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NXP Semiconductors MC33FS8435G0ESR2

Part No.:
MC33FS8435G0ESR2
Manufacturer:
NXP Semiconductors
Category:
Power Management - Specialized
Package:
56-VFQFN Exposed Pad
Datasheet:
AetrixMC33FS8435G0ESR2.pdf
Description:
SAFETY POWER MANAGEMENT IC, QFN5
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,025

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Product details

Overview

MC33FS8435G0ESR2 from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating three synchronous buck converters (BUCK1/2/3), one boost converter, two LDOs, voltage supervision, fail-safe output, and SPI/I²C interfaces. It supports up to 60 V input, delivers peak currents of 3.6 A per buck rail, and targets radar, vision, and ADAS domain controllers requiring functional safety and multi-rail power sequencing.

For engineers reviewing the MC33FS8435G0ESR2 datasheet, MC33FS8435G0ESR2 pinout, MC33FS8435G0ESR2 application, or MC33FS8435G0ESR2 equivalent, key selection criteria include its triple-buck + boost + dual-LDO architecture, ASIL B compliance per ISO 26262, HVQFN56 package with wettable flanks, and OTP-configurable power-up sequencing across six slots.

Technical Context

The MC33FS8435G0ESR2 implements a deterministic, safety-oriented power management state machine with independent monitoring circuits for VCOREMON, VDDIOMON, and four VMON inputs. Its fail-safe output (FS0B) asserts on detected faults including overvoltage, undervoltage, thermal shutdown, or watchdog timeout, enabling safe system shutdown in ASIL B–compliant architectures.

Power regulation uses synchronous buck topologies with 2.22 MHz switching frequency (BUCK1/2/3), programmable soft-start slew rates (7.81–10.41 mV/µs), and multiphase capability between BUCK1 and BUCK2. The VPRE controller supports external MOSFETs with 455 kHz forced-PWM operation and integrated slope compensation.

Key Specifications

ParameterValue and Actual Design Meaning
Input Voltage Range4.9 V to 60 V - Supports 12 V and 24 V automotive battery systems with reverse-battery protection diodes required on VSUP1/VSUP2.
BUCK1 Output1.8 V @ 4.5 A peak - Dedicated MCU core supply with SVS capability and slot-0 power sequencing.
BUCK2 Output1.8 V @ 4.5 A peak - Configurable low-voltage rail with multiphase support and slot-0 sequencing.
BUCK3 Output3.3 V @ 4.5 A peak - Third synchronous buck with slot-0 start/stop and 10.41 mV/µs DVS soft-start.
LDO1/LDO2 Outputs1.8 V / 3.3 V @ 400 mA each - Dual linear regulators for MCU I/O and ADC supply with independent voltage monitoring.
Safety CertificationISO 26262 ASIL B compliant - Qualified per AEC-Q100 Grade 1 (−40 °C to +125 °C) with built-in self-test and fail-safe output driver.
InterfaceSPI or I²C (0x20 address) with CRC - Enables real-time configuration, fault reporting, and register readback for safety-critical diagnostics.
Quiescent Current10 µA typical in OFF mode - Enables ultra-low-power wake-up readiness for always-on automotive subsystems.

Pinout & Package

HVQFN56 package: plastic thermal-enhanced very thin quad flat package, 8 mm × 8 mm × 0.85 mm body, 0.5 mm pitch, step-cut wettable flank (ES suffix), exposed pad for thermal and electrical grounding.

Pin/TerminalCircuit RoleDesign Meaning
VSUP1 / VSUP2Main power inputsAccept 4.9–60 V battery supply; require external reverse-battery diodes per datasheet.
BUCK1_SW / BUCK2_SW / BUCK3_SWSwitching nodesConnect to external inductors and low-side MOSFETs (BUCK1/2/3); tied to exposed pad ground.
PRE_GHS / PRE_GLSVPRE gate driversDrive external high-side and low-side MOSFETs for primary buck controller (VPRE).
FS0BFail-safe outputActive-low open-drain signal asserting on fault detection; requires external pull-up to VDDIO.
VCOREMON / VDDIOMON / VMON1–VMON4Voltage monitoring inputsAnalog inputs for real-time supervision of regulated outputs and external rails with configurable OV/UV thresholds.
SPI (MOSI/MISO/SCLK/CSB) / I²C (SCL/SDA)Digital interfacesConfigurable communication ports with CRC for register access, fault logging, and dynamic reconfiguration.
WAKE1 / WAKE2Wake-up inputsAsynchronous digital inputs triggering device wake from OFF mode; require external series resistors if used globally.
PGOOD / RSTB / INTBStatus outputsActive-low signals indicating power-good status, MCU reset assertion, and interrupt events respectively.

