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NXP Semiconductors MC33FS8435G0KSR2
- Part No.:
- MC33FS8435G0KSR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8435G0KSR2.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:2,817
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Product details
Overview
MC33FS8435G0KSR2 from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating three synchronous buck converters (BUCK1/2/3), one boost converter, two LDOs, and comprehensive safety monitoring. It supports 12 V/24 V battery inputs up to 60 V, delivers up to 3.6 A per buck rail, and features SPI/I²C control, frequency synchronization (FIN/FOUT), and fail-safe output (FS0B) for radar and ADAS domain controllers.
For engineers reviewing the MC33FS8435G0KSR2 datasheet, MC33FS8435G0KSR2 pinout, MC33FS8435G0KSR2 application, or MC33FS8435G0KSR2 equivalent, key selection criteria include its triple-buck + boost + dual-LDO power architecture, ASIL B safety certification per ISO 26262, HVQFN56 wettable flank package, and OTP-configurable power sequencing for S32R/S32V-based radar/vision systems.
Technical Context
The MC33FS8435G0KSR2 implements a multi-rail power management architecture with independent control loops for BUCK1 (MCU core), BUCK2 (IO/peripheral), and BUCK3 (sensor/PHY), each configurable for output voltage (e.g., 1.03125 V–3.3 V), current limit (up to 4.5 A peak), and 2.22 MHz switching frequency. Its integrated BOOST converter provides 5.0–5.74 V at up to 1.5 A peak for external PHYs or gate drivers.
Safety logic includes dedicated voltage monitors (VCOREMON, VDDIOMON, VMON1–VMON4), programmable over/under-voltage thresholds (±4.5% typical), deep fail-safe autoretry, challenger watchdog, and fail-safe state machine driving FS0B. All safety functions are independently verified and operate under ISO 26262 ASIL B compliance with AEC-Q100 Grade 1 qualification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 4.9 V to 60 V DC - supports direct connection to automotive 12 V/24 V battery rails with reverse-battery protection diodes on VSUP1/VSUP2. |
| BUCK1 Output | 1.03125 V @ 4.5 A peak - dedicated low-noise core supply for NXP S32R/S32V MCUs with SVS capability and soft-start slope of 7.81 mV/µs. |
| BUCK2 & BUCK3 Outputs | Configurable 1.2 V–3.3 V @ 4.5 A peak each - supports multi-phase operation (BUCK1+BUCK2) for 7.2 A peak on single rail; used for sensor interfaces and ADC supplies. |
| BOOST Output | 5.0 V or 5.74 V @ 1.5 A peak - powers CAN transceivers, radar front-ends, or external gate drivers with integrated low-side switch. |
| LDO1/LDO2 Outputs | 1.2 V–5.0 V @ 400 mA DC each - low-noise supplies for MCU I/O banks and analog subsystems with independent UV/OV detection. |
| Safety Certification | ISO 26262 ASIL B compliant - includes ABIST, LBIST, FCCU, PGOOD/RSTB assertion, and fail-safe output (FS0B) with infinite autoretry mode. |
| Interface | SPI or I²C (0x20 address) with CRC - enables real-time configuration, fault logging, and dynamic voltage scaling during runtime. |
| Package | HVQFN56 (8 mm × 8 mm × 0.85 mm, 0.5 mm pitch, wettable flank) - optimized for thermal dissipation in radar ECU modules and supports automated optical inspection (AOI). |
Pinout & Package
HVQFN56 plastic thermal enhanced very thin quad flat package with 56 terminals, wettable flank (KS suffix), 0.5 mm pitch, and exposed thermal pad (EP) connected to GNDFS/GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP1 / VSUP2 | Main power inputs | Accept 12 V/24 V battery input; require external reverse-battery diodes; internal clamping protects against load dump. |
| BUCK1_SW / BUCK2_SW / BUCK3_SW | Switching node outputs | Drive external inductors; require ceramic output capacitors and ferrite beads for EMC filtering per CISPR 25 Class 5. |
| FS0B | Fail-safe output | Open-drain active-low signal asserting system-level failure; drives external safety relay or MCU interrupt with configurable timeout. |
| FIN / FOUT | Frequency sync I/O | Enables synchronized switching across multiple MC33FS8435G0KSR2 devices or with external PMICs to reduce conducted EMI peaks. |
| VCOREMON / VDDIOMON | Core & IO voltage monitors | Analog inputs tied directly to BUCK1/LDO2 outputs; enable precise SVS with 100 µs response time and ±1% accuracy. |
| PSYNC | Power sync I/O | Coordinates power-up sequencing between two FS84/FS85 devices or with PF82-series PMICs to avoid inrush current stacking. |
| WAKE1 / WAKE2 | Wake-up inputs | Support low-power OFF mode (10 µA quiescent); require external series resistors when shared across multiple ECUs. |
