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NXP Semiconductors MC33FS8510A0KS

Part No.:
MC33FS8510A0KS
Manufacturer:
NXP Semiconductors
Category:
Power Management - Specialized
Package:
56-VFQFN Exposed Pad
Datasheet:
AetrixMC33FS8510A0KS.pdf
Description:
SAFETY POWER MANAGEMENT IC, QFN5
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,522

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Product details

Overview

MC33FS8510A0KS from NXP Semiconductors is an ASIL D–compliant automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, three low-voltage synchronous buck converters (BUCK1/BUCK2/BUCK3), one boost converter, and two LDOs. It delivers up to 3.6 A peak per buck rail, supports 60 V DC input, and features SPI/I²C control with CRC, fail-safe output (FS0B), and power-good/reset signaling - deployed in radar and ADAS domain controllers.

For engineers reviewing the MC33FS8510A0KS datasheet, MC33FS8510A0KS pinout, MC33FS8510A0KS application, or MC33FS8510A0KS equivalent, this device requires attention to its OTP-configured BUCK1/BUCK3 voltage settings (1.025 V / 1.8 V), ASIL D safety monitoring architecture, HVQFN56 thermal-enhanced package, and dual wake-up inputs for ultra-low-power automotive subsystems.

Technical Context

The MC33FS8510A0KS implements a hierarchical safety architecture with dedicated FCCU monitoring inputs, ABIST/LBIST self-test, challenger watchdog, and deep fail-safe autoretry (infinite cycles). Its power management integrates independent sequencing slots (e.g., BUCK1 in Slot 0, BUCK3 in Slot 6) and dynamic voltage scaling with soft-start ramp rates of 7.81 mV/µs (BUCK1/BUCK2) and 10.41 mV/µs (BUCK3).

It supports external frequency synchronization via FIN/FOUT pins and PSYNC for multi-device coordination, employs slew-rate control and spread-spectrum modulation for EMC optimization, and uses configurable overvoltage/undervoltage detection windows (e.g., VCOREMON UVTH = 88.5%, OVTH = 109%) with programmable deglitch times (UV_DGLT = 5 µs, OV_DGLT = 25 µs).

Key Specifications

Parameter Value and Actual Design Meaning
Input Voltage Range 60 V DC max - supports 12 V and 24 V automotive battery systems with reverse-battery protection diodes on VSUP1/VSUP2.
BUCK1 Output 1.025 V @ 2.6 A peak - MCU core supply with SVS capability and TSD-triggered shutdown + DFS response.
BUCK3 Output 1.8 V @ 4.5 A peak - configurable low-voltage rail with 10.41 mV/µs soft-start and power sequencing in Slot 0.
LDO1/LDO2 5.0 V / 5.0 V @ 400 mA each - supplies MCU I/Os and ADC reference; both monitored with OV/UV detection.
Safety Certification ISO 26262 ASIL D compliant - qualified to AEC-Q100 Grade 1 (−40 °C to +125 °C), with fail-safe output FS0B and integrated PGOOD/RSTB.
Interface SPI or I²C (0x20 address) with CRC - enables secure configuration, real-time monitoring, and fault reporting to host MCU.
Quiescent Current 10 µA typ in OFF mode - enables long-term battery-disconnected operation in always-on vehicle subsystems.

Pinout & Package

HVQFN56 plastic thermal-enhanced very thin quad flat package; 8 mm × 8 mm × 0.85 mm body; 0.5 mm pitch; wettable flank (dimple type for KS suffix); exposed pad (EP) connected to GND for thermal and electrical integrity.

Pin/Terminal Circuit Role Design Meaning
VCOREMON (17) BUCK1 output monitor input Direct connection to BUCK1 feedback node enables precise core voltage supervision and SVS functionality.
FS0B (14) Fail-safe output driver Active-low open-drain signal indicating system-level fault; triggers external safety mechanisms upon detected failure.
PSYNC (38) Power sync I/O Enables synchronized switching across multiple MC33FS8510A0KS or with external PMICs to reduce system EMI peaks.
WAKE1/WAKE2 (1, 49) Dual wake-up inputs Analog/digital inputs with external series resistor support - initiate device wake from OFF mode on battery voltage threshold crossing.
FIN/FOUT (20, 24) Frequency sync interface Allows daisy-chained clock alignment of SMPS switching frequencies across multiple ICs for optimized EMC performance.
PGOOD (18), RSTB (19) Power status outputs Active-low signals pulled up to VDDIO - indicate stable regulation and assert MCU reset during undervoltage/fault conditions.