Key Features

FeatureDesign Value
Triple synchronous buck + boost + dual-LDO integrationReduces board space and BOM count by consolidating six regulated rails into single HVQFN56 IC for radar/vision ECUs.
ASIL B functional safety architectureIncludes dedicated fail-safe state machine, ABIST/LBIST, challenger watchdog, and independent voltage monitors meeting ISO 26262 requirements.
OTP-programmable power sequencingEnables custom regulator startup/shutdown order across six time slots without firmware changes-critical for complex SoC power-up timing.
EMC optimization featuresSupports frequency synchronization (FIN/FOUT), spread spectrum, and slew rate control to meet automotive CISPR-25 Class 5 radiated emissions limits.
Multi-phase BUCK1+BUCK2 capabilityExtends peak current delivery to 7.2 A on a single rail, enabling higher-power MCU core supplies without external parallelization.
Fail-safe output with autoretryFS0B drives external safety relays or shutdown circuitry; deep fail-safe mode supports infinite retry or x15 autorecovery based on OTP configuration.

Applications

Radar Sensor Power ManagementVision System Power Supply

Use Scenario: Powers NXP S32R294 radar MCU and TEF810x RF transceiver in 12 V/24 V corner radar modules.

IC Role / Device Role / Timing Role: Primary SBC delivering BUCK1 (1.03125 V core), BUCK3 (3.3 V PHY), LDO1 (1.8 V I/O), and BOOST (5.0 V bias) with synchronized sequencing.

Use Value: Eliminates discrete PMIC + supervisor combinations while meeting ASIL B requirements for radar functional safety.

Use Scenario: Supplies NXP S32V234 vision processor and PF8x companion PMIC in mono/stereo camera ECU designs.

IC Role / Device Role / Timing Role: Provides BUCK1 (1.8 V core), BUCK2 (1.2 V DDR), BUCK3 (3.3 V sensor interface), and dual-LDOs (1.8 V/3.3 V I/O) with slot-0–slot-6 sequencing.

Use Value: Enables precise power-up timing alignment between vision SoC, image sensors, and ISP peripherals to prevent initialization faults.

ADAS Domain Controller PowerInfotainment Head Unit Supply

Use Scenario: Manages power for multi-core ADAS domain controller (e.g., S32G274) integrating radar, vision, and vehicle networking.

IC Role / Device Role / Timing Role: Delivers six regulated rails (three bucks, two LDOs, boost) with FCCU monitoring, PSYNC coordination, and fail-safe output for system-level fault containment.

Use Value: Reduces inter-IC communication latency versus discrete solutions and enables centralized safety monitoring across heterogeneous compute domains.

Use Scenario: Powers infotainment head unit with application processor, display driver, audio codec, and CAN transceiver.

IC Role / Device Role / Timing Role: Supplies BUCK1 (1.2 V core), BUCK2 (1.8 V memory), LDO1 (3.3 V I/O), LDO2 (5.0 V analog), and VPRE (5.0 V pre-regulator) with wake-on-CAN via WAKE1/WAKE2.

