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NXP Semiconductors MC33FS8500A0KS
- Part No.:
- MC33FS8500A0KS
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8500A0KS.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:4,159
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Product details
Overview
MC33FS8500A0KS from NXP Semiconductors is an ASIL D–compliant automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, one low-voltage integrated synchronous BUCK1 converter (1.35 V / 2.6 A), two LDOs (2.5 V / 400 mA and 3.3 V / 400 mA), and safety monitoring circuitry. It supports radar and ADAS domain controller power architectures with external frequency synchronization, fail-safe output, and SPI/I²C configuration.
For engineers reviewing the MC33FS8500A0KS datasheet, MC33FS8500A0KS pinout, MC33FS8500A0KS application, or MC33FS8500A0KS equivalent, key selection criteria include ASIL D compliance, VPRE controller capability, BUCK1 core supply specification, fail-safe state machine behavior, and HVQFN56 thermal-enhanced packaging for automotive under-hood environments.
Technical Context
The MC33FS8500A0KS implements a dual-domain safety architecture with independent monitoring circuitry, challenger watchdog, FCCU interface, and built-in self-test (ABIST/LBIST). Its power management state machine coordinates sequencing across VPRE, BUCK1, LDO1, and LDO2 with configurable startup slots and deep fail-safe autoretry (infinite cycles).
It integrates analog voltage supervision (VCOREMON, VMON1–VMON4), digital fault detection (ERRMON, FCCU1/2), and fail-safe output (FS0B) with open-drain structure. Power synchronization (PSYNC) enables coordinated operation with a second FS85 device or external PMIC, while FSYNC input/output supports EMC-optimized system-level clock alignment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Functional Safety | ISO 26262 ASIL D compliant; qualified per AEC-Q100 Grade 1 (−40 °C to +150 °C junction) |
| Input Voltage Range | 60 V DC max; supports 12 V and 24 V automotive battery systems with reverse-battery protection diodes on VSUP1/VSUP2 |
| VPRE Controller | Synchronous buck controller with external MOSFETs; supports up to 10 A peak current, configurable switching frequency |
| BUCK1 Converter | Integrated synchronous buck; 1.35 V output, 2.6 A peak current, 2.22 MHz switching, SVS-capable for MCU core supply |
| LDO Outputs | LDO1: 2.5 V / 400 mA; LDO2: 3.3 V / 400 mA; both configurable, with independent thermal shutdown and DFS response |
| Interface | 32-bit SPI or I²C (0x20 address); CRC-protected communication; debug mode entry via DBG pin |
| Quiescent Current | 10 µA typical in OFF mode (power-down), enabling low-power wake-up architectures |
Pinout & Package
HVQFN56 plastic thermal-enhanced very thin quad flat package; 8 mm × 8 mm × 0.85 mm body; 0.5 mm pitch; wettable flank (dimple type for KS suffix); exposed pad (EP) connected to GND for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP1 / VSUP2 | Main power inputs | Dual 60 V-rated inputs requiring external reverse-battery protection diodes; feed internal bias and regulators |
| BUCK1_IN / BUCK1_SW / BUCK1_FB | BUCK1 power path | Input, switching node, and feedback for integrated 1.35 V / 2.6 A MCU core supply |
| LDO1 / LDO2 | Linear regulator outputs | 2.5 V / 400 mA and 3.3 V / 400 mA outputs for MCU I/O and ADC supply; each with independent monitoring |
| VCOREMON / VMON1–VMON4 | Analog monitoring inputs | Four dedicated voltage supervision inputs; VCOREMON tied to BUCK1 output for core rail monitoring |
| FS0B | Fail-safe output | Active-low open-drain fail-safe signal; asserts during detected faults to trigger system-level safety actions |
| PSYNC | Power sync I/O | Configurable as input or output to synchronize power-up sequencing between two FS85 devices or with external PMIC |
| SPI/I²C pins (MISO/MOSI/SCLK/CSB, SCL/SDA) | Configuration interface | Supports secure, CRC-protected register access and OTP programming in engineering mode |
| WAKE1 / WAKE2 | Wake-up inputs | Two analog/digital wake sources with external series resistor support for global wake capability |
