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NXP Semiconductors MC33FS8530A1KS
- Part No.:
- MC33FS8530A1KS
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8530A1KS.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:4,958
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Product details
Overview
MC33FS8530A1KS from NXP Semiconductors is an ASIL D–compliant automotive fail-safe system basis chip (SBC) integrating three synchronous buck converters (BUCK1/2/3), one boost converter, two LDOs, and comprehensive safety monitoring. It delivers 1.35 V @ 2.6 A (BUCK1), 1.8 V @ 4.5 A (BUCK2), 1.2 V @ 2.6 A (BUCK3), 5.0 V @ 1.5 A (BOOST), 2.5 V @ 400 mA (LDO1), and 3.3 V @ 400 mA (LDO2), with 60 V max input voltage and SPI/I²C control - designed for camera power domains in automotive vision systems.
For engineers reviewing the MC33FS8530A1KS datasheet, MC33FS8530A1KS pinout, MC33FS8530A1KS application, or MC33FS8530A1KS equivalent, this page provides verified functional specifications, safety architecture details, OTP-configured regulator settings, fail-safe state machine behavior, and validated alternatives for radar/vision ECU power design.
Technical Context
The MC33FS8530A1KS implements a dual-domain safety architecture with independent monitoring circuitry, including ABIST, LBIST, FCCU, and configurable voltage supervisors (VCOREMON, VDDIOMON, VMON1–VMON4) meeting ISO 26262 ASIL D requirements. Its fail-safe state machine drives FS0B (open-drain) on fault detection and supports deep fail-safe autoretry (infinite cycles).
It features synchronized multi-rail power sequencing across six slots, 2.22 MHz switching frequency for BUCK1/2/3, 455 kHz forced-PWM mode for VPRE controller, and integrated EMC optimization via FSYNC input/output, spread spectrum, and slew rate control - enabling co-located operation with high-speed imaging sensors and CAN PHYs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ASIL Level | ASIL D compliant per ISO 26262; includes challenger watchdog, FCCU, ABIST/LBIST, and fail-safe output driver |
| Input Voltage Range | 4.9 V to 60 V DC - supports 12 V/24 V automotive battery rails with reverse-battery protection diode requirement on VSUP1/VSUP2 |
| BUCK1 Output | 1.35 V @ 2.6 A peak; dedicated MCU core supply with SVS capability and soft-start slope of 7.81 mV/µs |
| BUCK2 Output | 1.8 V @ 4.5 A peak; enabled by default, starts in Slot 0, supports multiphase operation with BUCK1 |
| BUCK3 Output | 1.2 V @ 2.6 A peak; enabled by default, starts in Slot 6, soft-start slope 10.41 mV/µs |
| LDO Outputs | LDO1: 2.5 V @ 400 mA; LDO2: 3.3 V @ 400 mA - both support voltage supervision and thermal shutdown with DFS |
| Communication Interface | SPI or I²C (address 0x20); includes CRC, programmable timing, and dedicated interrupt (INTB) and reset (RSTB) outputs |
| Package | HVQFN56 (8 mm × 8 mm × 0.85 mm); wettable flank (dimple), 0.5 mm pitch, exposed thermal pad (EP) tied to GNDFS/GND |
Pinout & Package
HVQFN56 plastic thermal enhanced very thin quad flat package with 56 terminals, 0.5 mm pitch, 8 mm × 8 mm body, and exposed thermal pad (EP) connected to GNDFS/GND. Wettable flank (dimple) variant for enhanced solder joint inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 WAKE2 | Wake-up input 2 | Analog/digital input for system wake-up; requires external series resistor if used as global wake pin |
| 3 BUCK3_INQ | Buck3 quiet input | Low-noise input path for BUCK3 to reduce EMI coupling into sensitive analog supplies |
| 7 BUCK3_SW | Buck3 switching node | High-frequency switching output driving external low-side MOSFET; connects to inductor and output capacitor |
| 9 BUCK3_FB | Buck3 feedback | Resistive divider input for closed-loop regulation; sets 1.2 V output per OTP configuration |
| 14 FS0B | Fail-safe output 0 | Open-drain active-low signal asserting system-level failure; driven by fail-safe state machine on critical fault |