Use Value: Achieves <10 µA quiescent current in OFF mode while maintaining fast wake response (<100 µs) for voice-triggered infotainment activation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive SBC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC33FS8430G0ESR2Omits FCCU safety monitor and supports only up to 2 VMON inputs vs. 4 on MC33FS8435G0ESR2.Targeted at simpler ASIL B systems without MCU error monitoring or multi-rail supervision requirements.Select when FCCU and extended voltage monitoring are unnecessary to reduce cost and simplify safety validation.
MC33FS8530A0ESR2ASIL D–rated version with enhanced monitoring (ERRMON, dual FCCU), deeper ABIST coverage, and higher diagnostic coverage metrics.Required for domain controllers or zonal gateways where end-to-end ASIL D decomposition is mandated.Choose for new ASIL D–compliant designs needing full ISO 26262 tool qualification evidence and extended fault coverage.

Compared with MC33FS8430G0ESR2, the MC33FS8435G0ESR2 adds FCCU-based MCU error monitoring and four VMON inputs for comprehensive rail supervision-enabling tighter safety partitioning in radar/vision ECUs. Versus MC33FS8530A0ESR2, it trades ASIL D certification for lower cost and reduced diagnostic overhead while retaining identical regulator topology and pinout.

Availability

MC33FS8435G0ESR2 is available at Aetrix Electronics and suitable for radar sensor modules, vision processing units, and ADAS domain controllers requiring stable component supply, automotive-grade lifecycle support, and ASIL B–certified power management.

Supply support for MC33FS8435G0ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive processors and power management ICs.

The FS84 product line delivers ASIL B–compliant system basis chips optimized for radar, vision, and ADAS domain controllers-integrating multiple SMPS, LDOs, safety monitors, and fail-safe outputs in a single HVQFN package.

FAQ

What is the maximum input voltage supported by the MC33FS8435G0ESR2?

The MC33FS8435G0ESR2 supports a maximum input voltage of 60 V DC across VSUP1 and VSUP2 pins, enabling compatibility with both 12 V and 24 V automotive battery systems. External reverse-battery protection diodes are mandatory on both inputs per the datasheet design requirements.

Does the MC33FS8435G0ESR2 support multiphase operation between its buck converters?

Yes, the MC33FS8435G0ESR2 supports multiphase operation between BUCK1 and BUCK2 to extend peak current capability to 7.2 A on a single rail. This is enabled via OTP configuration and requires matching inductor values and phase-shifted PWM signals generated internally.

How does the fail-safe output (FS0B) behave during thermal shutdown?

During thermal shutdown (TSD), the MC33FS8435G0ESR2 asserts its active-low FS0B output and initiates fail-safe state machine actions, including shutdown of all enabled regulators (BUCK1/2/3, BOOST, LDO1/2) and entry into deep fail-safe mode with configurable autoretry (infinite or x15 cycles).

What safety certifications apply to the MC33FS8435G0ESR2?

The MC33FS8435G0ESR2 is developed in compliance with ISO 26262 for ASIL B applications and qualified per AEC-Q100 Grade 1 (−40 °C to +125 °C). It includes built-in self-test (ABIST/LBIST), challenger watchdog, and independent voltage supervisors to meet functional safety requirements.

Can the MC33FS8435G0ESR2 be configured for different power-up sequencing orders?

Yes, the MC33FS8435G0ESR2 supports OTP-programmable power sequencing across six independent slots. Each regulator (BUCK1/2/3, BOOST, LDO1/2) can be assigned to a specific slot for start/stop timing, enabling custom sequencing without firmware intervention.

MC33FS8435G0ESR2 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
56-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
System Basis Chip
Current - Supply:
15mA
Voltage - Supply:
60V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
56-HVQFN (8x8)

MC33FS8435G0ESR2 FAQ

1.How can I place an order for MC33FS8435G0ESR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for MC33FS8435G0ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of MC33FS8435G0ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8435G0ESR2 is usually 5 days.

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Once your MC33FS8435G0ESR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC33FS8435G0ESR2?

For technical support, including MC33FS8435G0ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8435G0ESR2 requirements.

6.How does Aetrix verify that MC33FS8435G0ESR2 is sourced from the original manufacturer or authorized distributors?

All MC33FS8435G0ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8435G0ESR2 meets industry standards.

7.What is the process for return or replacement of MC33FS8435G0ESR2?

All MC33FS8435G0ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8435G0ESR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC33FS8435G0ESR2 part is unused and in its original packaging.

Return procedure for MC33FS8435G0ESR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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