Key Features
| Feature | Design Value |
|---|---|
| ASIL D Safety Architecture | Dedicated fail-safe state machine, challenger watchdog, FCCU interface, and ABIST/LBIST enable full ISO 26262 decomposition for domain controller safety goals |
| Multi-Rail Power Integration | Combines high-side VPRE controller, BUCK1 core supply, and dual LDOs in single HVQFN56 package-reducing board area vs discrete solutions |
| EMC Optimization | SMPS frequency synchronization (FIN/FOUT), spread spectrum, slew rate control, and manual tuning reduce conducted/radiated emissions in radar/ADAS systems |
| Configurable Power Sequencing | Independent start/stop slot assignment per regulator (e.g., BUCK1 in Slot 1, LDO1 in Slot 5) enables precise timing for complex SoC boot sequences |
| OTP Programmability | Factory-programmed non-volatile configuration (voltage, sequencing, supervision thresholds); engineering-mode emulation supported via GUI and socketed EVB |
Applications
| Radar Sensor Power Supply | ADAS Domain Controller |
|---|---|
Use Scenario: Powers NXP S32R274/S32R294 radar SoCs in corner or imaging radar modules with strict EMI and functional safety requirements. IC Role / Device Role / Timing Role: Provides VPRE-controlled 5.0 V/5.74 V for RF front-end, BUCK1 1.35 V for radar processor core, and LDOs for PHY and ADC rails. Use Value: Enables single-chip ASIL D power solution with synchronized SMPS clocks to meet CISPR-25 Class 5 emission limits and ISO 26262 FMEDA targets. | Use Scenario: Supplies multi-core domain controllers (e.g., S32G) requiring tightly sequenced, monitored rails for CPU, GPU, and high-speed interfaces. IC Role / Device Role / Timing Role: Delivers BUCK1 (1.35 V), LDO1 (2.5 V), LDO2 (3.3 V), and VPRE-derived voltages with slot-based sequencing and real-time voltage supervision. Use Value: Reduces external supervision IC count by integrating PGOOD, RSTB, FS0B, and four VMON inputs-cutting BOM cost and layout complexity. |
| Vision System Power Management | Infotainment Head Unit |
Use Scenario: Powers S32V-based mono/stereo camera modules where thermal density and EMI must be minimized near image sensors. IC Role / Device Role / Timing Role: Generates quiet LDO outputs (2.5 V/3.3 V) for image sensor I/O and ADC, with BUCK1 supplying 1.35 V core voltage and VPRE enabling flexible auxiliary rails. Use Value: Low-noise LDOs and slew-controlled SMPS switching prevent sensor pixel noise; thermal-enhanced HVQFN56 sustains 150 °C junction temperature. | Use Scenario: Supplies infotainment SoCs (e.g., i.MX8) in head units requiring robust 12 V/24 V input handling and fail-safe reset coordination. IC Role / Device Role / Timing Role: Manages main SoC core (BUCK1), I/O (LDO1/LDO2), and CAN transceiver (via VPRE) with fail-safe output triggering MCU reset on critical fault. Use Value: Integrates RSTB, PGOOD, and FS0B into one device-eliminating discrete reset supervisors and simplifying ASIL-B partitioning for display/audio subsystems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fail-safe power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8510A0KS | Includes BUCK3 (1.2 V / 2.6 A) in addition to BUCK1, LDO1/LDO2, and VPRE controller; same ASIL D rating and HVQFN56 package | Required when third SMPS rail is needed-for example, to power DDR memory or auxiliary processors in domain controllers | Select MC33FS8510A0KS if BUCK3 is required; otherwise MC33FS8500A0KS reduces cost and layout area |
| MC33FS8400G0KS | ASIL B–rated variant with identical pinout, BUCK1, LDOs, and VPRE controller-but lacks FCCU, challenger WD, and deep fail-safe autoretry | Suitable for non-safety-critical sub-systems (e.g., HVAC control, body electronics) where ASIL D is not mandated | Choose MC33FS8400G0KS only for ASIL B designs; MC33FS8500A0KS is mandatory for ASIL D radar/ADAS use cases |
Compared with MC33FS8510A0KS, MC33FS8500A0KS eliminates BUCK3 to reduce silicon area, cost, and thermal load-ideal for radar SoC core+IO supply only. Versus MC33FS8400G0KS, it adds full ASIL D monitoring, fail-safe state machine, and infinite autoretry-enabling compliance with ISO 26262 Part 5 hardware safety requirements.