| INTB / RSTB / PGOOD | System status outputs | Active-low open-drain signals requiring VDDIO pull-ups; indicate fault conditions, reset requests, and rail stabilization status. |
Key Features
| Feature | Design Value |
|---|---|
| Triple synchronous buck regulators | Independent 2.22 MHz switching with multiphase capability (BUCK1+BUCK2) enabling 7.2 A peak on single rail for high-current radar sensors. |
| Integrated boost converter | 5.0–5.74 V output with 1.5 A peak current and slew-rate-controlled switching for clean CAN/PHY power without external controller. |
| ASIL B safety architecture | Dedicated monitoring circuits (FCCU, ABIST, ERRMON), fail-safe state machine, and infinite autoretry mode ensure deterministic response to voltage, thermal, or communication faults. |
| OTP-configurable power sequencing | 12-slot sequencing engine allows precise start/stop timing for BUCK/LDO rails - critical for S32R294-based radar with cascaded power domains. |
| EMC optimization | Spread spectrum, manual frequency tuning, and FIN/FOUT synchronization reduce peak emissions by >10 dBµV in 150 kHz–108 MHz band per CISPR 25. |
| Wettable flank HVQFN56 | Enables reliable solder joint inspection via AOI and improves thermal resistance (θJA = 28 °C/W) for under-hood radar module operation up to 125 °C ambient. |
Applications
| Radar Sensor Power Management | Vision System Power Architecture |
|---|---|
Use Scenario: Powers NXP S32R294 MCU and TEF810x radar transceiver in corner radar module with 12 V/24 V battery input. IC Role / Device Role / Timing Role: MC33FS8435G0KSR2 serves as primary power source and safety monitor - BUCK1 supplies S32R294 core (1.03125 V), BUCK3 powers TEF810x (3.3 V), BOOST supplies CAN PHY (5.0 V). Use Value: Integrated fail-safe output (FS0B) asserts within 250 µs of VCOREMON undervoltage, halting radar transmission before MCU corruption occurs. | Use Scenario: Supplies NXP S32V234 vision processor and PF8x companion PMIC in mono-camera ADAS ECU. IC Role / Device Role / Timing Role: MC33FS8435G0KSR2 delivers BUCK1 (1.2 V core), BUCK2 (1.8 V IO), LDO1 (1.8 V ADC), and LDO2 (3.3 V sensor interface) with synchronized startup slots. Use Value: PSYNC pin coordinates power-up with PF8242 to prevent current surges during cold cranking, maintaining stable 1.2 V core rail within ±2% tolerance. |
| ADAS Domain Controller | Infotainment Head Unit |
Use Scenario: Powers multi-core S32Z274 domain controller with Ethernet AVB, CAN FD, and PCIe interfaces in zonal architecture. IC Role / Device Role / Timing Role: MC33FS8435G0KSR2 manages BUCK1 (1.1 V CPU), BUCK2 (1.8 V DDR), BUCK3 (3.3 V SerDes), and dual LDOs (1.2 V/3.3 V analog) with independent UV/OV monitoring per rail. Use Value: VMON1–VMON4 inputs monitor all critical rails; PGOOD deassertion triggers controlled shutdown sequence preserving firmware integrity during brownout. | Use Scenario: Supplies NXP i.MX8QXP application processor and audio codec in premium infotainment head unit with display backlight control. IC Role / Device Role / Timing Role: MC33FS8435G0KSR2 provides BUCK1 (1.35 V core), BUCK2 (1.8 V GPU), LDO1 (3.3 V display interface), and LDO2 (5.0 V USB PHY) with I²C dynamic voltage scaling. Use Value: I²C interface enables real-time adjustment of BUCK1 output during video playback vs. idle states, reducing average power consumption by 22%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8530A0ES | ASIL D certified; adds FCCU safety monitor and enhanced ABIST coverage; identical pinout and OTP programming interface. | Required for ASIL D domain controllers (e.g., central vehicle compute); not needed for ASIL B radar sensor nodes where MC33FS8435G0KSR2 suffices. | Select MC33FS8530A0ES only when full ASIL D decomposition is mandated by system safety plan; otherwise MC33FS8435G0KSR2 reduces cost and complexity. |
| TPS65381A-Q1 | TI device with dual buck + dual LDO + watchdog; no boost converter; I²C-only interface; different pinout and sequencing model. | Used in legacy ADAS camera modules with TI Jacinto processors; lacks frequency sync (FIN/FOUT) and fail-safe output required for new NXP S32R designs. | Choose MC33FS8435G0KSR2 for NXP S32R/S32V platforms requiring boost, PSYNC, and fail-safe output; TPS65381A-Q1 suits TI-based systems with simpler power trees. |
Compared with MC33FS8530A0ES, MC33FS8435G0KSR2 offers lower BOM cost and reduced qualification effort for ASIL B systems, while retaining identical power architecture and pin compatibility. Against TPS65381A-Q1, it delivers superior radar-specific features including boost regulation, FIN/FOUT synchronization, and fail-safe output - essential for next-generation S32R-based sensing.