Key Features

Feature Design Value
ASIL D Safety Architecture Dedicated FCCU monitoring inputs, challenger watchdog, infinite-deep fail-safe autoretry, and ABIST/LBIST enable full ISO 26262 compliance without external safety controller.
Multi-Rail Power Sequencing Independent slot-based startup/shutdown control (e.g., BUCK1 Slot 0, BUCK3 Slot 0, LDO1 Slot 2) ensures deterministic power-up order for complex SoCs like S32R234.
EMC Optimization Integrated spread spectrum, slew rate control, manual frequency tuning, and FIN/FOUT synchronization reduce conducted/radiated emissions in radar and vision modules.
OTP-Configurable Regulation Factory-programmed BUCK1 (1.025 V), BUCK3 (1.8 V), LDO1/LDO2 (5.0 V), and safety thresholds eliminate external resistor networks and simplify layout.
Ultra-Low OFF-Mode Current 10 µA typical quiescent current enables >10-year battery standby in always-on ADAS sensors without compromising wake latency.

Applications

Radar Sensor Power Management ADAS Domain Controller Supply

Use Scenario: Powers NXP S32R234 radar MCU and TEF810x RF transceiver in 24 V corner radar modules.

IC Role / Device Role / Timing Role: Primary SBC delivering regulated BUCK1 (1.025 V core), BUCK3 (1.8 V I/O), LDO1/LDO2 (5.0 V analog/PHY), and fail-safe signaling.

Use Value: Enables ASIL D-compliant power delivery with <5 µs UV fault detection and infinite autoretry - critical for functional safety in automated emergency braking.

Use Scenario: Supplies NXP S32G274 gateway SoC in zonal architecture domain controllers.

IC Role / Device Role / Timing Role: Centralized power hub managing 6+ rails including VPRE (for external FETs), BUCK1/BUCK2/BUCK3, BOOST, and dual LDOs.

Use Value: Reduces BOM count by consolidating discrete regulators and safety monitors; PSYNC coordination eliminates EMI hotspots across multi-SoC domains.

Vision System Camera Module Battery Monitoring Unit (BMU)

Use Scenario: Powers S32V234 vision processor and image sensor in mono/stereo camera systems.

IC Role / Device Role / Timing Role: Provides BUCK1 (1.025 V core), BUCK3 (1.8 V MIPI), LDO1 (5.0 V sensor bias), and wake-on-motion via WAKE1/WAKE2.

Use Value: Achieves <100 µs wake latency from OFF mode and supports dynamic voltage scaling for AI inference workloads - extending runtime in battery-powered cameras.

Use Scenario: Supplies MCU, ADC, and isolated CAN transceiver in high-voltage battery packs.

IC Role / Device Role / Timing Role: Delivers isolated 5.0 V LDO2 for CAN PHY, monitors cell voltage via VMON1–VMON4, and asserts FS0B on overtemperature or undervoltage.

Use Value: Integrates four independent voltage monitors with 25 µs deglitch and failsafe output - replacing discrete supervisor ICs and reducing fault response time by 40%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive SBC applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC33FS8520A0KS Includes BUCK2 (1.8 V @ 4.5 A) in addition to BUCK1/BUCK3; same ASIL D certification and HVQFN56 package. Required when dual-core SoCs (e.g., S32G274) need separate 1.8 V rails for CPU and GPU domains. Select MC33FS8520A0KS if BUCK2 is needed; otherwise MC33FS8510A0KS reduces cost and layout complexity.
MC33FS8530A0KS Full superset: adds BUCK2 + BUCK3 + FCCU + enhanced VMONx coverage; identical OTP programming model and pinout. Used in imaging radar with S32R294 + TEF82xx where all three bucks and four VMON inputs are actively utilized. MC33FS8530A0KS offers maximum flexibility but increases bill-of-materials; MC33FS8510A0KS optimizes for cost-sensitive radar modules with fixed rail count.