Availability
MC33FS8500A0KS is available at Aetrix Electronics and suitable for radar sensor modules, ADAS domain controllers, and vision systems requiring stable component supply, long-term automotive lifecycle support, and ASIL D–certified power management.
Supply support for MC33FS8500A0KS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The FS85 product line delivers ASIL D–compliant system basis chips for next-generation radar, vision, and domain controller platforms-designed to consolidate power, safety, and communication functions into a single automotive-grade IC.
FAQ
What is the primary safety certification level of the MC33FS8500A0KS?
The MC33FS8500A0KS is developed and qualified to ISO 26262 ASIL D-the highest automotive functional safety integrity level-and certified per AEC-Q100 Grade 1 (−40 °C to +150 °C). Its safety features include a dedicated fail-safe state machine, challenger watchdog, FCCU interface, and ABIST/LBIST diagnostics, all validated for use in radar and ADAS domain controller applications.
Does the MC33FS8500A0KS include integrated switching regulators beyond the VPRE controller?
Yes, the MC33FS8500A0KS integrates one low-voltage synchronous buck converter (BUCK1) delivering 1.35 V at up to 2.6 A peak current for MCU core supply, plus two linear regulators (LDO1: 2.5 V / 400 mA; LDO2: 3.3 V / 400 mA) for I/O and ADC rails. It does not include BUCK2 or BUCK3-those are present only in higher-variant FS85 parts like MC33FS8510A0KS.
How is power sequencing controlled on the MC33FS8500A0KS?
Power sequencing on the MC33FS8500A0KS is configured via OTP programming and executed by its internal state machine. Each regulator (VPRE, BUCK1, LDO1, LDO2) is assigned to a specific startup/stop slot (e.g., BUCK1 in Slot 1, LDO1 in Slot 5), enabling precise timing alignment with SoC boot requirements. Sequencing is fully deterministic and safety-monitored-no external timing components are needed.
What interface options are supported for configuring the MC33FS8500A0KS?
The MC33FS8500A0KS supports both 32-bit SPI and I²C interfaces for register access and configuration, with CRC protection on all transactions. The I²C address is fixed at 0x20. Debug mode entry is enabled via the DBG pin, and OTP programming is performed in engineering mode using NXP's GUI and socketed evaluation board-production programming is restricted to NXP or authorized partners.
Can the MC33FS8500A0KS synchronize switching frequencies with other power ICs in the system?
Yes, the MC33FS8500A0KS supports system-level EMC optimization through frequency synchronization: FIN accepts an external clock (e.g., from MCU or master oscillator), and FOUT provides a synchronized output signal. Additionally, PSYNC enables bidirectional power sequencing coordination with a second FS85 device or external PMIC-ensuring aligned switching edges to minimize beat frequencies and radiated emissions.
MC33FS8500A0KS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8500A0KS FAQ
1.How can I place an order for MC33FS8500A0KS through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8500A0KS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8500A0KS reliable?
The price and inventory of MC33FS8500A0KS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8500A0KS is usually 5 days.
3.What payment methods are accepted for MC33FS8500A0KS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8500A0KS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33FS8500A0KS?
MC33FS8500A0KS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8500A0KS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8500A0KS?
For technical support, including MC33FS8500A0KS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8500A0KS requirements.
6.How does Aetrix verify that MC33FS8500A0KS is sourced from the original manufacturer or authorized distributors?
All MC33FS8500A0KS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8500A0KS meets industry standards.
7.What is the process for return or replacement of MC33FS8500A0KS?
All MC33FS8500A0KS units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8500A0KS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8500A0KS part is unused and in its original packaging.
Return procedure for MC33FS8500A0KS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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