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NXP Semiconductors MC33FS8500A0KSR2
- Part No.:
- MC33FS8500A0KSR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8500A0KSR2.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:2,555
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Product details
Overview
MC33FS8500A0KSR2 from NXP Semiconductors is an ASIL D–compliant automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, one low-voltage integrated synchronous BUCK1 (1.35 V/3.6 A), two LDOs (2.5 V/400 mA and 3.3 V/400 mA), BOOST converter (5.0 V/1.5 A), and comprehensive safety monitoring. It serves as the primary power management unit for radar and ADAS domain controllers requiring functional safety, EMC robustness, and multi-rail sequencing.
For engineers reviewing the MC33FS8500A0KSR2 datasheet, MC33FS8500A0KSR2 pinout, MC33FS8500A0KSR2 application, or MC33FS8500A0KSR2 equivalent, this device delivers deterministic fail-safe behavior, SPI/I²C-configurable regulation, frequency synchronization (FIN/FOUT), PSYNC support for multi-device coordination, and ISO 26262-compliant diagnostics including ABIST, watchdog, PGOOD, RSTB, and dedicated fault reporting via INTB and FS0B.
Technical Context
The MC33FS8500A0KSR2 implements a hierarchical safety architecture with independent monitoring circuitry, challenger watchdog, FCCU interface for MCU error detection, and fail-safe state machine driving open-drain FS0B output. Its power management includes VPRE controller with external MOSFET gate drivers (PRE_GHS/PRE_GLS), BUCK1 core supply with SVS capability, and dual LDOs for MCU I/O and ADC rails.
It supports 60 V DC input for 12 V/24 V automotive systems, OFF-mode quiescent current of 10 µA, and EMC optimization via spread spectrum, slew rate control, and manual frequency tuning. Power-up sequencing is configurable per regulator slot, and OTP programming defines BUCK/LDO voltages, current limits, and safety feature enablement.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Functional Safety Level | ASIL D compliant per ISO 26262, with built-in self-test (ABIST/LBIST), fail-safe output (FS0B), and dedicated monitoring interfaces (FCCU1/FCCU2, ERRMON) |
| Input Voltage Range | 60 V DC max - supports reverse-battery-protected 12 V and 24 V automotive battery rails (VSUP1/VSUP2) |
| VPRE Controller | Synchronous buck controller with high-side/low-side gate drivers (PRE_GHS/PRE_GLS); supports external MOSFETs up to 10 A peak current |
| BUCK1 Output | 1.35 V @ 3.6 A peak - dedicated MCU core supply with SVS (supply voltage supervision) and soft-start (7.81 mV/µs) |
| LDO Outputs | LDO1: 2.5 V / 400 mA; LDO2: 3.3 V / 400 mA - independently configurable for MCU I/O and analog subsystems |
| Communication Interface | SPI or I²C (address 0x20), with CRC protection, supporting full register access, OTP configuration, and real-time status reporting |
| EMC Features | Frequency synchronization (FIN/FOUT), spread spectrum modulation, slew rate control, and manual frequency tuning (455 kHz or 2.22 MHz options) |
Pinout & Package
MC33FS8500A0KSR2 is housed in a HVQFN56 package (8 mm × 8 mm × 0.85 mm, 0.5 mm pitch, wettable flank), thermally enhanced with exposed pad (EP) connected to GNDFS/GND. Pin count and function mapping align with the FS85 superset pinout (FS8530).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP1 / VSUP2 | Main power inputs | Reverse-battery-protected 12 V/24 V supply inputs; require external series diodes |
| PRE_GHS / PRE_GLS | VPRE gate drivers | High-side and low-side gate drive outputs for external MOSFETs in VPRE buck stage |
| BUCK1_SW / BUCK1_FB | Core regulator switching node & feedback | Switching node connects to external inductor; FB sets 1.35 V output with resistor divider |
| LDO1 / LDO2 | Linear regulator outputs | Stable 2.5 V and 3.3 V outputs for MCU I/O and analog subsystems; each rated 400 mA |
| FS0B | Fail-safe output | Active-low open-drain signal indicating safety violation; drives external fail-safe path or MCU interrupt |
| INTB / PGOOD / RSTB | Status and control outputs | Interrupt flag, power-good indicator (active-low), and reset signal (active-low) with VDDIO pull-up required |
| SPI/I²C pins (MISO/MOSI/SCLK/CSB, SCL/SDA) | Configuration interface | Full-duplex SPI or bidirectional I²C (0x20) for runtime reconfiguration, diagnostics, and OTP programming |
| VMON1–VMON4 | Voltage monitoring inputs | Analog inputs for supervising external rail voltages; used with internal comparators and fault timers (OV_DGLT/UV_DGLT) |
Key Features
