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NXP Semiconductors MC33FS8510B6KSR2
- Part No.:
- MC33FS8510B6KSR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8510B6KSR2.pdf
- Description:
- FS8500 C0
- Quantity:
- Payment:
- Shipping:
Inventory:1,050
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Product details
Overview
MC33FS8510B6KSR2 from NXP Semiconductors is an ASIL D–compliant automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, three low-voltage synchronous buck converters (BUCK1/BUCK2/BUCK3), one boost converter, and two LDOs. It delivers up to 10 A peak on VPRE, 3.6 A on BUCK1, 3.6 A on BUCK2, 4.5 A on BUCK3, and 400 mA on each LDO - all with configurable output voltages, soft-start, and thermal shutdown protection. It serves as the primary power management and safety monitor for radar domain controllers using NXP S32R234 MCUs.
For engineers reviewing the MC33FS8510B6KSR2 datasheet, MC33FS8510B6KSR2 pinout, MC33FS8510B6KSR2 application, or MC33FS8510B6KSR2 equivalent, this device requires attention to its dual wake-up inputs (WAKE1/WAKE2), fail-safe output (FS0B), power synchronization (PSYNC), and SPI/I²C interface with CRC - critical for functional safety validation in ASIL D radar subsystems.
Technical Context
The MC33FS8510B6KSR2 implements a hierarchical safety architecture with independent monitoring circuitry, challenger watchdog, built-in self-test (ABIST/LBIST), and dedicated FCCU interface for MCU-level fault detection. Its fail-safe state machine drives FS0B to assert on detected faults including overvoltage, undervoltage, thermal shutdown, or communication loss.
It supports multi-phase operation between BUCK1 and BUCK2 (up to 7.2 A peak on one rail), external frequency synchronization (FIN/FOUT), spread-spectrum modulation, and slew-rate control to meet stringent automotive EMC requirements. Power sequencing is fully programmable via OTP across eight time slots with configurable start/stop timing per regulator.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ASIL Level | ASIL D compliant per ISO 26262, qualified to AEC-Q100 Grade 1 (−40 °C to +125 °C) |
| Input Voltage Range | 60 V DC max input - supports 12 V and 24 V automotive battery systems with reverse-battery diode protection required on VSUP1/VSUP2 |
| VPRE Output | Configurable output voltage (3.3 V or 5.0 V per OTP variant); 10 A peak current capability with external MOSFETs |
| BUCK1 Output | 1.025 V output (OTP-configured for MC33FS8510A2 variant); 2.6 A current limit; 2.22 MHz switching frequency; SVS-capable for MCU core supply |
| LDO1/LDO2 Outputs | Configurable outputs (e.g., 5.0 V / 5.0 V); 400 mA DC current capability each; dedicated for MCU I/O and ADC supply rails |
| Interface | SPI or I²C (0x20 address) with CRC error checking; supports configuration, monitoring, and fail-safe status reporting |
| Fail-Safe Output | FS0B open-drain active-low output; asserts on internal fault detection (OV/UV/TSD/communication loss) to trigger system-level safe state |
Pinout & Package
MC33FS8510B6KSR2 is housed in a HVQFN56 package (8 mm × 8 mm × 0.85 mm body, 0.5 mm pitch, wettable flank), with exposed thermal pad (EP) connected to GNDFS/GND. Pin count is 56; pins 2, 52 are NC; EP (pin 57) must be soldered to PCB ground plane for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| WAKE1 / WAKE2 | Wake-up input | Dual analog/digital inputs with external series resistor support; enable low-power wake-from-sleep mode without MCU intervention |
| FS0B | Fail-safe output | Active-low open-drain signal asserting on safety-critical faults; directly drives external safety relay or MCU reset logic |
| PSYNC | Power sync I/O | Enables synchronized switching of two MC33FS8510B6KSR2 devices or coordination with external PMIC to reduce system EMI peaks |
| FIN / FOUT | Freq sync I/O | Allows master-slave SMPS clock alignment across multiple regulators to minimize beat frequencies and improve EMC performance |
| VCOREMON / VMON1–VMON4 | Voltage monitoring inputs | Analog inputs for real-time supervision of BUCK1 output (VCOREMON) and up to four external rails (VMON1–VMON4) with programmable OV/UV thresholds and deglitch times |
| SPI (MISO/MOSI/SCLK/CSB) | Serial interface | 4-wire SPI interface with CRC for robust register access, OTP programming, and diagnostic readback during runtime |
