NXP Semiconductors MC33FS8510C4ESR2
- Part No.:
- MC33FS8510C4ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8510C4ESR2.pdf
- Description:
- PMIC, SAFETY, 2 BUCKS
- Quantity:
- Payment:

- Shipping:

Inventory:4,736
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Product details
Overview
MC33FS8510C4ESR2 from NXP Semiconductors is an ASIL D–compliant automotive fail-safe system basis chip (SBC) with integrated VPRE buck controller, three synchronous buck converters (BUCK1/BUCK2/BUCK3), one boost converter, and two LDOs. It delivers up to 3.6 A peak on BUCK1, supports 60 V DC input, features SPI/I²C interface with CRC, and targets radar systems with NXP S32R234 MCU.
For engineers reviewing the MC33FS8510C4ESR2 datasheet, MC33FS8510C4ESR2 pinout, MC33FS8510C4ESR2 application, or MC33FS8510C4ESR2 equivalent, key selection criteria include ASIL D safety certification, multi-rail power sequencing control, fail-safe output (FS0B), frequency synchronization (FIN/FOUT), and OTP-configurable regulator voltages and current limits for radar domain controllers.
Technical Context
The MC33FS8510C4ESR2 implements a hierarchical safety architecture with dedicated monitoring circuitry, challenger watchdog, FCCU inputs, and built-in self-test (ABIST/LBIST). Its power management state machine coordinates startup sequencing across six configurable slots, enabling precise timing of BUCK1 (VCORE), BUCK3 (1.35 V), LDO1 (3.3 V), and LDO2 (3.3 V) activation per radar subsystem requirements.
It integrates analog voltage supervision (VCOREMON, VDDIOMON, VMON1–VMON4) with programmable over/under-voltage thresholds and deglitch times, plus fail-safe output driver capable of driving external safety relays or MCU reset chains. The device supports external frequency synchronization and spread-spectrum modulation to meet stringent automotive EMC requirements in 77 GHz radar front-ends.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ASIL Level | ASIL D compliant per ISO 26262, qualified to AEC-Q100 Grade 1 |
| Input Voltage Range | 60 V DC max input supports 12 V and 24 V automotive battery rails |
| BUCK1 Output | 1.35 V @ 3.6 A peak, dedicated to S32R234 MCU core supply with SVS capability |
| BUCK3 Output | 1.35 V @ 2.6 A peak, configured for radar sensor analog/digital supply |
| LDO Outputs | Two 400 mA LDOs: LDO1 = 3.3 V, LDO2 = 3.3 V for MCU I/O and ADC reference |
| Interface | SPI or I²C with CRC error detection; I²C address 0x20 |
| Fail-Safe Output | FS0B open-drain active-low output for system-level fault escalation |
| Power Sync | PSYNC pin enables synchronized operation with second FS85 or external PMIC |
Pinout & Package
MC33FS8510C4ESR2 uses HVQFN56 package: plastic thermal enhanced very thin quad flat package, 8 mm × 8 mm × 0.85 mm body, 0.5 mm pitch, wettable flank (ES suffix), exposed pad for thermal and ground connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP1 / VSUP2 | Main power inputs | Accept 60 V DC input; require external reverse-battery diodes |
| BUCK1_SW / BUCK2_SW / BUCK3_SW | Switching nodes | Drive external inductors; BUCK1_SW connects to S32R234 VCORE |
| VCOREMON / VDDIOMON | Core & I/O voltage monitors | Direct feedback to internal supervision circuits; VCOREMON tied to BUCK1 output |
| FS0B | Fail-safe output | Active-low open-drain signal for triggering MCU safety shutdown or external relay |
| FIN / FOUT | Frequency sync I/O | Enables synchronized switching across multiple FS85 devices to reduce EMI peaks |
| PSYNC | Power sync I/O | Configurable as input or output to coordinate startup/shutdown timing with companion PMIC |
| WAKE1 / WAKE2 | Wake-up inputs | Support low-power OFF mode (10 µA quiescent); detect battery wake events |
| SCL / SDA / MISO / MOSI / SCLK / CSB | Digital interfaces | Full SPI and I²C support with CRC; enable configuration, monitoring, and diagnostics |