| Feature | Design Value |
|---|---|
| ASIL D Safety Architecture | Dedicated fail-safe state machine, challenger watchdog, ABIST/LBIST, FCCU interface, and hardware-enforced fault response (e.g., FS0B assertion within <100 µs) |
| Multi-Rail Power Sequencing | Configurable start/stop slots per regulator (BUCK1, LDO1, LDO2, etc.), enabling precise timing for radar SoC boot-up and domain controller power-up |
| EMC-Optimized Switching | Integrated FIN/FOUT synchronization, spread spectrum, and programmable slew rate control reduce conducted/radiated emissions in dense ADAS ECU layouts |
| Low-Power OFF Mode | 10 µA typical quiescent current in OFF mode - enables always-on wake-up capability while meeting automotive standby power budgets |
| OTP Programmability | Factory-programmed non-volatile configuration for BUCK/LDO voltages, current limits, safety thresholds, and sequencing - eliminates external configuration components |
| Robust Monitoring Suite | Four independent VMON inputs, VCOREMON, VDDIOMON, thermal shutdown (TSD), and fault recovery logic with configurable retry count (infinite or x15) |
Applications
| Radar Sensor Power Management | ADAS Domain Controller SBC |
|---|---|
|
Use Scenario: Powers NXP S32R274/S32R294 radar SoCs in corner or imaging radar modules, managing VPRE, core, I/O, and PHY rails under ASIL D requirements. IC Role / Device Role / Timing Role: Primary system basis chip providing regulated VPRE (3.3 V), BUCK1 (1.35 V), LDO1 (2.5 V), LDO2 (3.3 V), and BOOST (5.0 V) with synchronized startup and fail-safe signaling. Use Value: Enables single-chip power + safety solution eliminating discrete PMIC + monitor combinations, reducing BOM count and PCB area by >30% versus legacy designs. |
Use Scenario: Supplies multi-core MCU (e.g., S32Z/S32E), CAN transceivers, Ethernet PHYs, and sensor interfaces in centralized ADAS domain controllers. IC Role / Device Role / Timing Role: Centralized power manager with PSYNC support for coordinating multiple FS85 devices, ensuring deterministic inter-rail timing and synchronized frequency modulation across subsystems. Use Value: Delivers deterministic power sequencing, real-time fault reporting via INTB/FS0B, and diagnostic coverage exceeding 90% - critical for ASIL D decomposition in domain architecture. |
| Vision System Power Hub | Automotive Infotainment SBC |
|
Use Scenario: Powers NXP S32V-based mono/stereo camera modules with precise voltage ramp rates, SVS on core rail, and low-noise LDOs for image sensor analog front-end. IC Role / Device Role / Timing Role: Dual-role SBC delivering BUCK1 (1.025–1.35 V) for vision SoC core, LDO2 (3.3 V) for MIPI CSI-2 interface, and BOOST (5.0 V) for USB PHY, all with soft-start and UV/OV monitoring. Use Value: Achieves <±1% output regulation and <10 µs fault response time - essential for preventing image corruption during transient load steps or brownouts. |
Use Scenario: Manages power for infotainment head units with application processors, display drivers, audio codecs, and connectivity modules (Wi-Fi/BT). IC Role / Device Role / Timing Role: Configurable multi-output SBC supplying 1.2 V/1.8 V/3.3 V/5.0 V rails with independent sequencing, thermal derating, and wake-up via WAKE1/WAKE2 pins. Use Value: Supports rapid wake-from-sleep (<100 ms) and ultra-low OFF-mode current (10 µA), meeting OEM requirements for ignition-off power consumption <20 µA. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive fail-safe power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8510A0KSR2 | Includes BUCK3 (1.2 V/2.6 A) in addition to BUCK1, LDO1/LDO2, and BOOST; same ASIL D compliance and pinout | Required when third SMPS rail needed for auxiliary SoC or memory subsystem (e.g., LPDDR4 termination) | Select when design requires three independent SMPS outputs; otherwise MC33FS8500A0KSR2 reduces cost and layout complexity |
| MC33FS8430G0KSR2 | ASIL B–rated variant with identical pinout, BUCK1/LDO/BOOST functionality, but reduced safety feature set (no FCCU, limited ABIST) | Suitable for non-safety-critical sub-systems (e.g., body control modules, HVAC) where ASIL D is not mandated | Choose for cost-sensitive ASIL B applications; not suitable for radar/vision where ASIL D is required by ISO 26262 |
Compared with MC33FS8510A0KSR2, MC33FS8500A0KSR2 omits BUCK3 to lower bill-of-materials and simplify layout, while retaining full ASIL D safety integrity for radar core power. Against MC33FS8430G0KSR2, it provides certified ASIL D diagnostics, fail-safe output, and FCCU monitoring-essential for safety-critical ADAS functions.