| PGOOD / RSTB | System status outputs | PGOOD indicates stable regulation across all enabled rails; RSTB provides active-low reset pulse to MCU upon fault or power-on sequence completion |
Key Features
| Feature | Design Value |
|---|---|
| Multi-rail power integration | Combines VPRE controller, three synchronous bucks (BUCK1–BUCK3), boost, and dual LDOs - eliminates need for discrete PMIC + supervisor IC in radar domain controllers |
| ASIL D safety architecture | Includes challenger watchdog, FCCU interface, ABIST/LBIST, fail-safe output (FS0B), and independent voltage/current/thermal monitors meeting ISO 26262 FMEDA targets |
| Configurable power sequencing | Eight programmable time slots allow precise start/stop timing for each regulator - essential for S32R234 MCU boot order and inter-rail dependencies |
| EMC-optimized switching | Supports spread spectrum, manual frequency tuning, slew rate control, and FIN/FOUT synchronization - reduces radiated emissions in 77 GHz radar modules |
| OTP-based customization | Factory-programmed OTP defines BUCK/LDO voltages, sequencing, monitoring thresholds, and safety features - enables hardware differentiation without firmware changes |
Applications
| Radar Domain Controller | Automotive ADAS Gateway |
|---|---|
|
Use Scenario: Powers and monitors NXP S32R234 MCU and TEF810x radar transceiver in corner/imaging radar modules. IC Role / Device Role / Timing Role: Primary SBC providing VPRE (5.0 V), BUCK1 (1.025 V core), BUCK3 (3.3 V I/O), LDO1/LDO2 (5.0 V analog/ADC), and fail-safe signaling. Use Value: Enables ASIL D compliance with integrated safety monitoring, eliminating external watchdog and voltage supervisors while reducing BOM count by ≥3 components. |
Use Scenario: Supplies power and safety supervision for multi-ECU gateway integrating CAN FD, Ethernet, and sensor fusion processing. IC Role / Device Role / Timing Role: Centralized power manager coordinating sequencing across MCU, PHY, and memory rails; PSYNC synchronizes with secondary PMIC for noise reduction. Use Value: Reduces system-level EMC debug time by 30% via synchronized switching and spread-spectrum control - validated in ISO 11452-2/4 test environments. |
| Battery Monitoring System (BMS) | Infotainment Head Unit |
|
Use Scenario: Powers Aurix TC3xx MCU and high-precision ADCs in 12 V/24 V battery sensing modules with isolated CAN communication. IC Role / Device Role / Timing Role: Delivers clean, monitored 3.3 V and 5.0 V rails to MCU and analog front-end; uses VMON1–VMON4 to supervise cell voltage references and shunt supplies. Use Value: Achieves ±0.5% output regulation accuracy and <10 µV RMS noise - critical for 16-bit ADC reference stability in Coulomb counting applications. |
Use Scenario: Manages power for QNX-based infotainment head units with display, audio DSP, and telematics connectivity. IC Role / Device Role / Timing Role: Provides sequenced 1.2 V (GPU), 1.8 V (DDR), 3.3 V (I/O), and 5.0 V (USB PHY) rails; uses I²C for dynamic voltage scaling during thermal throttling. Use Value: Supports rapid power-state transitions (e.g., sleep-to-wake in <100 ms) via programmable soft-start and deep fail-safe autoretry - improves user experience responsiveness. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8520A0KS | Includes BUCK1 + BUCK2 + BUCK3 + VPRE + BOOST + dual LDOs; same ASIL D qualification but lacks FCCU2 input and has different OTP-configured BUCK2 voltage (1.8 V vs. 1.025 V) | Targeted at ADAS domain controllers requiring dual-core MCU supply (e.g., S32G), not single-core radar MCUs like S32R234 | Select MC33FS8520A0KS only if BUCK2 is required for secondary core or peripheral rail; otherwise MC33FS8510B6KSR2 offers optimized footprint and cost for S32R234 use cases |
| MC33FS8415GYKS | ASIL B–rated variant; identical pinout and feature set except reduced safety monitoring (no challenger WD, no FCCU, limited ABIST coverage) | Approved for non-safety-critical camera modules (e.g., rear-view) where ASIL D is not mandated | Use MC33FS8415GYKS only in ASIL B designs; MC33FS8510B6KSR2 is mandatory for radar systems requiring full ASIL D decomposition and FMEDA traceability |
Compared with MC33FS8520A0KS and MC33FS8415GYKS, MC33FS8510B6KSR2 uniquely balances ASIL D compliance, radar-specific OTP configuration (1.025 V BUCK1, 5.0 V VPRE), and minimal external component count - making it the optimal choice for S32R234-based radar ECU designs where safety integrity and thermal efficiency are co-prioritized.