| 17 VCOREMON | Core voltage monitor | Analog input tied directly to BUCK1 output for real-time supervision at 1.35 V threshold |
| 18 PGOOD | Power good indicator | Active-low open-drain output confirming all regulated rails are within tolerance; requires external pull-up to VDDIO |
| 19 RSTB | Reset output | Active-low reset signal for MCU; monitors external reset assertion and internal fault conditions |
| 24 FOUT | Frequency sync output | Drives external SMPS or second FS85 device to synchronize switching frequencies and reduce beat frequencies |
| 37 BUCK1_SW | Buck1 switching node | Main switching output for MCU core rail; connects to 1.5 µH inductor and ceramic output capacitors |
| 48 PRE_FB | VPRE feedback | Combined feedback and negative current sense input for external VPRE synchronous buck controller |
| 54 LDO2 | LDO2 output | 3.3 V @ 400 mA regulated output for MCU I/Os or ADC reference; monitored by VDDIOMON |
| 55 LDO1 | LDO1 output | 2.5 V @ 400 mA regulated output for analog subsystems; monitored by VMON1 |
| 56 LDO1_IN | LDO1 input | Input supply for LDO1; must be ≥ LDO1 output + dropout voltage (typically 0.2 V) |
| EP | Exposed thermal pad | Thermal and electrical connection point for BUCK1/2/3 low-side switches; must be soldered to GNDFS/GND plane |
Key Features
| Feature | Design Value |
|---|---|
| Triple synchronous buck regulators | BUCK1 (1.35 V/2.6 A), BUCK2 (1.8 V/4.5 A), BUCK3 (1.2 V/2.6 A) with independent sequencing slots and TSD+DFS behavior |
| Fail-safe state machine | Dedicated hardware FSM driving FS0B on fault; supports infinite autoretry and configurable deep fail-safe recovery |
| Voltage supervision | Seven independent monitors (VCOREMON, VDDIOMON, VMON1–VMON4) with programmable OV/UV thresholds and deglitch times |
| EMC optimization | FSYNC input/output, spread spectrum modulation, slew rate control, and manual frequency tuning for radar/vision coexistence |
| OTP-configurable power-up | Pre-programmed startup sequence, regulator enable states, soft-start slopes, and safety feature activation (FCCU, ABIST, etc.) |
| Functional safety interface | FCCU1/FCCU2 inputs for MCU error signaling; ERRMON for external IC fault detection; AMUX for analog parameter readback via ADC |
Applications
| Camera Power Management | Radar Sensor Supply |
|---|---|
Use Scenario: Powering NXP S32V-based mono/stereo camera modules with image sensor, ISP, and MIPI interface. IC Role / Device Role / Timing Role: Primary SBC delivering core (1.35 V), I/O (3.3 V), and analog (2.5 V) rails while coordinating power-up sequencing and fail-safe response. Use Value: Eliminates discrete PMIC + supervisor combinations; reduces BOM count by 4+ components and enables ASIL D compliance without external safety monitor. | Use Scenario: Supplying NXP S32R294 radar SoC with RF front-end (TEF810x) in 12 V/24 V vehicle architectures. IC Role / Device Role / Timing Role: Integrated power solution providing VPRE-controlled 4.1 V rail, BUCK1 core (1.35 V), BUCK3 analog (1.2 V), and BOOST (5.0 V) for CAN transceiver. Use Value: Enables single-chip power domain with synchronized switching (via FSYNC) to suppress beat interference in 77 GHz radar bands. |
| ADAS Domain Controller | Automotive Infotainment |
