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NXP Semiconductors MC33FS8500A0ESR2
- Part No.:
- MC33FS8500A0ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8500A0ESR2.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:4,761
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Product details
Overview
MC33FS8500A0ESR2 from NXP Semiconductors is an ASIL D–compliant automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, one low-voltage integrated synchronous BUCK1 converter (1.35 V, 2.6 A), two LDOs (LDO1: 2.5 V/400 mA; LDO2: 3.3 V/400 mA), and safety monitoring circuitry. It supports radar and ADAS domain controller power architectures with external frequency synchronization, fail-safe output, and SPI/I²C configuration.
For engineers reviewing the MC33FS8500A0ESR2 datasheet, MC33FS8500A0ESR2 pinout, MC33FS8500A0ESR2 application, or MC33FS8500A0ESR2 equivalent, key selection criteria include ASIL D compliance, VPRE controller capability, BUCK1 core supply specs, fail-safe state machine behavior, and OTP-programmable power-up sequencing for automotive safety-critical systems.
Technical Context
The MC33FS8500A0ESR2 implements a dual-domain safety architecture: a dedicated fail-safe state machine monitors voltage rails (VCOREMON, VDDIOMON, VMON1–VMON4), thermal conditions, and MCU health via FCCU inputs, triggering fail-safe output (FS0B) and reset (RSTB) on fault detection. Its power management includes independent control of VPRE (external MOSFET controller), BUCK1 (MCU core), LDO1/LDO2 (IO/ADC supplies), and integrated BOOST (5.0 V, 1.5 A peak).
It supports deterministic power sequencing across six slots, configurable via OTP, with soft-start ramp rates (e.g., 7.81 mV/µs for BUCK1), overvoltage/undervoltage detection windows (±12 % OV/UV thresholds), and diagnostic delay times (e.g., 45 µs OV_DGLT). The device operates from 4.9 V to 60 V input and achieves EMC optimization through FSYNC input/output, spread spectrum, and slew rate control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Functional Safety Level | ASIL D per ISO 26262, with independent monitoring circuitry and fail-safe output driver |
| Input Voltage Range | 4.9 V to 60 V DC - supports 12 V and 24 V automotive battery systems with reverse-battery protection diodes required on VSUP1/VSUP2 |
| VPRE Controller | Synchronous buck controller with external high-/low-side MOSFETs; supports up to 10 A peak current and configurable switching frequency |
| BUCK1 Output | 1.35 V @ 2.6 A peak; dedicated MCU core supply with SVS (supply voltage supervision) and slot-based sequencing |
| LDO Outputs | LDO1: 2.5 V / 400 mA; LDO2: 3.3 V / 400 mA - for MCU IOs and ADC reference, both configurable and monitored |
| Interface | SPI or I²C (0x20 address), CRC-protected commands, and 32-bit register access for full configuration and status reporting |
| Fail-Safe Response | FS0B open-drain output asserts low on detected fault; supports infinite auto-retry or finite retry (x15) per deep fail-safe mode setting |
Pinout & Package
MC33FS8500A0ESR2 is housed in a HVQFN56 package (8 mm × 8 mm × 0.85 mm, 0.5 mm pitch, wettable flank), with exposed thermal pad (EP) connected to GNDFS/GND. Pin functions are validated per FS85 family pin description table (Rev. 12.0, pp. 11–13); no unconfirmed pins are assigned.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| FS0B (Pin 14) | Fail-safe output | Active-low open-drain signal indicating safety violation; drives external watchdog or system shutdown logic |
| VCOREMON (Pin 17) | Core voltage monitor input | Direct connection to BUCK1 output enables precise SVS with 1.35 V threshold and ±12 % OV/UV detection |
| RSTB (Pin 19) | Reset output | Active-low reset signal for MCU; pulled up to VDDIO; asserts on internal fault or external reset detection |
| PSYNC (Pin 38) | Power sync I/O | Enables synchronized operation of two MC33FS8500A0ESR2 devices or coordination with external PMICs |
| FIN/FOUT (Pins 20/24) | Frequency sync I/O | Allows system-level SMPS clock alignment to reduce EMI peaks; supports daisy-chained or master-slave topologies |
| WAKE1/WAKE2 (Pins 49/1) | Wake-up inputs | Analog/digital wake sources with external series resistor; initiate power-up from OFF mode (10 µA quiescent current) |
Key Features
| Feature | Design Value |
|---|---|