Key Features
| Feature | Design Value |
|---|---|
| OTP-programmable regulators | BUCK1/BUCK3/LDO1/LDO2 voltages, current limits, and sequencing slots pre-configured at factory for S32R234 radar use case |
| Multi-phase BUCK1+BUCK2 capability | Extends total current delivery to 7.2 A peak on single rail when enabled - supports high-power radar SoC cores |
| EMC optimization suite | Includes spread spectrum, slew rate control, manual frequency tuning, and FIN/FOUT synchronization for CISPR-25 Class 5 compliance |
| Deep fail-safe autoretry | Infinite retry attempts on critical faults (e.g., TSD, OV/UV) before asserting permanent FS0B deactivation |
| Scalable safety monitoring | Dedicated FCCU1/FCCU2 inputs, ERRMON, and ABIST/LBIST enable layered diagnostic coverage for ASIL D decomposition |
| OFF mode ultra-low IQ | 10 µA typical quiescent current enables always-on radar wake functionality without battery drain |
Applications
| Radar Sensor Power Management | ADAS Domain Controller Supply |
|---|---|
Use Scenario: Powers 77 GHz radar transceiver (e.g., TEF810x) and S32R234 MCU in corner radar module. IC Role / Device Role / Timing Role: Primary SBC providing sequenced VCORE (1.35 V), VDDIO (3.3 V), and analog supply (1.35 V) with fail-safe assertion on sensor fault. Use Value: Enables ASIL D-compliant power delivery with <250 µs fault response time and synchronized switching to meet CISPR-25 radiated emissions limits. | Use Scenario: Supplies central ADAS domain controller integrating camera, radar, and V2X processing units. IC Role / Device Role / Timing Role: Centralized multi-rail power source coordinating startup of heterogeneous SoCs via six-slot sequencing engine. Use Value: Reduces board area by consolidating eight discrete regulators; PSYNC pin allows tight timing alignment with companion PF82 PMIC. |
| Vision System with Safety Monitoring | Automotive Infotainment Power Hub |
Use Scenario: Powers stereo camera module with S32V234 processor and image signal processor (ISP). IC Role / Device Role / Timing Role: Provides isolated, monitored 1.2 V (BUCK3), 1.8 V (BUCK2), and 3.3 V (LDO1/LDO2) rails with voltage supervision on all outputs. Use Value: Delivers functional safety evidence via VCOREMON/VDDIOMON monitoring and PGOOD assertion, satisfying ISO 26262 hardware metrics for ASIL B subsystems. | Use Scenario: Supplies head unit MCU, display driver, audio codec, and USB PHY in premium infotainment system. IC Role / Device Role / Timing Role: High-efficiency SBC delivering 5 V (BOOST), 3.3 V (LDOs), and 1.8 V (BUCK2) with thermal derating and brown-out protection. Use Value: Maintains stable operation during cold-crank (4.9 V VSUP threshold) and load-dump (60 V tolerance), eliminating need for external TVS clamping. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fail-safe SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8510A2ESR2 | Same ASIL D rating; BUCK1 = 1.025 V (vs. 1.35 V), BUCK3 = 1.8 V (vs. 1.35 V), LDO1 = 5.0 V (vs. 3.3 V) | Targeted for domain controllers with different SoC core voltage requirements (e.g., S32G) | Select MC33FS8510A2ESR2 only if SoC core voltage is 1.025 V and I/O rail requires 5.0 V |
| MC33FS8415GJESR2 | ASIL B rated; same pinout; BUCK1 = 0.825 V, no BUCK3, LDO1 = 1.8 V, includes TEF810x-specific OTP settings | Optimized for cost-sensitive 12 V/24 V radar with S32R294 + TEF810x, lacking full ASIL D diagnostics | Choose MC33FS8415GJESR2 for non-safety-critical radar modules where ASIL D is not mandated |
Compared with MC33FS8510A2ESR2 and MC33FS8415GJESR2, the MC33FS8510C4ESR2 provides the exact OTP configuration (1.35 V BUCK1, 1.35 V BUCK3, 3.3 V LDOs) validated for NXP S32R234 radar applications, with full ASIL D diagnostic coverage and fail-safe output behavior required for ISO 26262-compliant systems.
