2 meets industry standards.
7.What is the process for return or replacement of MC33FS8430G4KSR2?
All MC33FS8430G4KSR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8430G4KSR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8430G4KSR2 part is unused and in its original packaging.
Return procedure for MC33FS8430G4KSR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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