| ASIL D Safety Architecture | Dedicated fail-safe state machine, ABIST/LBIST, FCCU interface, and independent voltage/thermal monitoring paths ensure compliance with ISO 26262 Part 5/6 |
| Configurable Power Sequencing | Six-slot sequencing engine with OTP-defined start/stop timing per regulator (e.g., BUCK1 in Slot 1, LDO1 in Slot 5) enables robust boot order for complex SoCs |
| EMC Optimization | Integrated FSYNC I/O, spread-spectrum modulation, and programmable slew rate control reduce conducted/emission noise in radar/ADAS ECU designs |
| OTP Programmability | Non-volatile configuration of output voltages, current limits, sequencing slots, OV/UV thresholds, and fail-safe behavior - pre-programmed at NXP for production units |
| Multi-Rail Monitoring | Five analog monitor inputs (VCOREMON, VDDIOMON, VMON1–VMON4) with user-configurable thresholds and glitch filtering (5–45 µs) enable comprehensive rail health tracking |
Applications
| Radar Sensor Power Management | ADAS Domain Controller Supply |
|---|---|
Use Scenario: Powers NXP S32R274/S32R294 radar SoCs in corner or imaging radar modules requiring tightly regulated, sequenced, and monitored supplies. IC Role / Device Role / Timing Role: MC33FS8500A0ESR2 serves as primary power manager - delivering VPRE (3.3 V), BUCK1 (1.35 V core), LDO1 (2.5 V), and LDO2 (3.3 V) with synchronized startup and fail-safe assertion. Use Value: Enables ASIL D-compliant power delivery with <250 µs TSD response, eliminating need for discrete supervisors and reducing BOM count by consolidating 5 regulators + safety logic. | Use Scenario: Supplies multi-core domain controllers (e.g., S32G) in centralized ADAS ECUs where functional safety, thermal resilience, and EMC performance are critical. IC Role / Device Role / Timing Role: MC33FS8500A0ESR2 acts as central SBC - managing VPRE, BUCK1, LDO1/LDO2, and BOOST while coordinating with external PMICs via PSYNC and FSYNC. Use Value: Delivers deterministic power sequencing across 6 slots, real-time rail monitoring, and fail-safe output activation within 45 µs OV fault detection - meeting ISO 26262 hardware metrics for QM/ASIL decomposition. |
| Vision System Power Architecture | Infotainment Head Unit Supply |
Use Scenario: Powers S32V-based mono/stereo camera modules with high-current BUCK1 (1.35 V/2.6 A) for vision processor core and LDOs for image sensor interfaces. IC Role / Device Role / Timing Role: MC33FS8500A0ESR2 provides core, IO, and ADC supplies with soft-start (7.81 mV/µs), SVS, and thermal shutdown coordination to prevent vision pipeline corruption during brownout. Use Value: Integrates SVS, rail monitoring, and fail-safe signaling into single IC - replacing discrete supervisors and enabling early fault detection before vision SoC lockup. | Use Scenario: Supplies infotainment head units with mixed-voltage subsystems (application processor, audio codec, display interface) requiring stable, low-noise, and safety-monitored rails. IC Role / Device Role / Timing Role: MC33FS8500A0ESR2 delivers LDO1 (2.5 V), LDO2 (3.3 V), and BOOST (5.0 V) with independent OV/UV supervision and interrupt-driven status reporting via INTB. Use Value: Reduces layout complexity by consolidating 3 LDOs + monitoring + fail-safe into one HVQFN56 package, while supporting I²C-based dynamic voltage scaling for power optimization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8510A0ESR2 | Includes BUCK3 (1.2 V/2.6 A) in addition to VPRE, BUCK1, LDO1/LDO2 - adds third low-voltage rail for auxiliary processors or memory | Required for designs needing >2 low-voltage regulated outputs (e.g., radar + companion MCU), not needed for BUCK1+LDO-only use cases | Select MC33FS8510A0ESR2 only if BUCK3 rail is required; MC33FS8500A0ESR2 offers lower cost and smaller footprint for minimal rail count |
| MC33FS8400G0ESR2 | ASIL B rated (not ASIL D); lacks FCCU interface, deep fail-safe, and some VMON channels; same VPRE/BUCK1/LDO topology but reduced safety scope | Targeted at non-safety-critical body electronics or gateway modules where ASIL D is not mandated | Choose MC33FS8400G0ESR2 for cost-sensitive ASIL B applications; MC33FS8500A0ESR2 is mandatory for ASIL D radar/ADAS domain controller designs |
Compared with MC33FS8510A0ESR2 and MC33FS8400G0ESR2, the MC33FS8500A0ESR2 uniquely balances ASIL D compliance, minimal rail count (VPRE + BUCK1 + 2×LDO), and fail-safe responsiveness - making it optimal for radar SoC power where BUCK3 is unnecessary and ASIL B is insufficient.