Availability
MC33FS8510C4ESR2 is available at Aetrix Electronics and suitable for radar sensor modules, ADAS domain controllers, and automotive vision systems requiring stable component supply, long-term automotive qualification, and ASIL D safety certification.
Supply support for MC33FS8510C4ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The FS85 family, including MC33FS8510C4ESR2, was designed specifically for ASIL D–compliant automotive power management in radar, vision, and domain controller systems, integrating safety monitoring, multi-rail sequencing, and EMC-optimized switching.
FAQ
What is the primary application target for MC33FS8510C4ESR2?
The MC33FS8510C4ESR2 is specifically configured for radar systems using the NXP S32R234 MCU. Its OTP settings deliver 1.35 V on BUCK1 for the MCU core, 1.35 V on BUCK3 for radar sensor analog supply, and dual 3.3 V LDOs for I/O and ADC reference - all coordinated through ASIL D–validated power sequencing slots.
Does MC33FS8510C4ESR2 support both SPI and I²C interfaces?
Yes, MC33FS8510C4ESR2 supports both SPI and I²C communication protocols with CRC error detection. Its I²C address is fixed at 0x20, and it includes dedicated SCL, SDA, MISO, MOSI, SCLK, and CSB pins. Interface selection is made at boot via OTP configuration or external strapping.
What safety certifications does MC33FS8510C4ESR2 hold?
MC33FS8510C4ESR2 is developed in full compliance with ISO 26262 for ASIL D applications and qualified per AEC-Q100 Rev H Grade 1 (−40 °C to +125 °C). It includes challenger watchdog, FCCU monitoring inputs, ABIST/LBIST, and fail-safe output (FS0B) - all verified in the safety case documentation.
How does the fail-safe output (FS0B) behave under fault conditions?
Under detected faults (e.g., overtemperature, overvoltage, or watchdog timeout), MC33FS8510C4ESR2 asserts FS0B as an active-low open-drain signal. With deep fail-safe autoretry enabled, it attempts infinite recovery cycles before permanent deactivation - a behavior confirmed in the FS85C datasheet Section 4.2 for this OTP variant.
Is MC33FS8510C4ESR2 pin-compatible with other FS85 variants?
Yes, all FS85 devices including MC33FS8510C4ESR2 are pin-to-pin and software compatible per the datasheet. This allows hardware reuse across radar, domain controller, and vision platforms - only OTP configuration and external passive components differ between variants.
MC33FS8510C4ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8510C4ESR2 FAQ
1.How can I place an order for MC33FS8510C4ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8510C4ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8510C4ESR2 reliable?
The price and inventory of MC33FS8510C4ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8510C4ESR2 is usually 5 days.
3.What payment methods are accepted for MC33FS8510C4ESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8510C4ESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33FS8510C4ESR2?
MC33FS8510C4ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8510C4ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8510C4ESR2?
For technical support, including MC33FS8510C4ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8510C4ESR2 requirements.
6.How does Aetrix verify that MC33FS8510C4ESR2 is sourced from the original manufacturer or authorized distributors?
All MC33FS8510C4ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8510C4ESR2 meets industry standards.
7.What is the process for return or replacement of MC33FS8510C4ESR2?
All MC33FS8510C4ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8510C4ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8510C4ESR2 part is unused and in its original packaging.
Return procedure for MC33FS8510C4ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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