Availability
MC33FS8435G0KSR2 is available at Aetrix Electronics and suitable for radar sensor modules, vision processing units, ADAS domain controllers, and infotainment head units requiring stable component supply across automotive production lifecycles.
Supply support for MC33FS8435G0KSR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade power management.
The FS84 product line delivers ASIL B–certified system basis chips optimized for radar, vision, and domain controller applications - integrating multiple SMPS, LDOs, safety monitors, and fail-safe logic in a single HVQFN package.
FAQ
What is the maximum output current supported by each buck regulator in the MC33FS8435G0KSR2?
The MC33FS8435G0KSR2 supports up to 4.5 A peak output current per buck regulator (BUCK1, BUCK2, BUCK3). BUCK1 is configured for 1.03125 V core supply, BUCK2 for 1.8 V IO, and BUCK3 for 3.3 V sensor/PHY - all operating at 2.22 MHz with independent current limiting and thermal shutdown.
Does the MC33FS8435G0KSR2 support frequency synchronization with external devices?
Yes, the MC33FS8435G0KSR2 supports bidirectional frequency synchronization via dedicated FIN (input) and FOUT (output) pins. This feature enables phase-aligned switching across multiple MC33FS8435G0KSR2 devices or with external PMICs to minimize conducted EMI peaks in radar and ADAS systems.
How does the fail-safe output (FS0B) function in the MC33FS8435G0KSR2?
The FS0B pin on the MC33FS8435G0KSR2 is an open-drain active-low fail-safe output driven by the internal safety state machine. It asserts within 250 µs of detected VCOREMON undervoltage, thermal shutdown, or communication fault - providing deterministic system-level shutdown for ASIL B radar applications.
What package type and thermal characteristics does the MC33FS8435G0KSR2 use?
The MC33FS8435G0KSR2 uses an HVQFN56 package (8 mm × 8 mm × 0.85 mm, 0.5 mm pitch) with dimple wettable flank (KS suffix). Its exposed thermal pad (EP) connects to GNDFS/GND, achieving θJA = 28 °C/W - enabling reliable operation at 125 °C ambient in under-hood radar modules.
Can the MC33FS8435G0KSR2 be configured for different power-up sequencing orders?
Yes, the MC33FS8435G0KSR2 includes a 12-slot programmable power sequencing engine. Each regulator (BUCK1–BUCK3, LDO1–LDO2) can be assigned to a specific slot for precise start/stop timing - critical for S32R294-based radar systems requiring staggered power delivery to avoid inrush current violations.
MC33FS8435G0KSR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8435G0KSR2 FAQ
1.How can I place an order for MC33FS8435G0KSR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8435G0KSR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8435G0KSR2 reliable?
The price and inventory of MC33FS8435G0KSR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8435G0KSR2 is usually 5 days.
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4.How is shipping managed for MC33FS8435G0KSR2?
MC33FS8435G0KSR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8435G0KSR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8435G0KSR2?
For technical support, including MC33FS8435G0KSR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8435G0KSR2 requirements.
6.How does Aetrix verify that MC33FS8435G0KSR2 is sourced from the original manufacturer or authorized distributors?
All MC33FS8435G0KSR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8435G0KSR2 meets industry standards.
7.What is the process for return or replacement of MC33FS8435G0KSR2?
All MC33FS8435G0KSR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8435G0KSR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8435G0KSR2 part is unused and in its original packaging.
Return procedure for MC33FS8435G0KSR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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