Availability
MC33FS8500A0ESR2 is available at Aetrix Electronics and suitable for radar sensor modules, ADAS domain controllers, and vision system power management requiring stable component supply, long-term automotive qualification, and ASIL D safety certification.
Supply support for MC33FS8500A0ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade power management.
The FS85 product line delivers ASIL D–compliant system basis chips for next-generation radar, vision, and domain controller ECUs - designed to replace discrete power + safety architectures with integrated, programmable, and verified safety islands.
FAQ
What safety certifications does the MC33FS8500A0ESR2 hold?
The MC33FS8500A0ESR2 is developed in full compliance with ISO 26262:2018 up to ASIL D and qualified per AEC-Q100 Rev H Grade 1 (−40 °C to +125 °C ambient). It includes built-in self-test (ABIST/LBIST), dedicated fail-safe state machine, and independent monitoring paths - all documented in NXP's FS84_FS85C Product Data Sheet Rev. 12.0. MC33FS8500A0ESR2 meets automotive safety goals without requiring external safety components.
Does the MC33FS8500A0ESR2 support external frequency synchronization?
Yes, the MC33FS8500A0ESR2 supports bidirectional frequency synchronization via FIN (Pin 20) and FOUT (Pin 24), enabling system-level EMI reduction by aligning switching frequencies across multiple SMPS. It also supports PSYNC (Pin 38) for power-state coordination between two MC33FS8500A0ESR2 devices or with external PMICs - a key feature for radar ECU designs requiring tight timing control.
What is the role of the VPRE controller in the MC33FS8500A0ESR2?
The VPRE controller in the MC33FS8500A0ESR2 is a synchronous buck controller driving external high- and low-side MOSFETs to generate a programmable intermediate rail (e.g., 3.3 V or 5.0 V) with up to 10 A peak current. It includes PRE_GHS/PRE_GLS gate drivers, PRE_FB feedback, and PRE_COMP compensation - allowing flexible, high-efficiency pre-regulation ahead of BUCK1 and LDOs in multi-rail automotive power trees.
How is power sequencing configured on the MC33FS8500A0ESR2?
Power sequencing on the MC33FS8500A0ESR2 is defined by OTP programming that assigns each regulator (VPRE, BUCK1, LDO1, LDO2) to one of six time slots (Slot 0–5), with configurable start/stop timing and soft-start ramp rates (e.g., 7.81 mV/µs for BUCK1). This enables deterministic, fault-tolerant boot sequences for radar SoCs - verified in NXP's FS84_FS85C datasheet Table 4.1 and Section 4.1 Main OTP flavors.
Can the MC33FS8500A0ESR2 be used in both 12 V and 24 V automotive systems?
Yes, the MC33FS8500A0ESR2 supports 4.9 V to 60 V DC input across VSUP1 and VSUP2 pins, making it compatible with both 12 V and 24 V battery architectures. External reverse-battery protection diodes are mandatory on both inputs per datasheet requirements. Its wide VIN range, ASIL D compliance, and thermal robustness (125 °C ambient) make MC33FS8500A0ESR2 suitable for under-hood and cabin-mounted ADAS modules.
MC33FS8500A0ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8500A0ESR2 FAQ
1.How can I place an order for MC33FS8500A0ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8500A0ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8500A0ESR2 reliable?
The price and inventory of MC33FS8500A0ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8500A0ESR2 is usually 5 days.
3.What payment methods are accepted for MC33FS8500A0ESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8500A0ESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33FS8500A0ESR2?
MC33FS8500A0ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8500A0ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8500A0ESR2?
For technical support, including MC33FS8500A0ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8500A0ESR2 requirements.
6.How does Aetrix verify that MC33FS8500A0ESR2 is sourced from the original manufacturer or authorized distributors?
All MC33FS8500A0ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8500A0ESR2 meets industry standards.
7.What is the process for return or replacement of MC33FS8500A0ESR2?
All MC33FS8500A0ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8500A0ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8500A0ESR2 part is unused and in its original packaging.
Return procedure for MC33FS8500A0ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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