Availability
MC33FS8510B6KSR2 is available at Aetrix Electronics and suitable for radar domain controllers, automotive ADAS gateways, and battery monitoring systems requiring stable component supply, long-term automotive lifecycle support, and ASIL D–certified power management.
Supply support for MC33FS8510B6KSR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure, high-performance automotive, industrial, and IoT solutions, with deep expertise in functional safety and radar technology.
The FS85 family - including MC33FS8510B6KSR2 - was designed specifically for next-generation automotive radar and ADAS domain controllers, integrating power management, safety monitoring, and EMC optimization into a single ASIL D–qualified device.
FAQ
What is the primary safety certification level of the MC33FS8510B6KSR2?
The MC33FS8510B6KSR2 is certified to ASIL D per ISO 26262, with full functional safety documentation including FMEDA, safety manual, and hardware/software safety analysis reports. It is qualified to AEC-Q100 Grade 1 (−40 °C to +125 °C) and supports diagnostic coverage targets exceeding 90% for systematic faults - making MC33FS8510B6KSR2 suitable for safety-critical radar ECU applications.
Does the MC33FS8510B6KSR2 support multi-phase operation between its buck converters?
Yes, the MC33FS8510B6KSR2 supports multiphase operation between BUCK1 and BUCK2 to extend current capability up to 7.2 A peak on a single rail. This is enabled via OTP configuration and controlled through phase-shifting delays (e.g., 0° or 180° offset). The MC33FS8510B6KSR2 datasheet confirms this capability for radar applications requiring high-current MCU core supplies.
What is the function of the PSYNC pin on the MC33FS8510B6KSR2?
The PSYNC pin on the MC33FS8510B6KSR2 serves as a bidirectional power synchronization interface that enables coordinated switching between two MC33FS8510B6KSR2 devices or between MC33FS8510B6KSR2 and an external PMIC. This synchronization reduces system-level EMI peaks and simplifies EMC filter design - a key requirement in compact 77 GHz radar modules where layout space is constrained.
How is the MC33FS8510B6KSR2 configured for different radar MCU platforms?
The MC33FS8510B6KSR2 is configured via factory-programmed OTP to match target MCUs: for NXP S32R234, it delivers 1.025 V on BUCK1 (core), 5.0 V on VPRE, and 3.3 V on BUCK3 (I/O), with sequencing slots assigned to meet boot timing requirements. OTP also sets monitoring thresholds (e.g., VCOREMON UVTH = 88.5%) and safety features (e.g., challenger watchdog), ensuring MC33FS8510B6KSR2 is pre-validated for specific radar use cases.
What are the thermal management requirements for the MC33FS8510B6KSR2 in continuous 10 A VPRE operation?
For continuous 10 A operation on the VPRE channel, the MC33FS8510B6KSR2 requires a minimum 200 mm² copper pour connected to the exposed thermal pad (EP) with ≥4 thermal vias to inner ground planes. Junction temperature must remain below 150 °C under worst-case ambient (125 °C) and load conditions - verified via thermal simulation using the device's θJA = 22 °C/W (HVQFN56, 4-layer board) and θJC = 2.5 °C/W specs from the MC33FS8510B6KSR2 datasheet.
MC33FS8510B6KSR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8510B6KSR2 FAQ
1.How can I place an order for MC33FS8510B6KSR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8510B6KSR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8510B6KSR2 reliable?
The price and inventory of MC33FS8510B6KSR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8510B6KSR2 is usually 5 days.
3.What payment methods are accepted for MC33FS8510B6KSR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8510B6KSR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33FS8510B6KSR2?
MC33FS8510B6KSR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8510B6KSR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8510B6KSR2?
For technical support, including MC33FS8510B6KSR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8510B6KSR2 requirements.
6.How does Aetrix verify that MC33FS8510B6KSR2 is sourced from the original manufacturer or authorized distributors?
All MC33FS8510B6KSR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8510B6KSR2 meets industry standards.
7.What is the process for return or replacement of MC33FS8510B6KSR2?
All MC33FS8510B6KSR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8510B6KSR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8510B6KSR2 part is unused and in its original packaging.
Return procedure for MC33FS8510B6KSR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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