Availability
MC33FS8500A0KSR2 is available at Aetrix Electronics and suitable for radar sensor modules, ADAS domain controllers, and vision systems requiring stable component supply, long-term automotive qualification, and ISO 26262-compliant power management.
Supply support for MC33FS8500A0KSR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure, reliable, and energy-efficient automotive, industrial, and IoT solutions.
The FS85 product line delivers ASIL D–compliant system basis chips for next-generation ADAS and autonomous driving platforms, integrating power conversion, functional safety, and communication interfaces into single-package solutions.
FAQ
What is the safety qualification status of the MC33FS8500A0KSR2?
The MC33FS8500A0KSR2 is developed in full compliance with ISO 26262 for ASIL D applications and qualified per AEC-Q100 Grade 1 (−40 °C to +125 °C). It includes hardware-based safety mechanisms such as ABIST, LBIST, challenger watchdog, FCCU interface, and fail-safe output (FS0B) with documented diagnostic coverage metrics in the safety manual.
Does the MC33FS8500A0KSR2 support both SPI and I²C interfaces simultaneously?
No - the MC33FS8500A0KSR2 supports either SPI or I²C, selected at power-up via hardware strapping or OTP configuration. The default I²C address is 0x20; SPI uses standard four-wire protocol (MISO/MOSI/SCLK/CSB) with CRC-protected transactions. Both interfaces provide full register access and OTP programming capability.
What are the key differences between MC33FS8500A0KSR2 and MC33FS8510A0KSR2?
The MC33FS8500A0KSR2 integrates VPRE controller, BUCK1, BOOST, LDO1, and LDO2. The MC33FS8510A0KSR2 adds a third SMPS (BUCK3) for auxiliary rail generation. Both share identical ASIL D safety architecture, pinout, and OTP programming model - BUCK3 is the sole functional expansion in the latter.
How does the MC33FS8500A0KSR2 handle thermal overload conditions?
Upon detecting die temperature exceeding threshold (TSD), the MC33FS8500A0KSR2 initiates per-regulator shutdown: BUCK1, BOOST, LDO1, and LDO2 enter safe state with controlled discharge, while FS0B asserts active-low. Recovery is configurable - infinite retry or fixed x15 attempts - and monitored via INTB and status registers accessible over SPI/I²C.
Can the MC33FS8500A0KSR2 be used in 24 V commercial vehicle applications?
Yes - the MC33FS8500A0KSR2 supports up to 60 V DC input and is qualified for automotive Grade 1 operation (−40 °C to +125 °C). Its VSUP1/VSUP2 inputs accept reverse-battery-protected 24 V systems, and its VPRE controller and BUCK1 are designed for stable regulation across wide input transients (e.g., load dump up to 60 V), making it suitable for trucks and off-highway vehicles.
MC33FS8500A0KSR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8500A0KSR2 FAQ
1.How can I place an order for MC33FS8500A0KSR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8500A0KSR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8500A0KSR2 reliable?
The price and inventory of MC33FS8500A0KSR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8500A0KSR2 is usually 5 days.
3.What payment methods are accepted for MC33FS8500A0KSR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8500A0KSR2 transactions.
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4.How is shipping managed for MC33FS8500A0KSR2?
MC33FS8500A0KSR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8500A0KSR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8500A0KSR2?
For technical support, including MC33FS8500A0KSR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8500A0KSR2 requirements.
6.How does Aetrix verify that MC33FS8500A0KSR2 is sourced from the original manufacturer or authorized distributors?
All MC33FS8500A0KSR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8500A0KSR2 meets industry standards.
7.What is the process for return or replacement of MC33FS8500A0KSR2?
All MC33FS8500A0KSR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8500A0KSR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8500A0KSR2 part is unused and in its original packaging.
Return procedure for MC33FS8500A0KSR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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