Compared with MC33FS8520A0KS and MC33FS8530A0KS, the MC33FS8510A0KS provides optimal integration for ASIL D radar systems requiring only BUCK1 and BUCK3 - eliminating unused regulator circuitry while maintaining identical safety architecture, thermal performance, and PCB footprint.

Availability

MC33FS8510A0KS is available at Aetrix Electronics and suitable for radar sensor modules, ADAS domain controllers, and battery monitoring units requiring stable component supply across automotive production lifecycles.

Supply support for MC33FS8510A0KS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade power management.

The MC33FS8510A0KS belongs to NXP's FS85 family of fail-safe system basis chips, engineered specifically for ASIL D–compliant radar, vision, and domain controller power architectures - emphasizing safety integrity, EMC robustness, and seamless integration with NXP S32 processors.

FAQ

What is the primary safety certification level of the MC33FS8510A0KS?

The MC33FS8510A0KS is certified to ISO 26262 ASIL D and qualified per AEC-Q100 Grade 1 (−40 °C to +125 °C). Its safety architecture includes dedicated FCCU monitoring inputs, challenger watchdog, ABIST/LBIST, and infinite-deep fail-safe autoretry - enabling use as the sole safety element in radar and ADAS subsystems without external safety controllers.

Does the MC33FS8510A0KS support external frequency synchronization?

Yes, the MC33FS8510A0KS supports external frequency synchronization via dedicated FIN (pin 20) and FOUT (pin 24) pins, allowing alignment of switching frequencies across multiple devices. It also includes PSYNC (pin 38) for bidirectional power synchronization with other FS85 devices or external PMICs - a key feature for reducing system-level EMI in radar modules.

What are the configured output voltages for BUCK1 and BUCK3 on the MC33FS8510A0KS?

The MC33FS8510A0KS has factory-programmed OTP settings: BUCK1 delivers 1.025 V at up to 2.6 A peak for MCU core supply, and BUCK3 delivers 1.8 V at up to 4.5 A peak for I/O or interface rails. Both include dynamic voltage scaling, soft-start ramp rates (7.81 mV/µs for BUCK1, 10.41 mV/µs for BUCK3), and thermal shutdown with DFS response.

How does the MC33FS8510A0KS handle wake-up from ultra-low-power OFF mode?

The MC33FS8510A0KS supports wake-up from OFF mode (10 µA quiescent current) via two dedicated inputs - WAKE1 (pin 49) and WAKE2 (pin 1). Each accepts analog or digital wake signals with external series resistors; detection triggers fast power-up sequencing within <100 µs, making it ideal for motion-activated vision systems and always-on radar sensors.

Is the MC33FS8510A0KS pin-compatible with other FS85 family members?

Yes, all FS85 devices - including MC33FS8510A0KS, MC33FS8520A0KS, and MC33FS8530A0KS - are pin-to-pin and software compatible in the HVQFN56 package. This allows scalable design reuse: engineers can start with MC33FS8510A0KS and upgrade to higher-rail variants without PCB changes, preserving layout, firmware, and safety validation effort.

MC33FS8510A0KS Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
56-VFQFN Exposed Pad
Packaging:
Tray
Product Status:
Active
Applications:
System Basis Chip
Current - Supply:
15mA
Voltage - Supply:
60V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
56-HVQFN (8x8)

MC33FS8510A0KS FAQ

1.How can I place an order for MC33FS8510A0KS through Aetrix?

Please submit a Request for Quotation (RFQ) for MC33FS8510A0KS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC33FS8510A0KS reliable?

The price and inventory of MC33FS8510A0KS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8510A0KS is usually 5 days.

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MC33FS8510A0KS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC33FS8510A0KS order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC33FS8510A0KS?

For technical support, including MC33FS8510A0KS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8510A0KS requirements.

6.How does Aetrix verify that MC33FS8510A0KS is sourced from the original manufacturer or authorized distributors?

All MC33FS8510A0KS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8510A0KS meets industry standards.

7.What is the process for return or replacement of MC33FS8510A0KS?

All MC33FS8510A0KS units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8510A0KS, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC33FS8510A0KS part is unused and in its original packaging.

Return procedure for MC33FS8510A0KS:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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