Use Scenario: Powering centralized ADAS domain controllers integrating multiple SoCs (e.g., S32G + S32R) requiring tightly sequenced, monitored rails. IC Role / Device Role / Timing Role: Centralized SBC managing up to six regulator start/stop slots, safety-critical reset generation (RSTB), and fault reporting (INTB, FS0B). Use Value: Reduces inter-SoC coordination complexity; replaces multiple discrete regulators and safety monitors while maintaining ASIL D partitioning. | Use Scenario: Supplying infotainment head units with application processor, audio codec, display interface, and USB peripherals. IC Role / Device Role / Timing Role: Multi-rail SBC delivering 1.1 V core, 1.8 V memory, 3.3 V I/O, and 5.0 V USB VBUS - all with voltage supervision and thermal management. Use Value: Supports hot-plug USB and display enablement with precise power sequencing; LDO2 (3.3 V) powers HDMI CEC and touch controller I/Os. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8530A0KS | Non-programmed OTP version; requires field programming for regulator voltages, sequencing, and safety features | Used in prototyping or custom configurations where pre-defined A1 settings are insufficient | Select A0KS only when engineering teams require full OTP customization during development; A1KS is production-qualified with fixed camera-optimized settings |
| MC33FS8510A2KS | Omits BUCK2 and BUCK3; provides only BUCK1 (1.025 V/2.6 A), BOOST (5.0 V), LDO1 (5.0 V), LDO2 (5.0 V), and VPRE controller | Targeted at domain controllers with single-core SoC and minimal peripheral rail count | Choose A2KS for cost-sensitive ADAS ECUs needing ASIL D compliance but fewer output rails than camera systems |
Compared with MC33FS8530A0KS and MC33FS8510A2KS, the MC33FS8530A1KS delivers production-ready camera-specific OTP configuration - eliminating development time for BUCK2/BUCK3 enablement, 1.8 V/1.2 V output setting, and Slot 0/6 sequencing - while retaining full ASIL D safety coverage and fail-safe output functionality.
Availability
MC33FS8530A1KS is available at Aetrix Electronics and suitable for automotive camera modules, radar sensor units, and ADAS domain controllers requiring stable component supply, long-term lifecycle support, and AEC-Q100 Grade 1 qualification.
Supply support for MC33FS8530A1KS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive processors and power management.
The FS85 family - including MC33FS8530A1KS - is designed specifically for ASIL D–compliant automotive power domains in radar, vision, and domain controller systems, integrating functional safety, multi-rail regulation, and EMC-optimized switching in a single HVQFN56 package.
FAQ
What safety certifications does the MC33FS8530A1KS hold?
The MC33FS8530A1KS is developed in compliance with ISO 26262 for ASIL D applications and qualified per AEC-Q100 Rev H Grade 1 (−40 °C to +125 °C ambient). It includes built-in self-test (ABIST/LBIST), challenger watchdog, FCCU interface, and fail-safe output driver - all documented in the FS84_FS85C product data sheet Rev. 12.0.
Does the MC33FS8530A1KS support synchronization with external power supplies?
Yes, the MC33FS8530A1KS supports bidirectional frequency synchronization via FIN (input) and FOUT (output) pins, enabling phase-aligned switching with other FS85 devices or external PMICs. This reduces beat frequencies and improves EMC performance in radar and vision systems where multiple SMPS operate in proximity.
What is the function of the PSYNC pin on the MC33FS8530A1KS?
The PSYNC pin on the MC33FS8530A1KS serves as a bidirectional power synchronization interface. It allows daisy-chaining two MC33FS8530A1KS devices or synchronizing the MC33FS8530A1KS with an external PMIC to align power-up sequencing and switching events - critical for deterministic behavior in multi-processor ADAS ECUs.
How is the fail-safe output (FS0B) triggered on the MC33FS8530A1KS?
The FS0B output on the MC33FS8530A1KS is driven low by the dedicated fail-safe state machine upon detection of critical faults including overtemperature (TSD), undervoltage/overvoltage on monitored rails (VCOREMON, VDDIOMON, VMON1–VMON4), watchdog timeout, or FCCU error assertion. Its open-drain structure requires external pull-up to VDDIO.
Can the MC33FS8530A1KS be used without programming its OTP memory?
Yes, the MC33FS8530A1KS ships with factory-programmed OTP configuration optimized for camera applications (1.35 V BUCK1, 1.8 V BUCK2, 1.2 V BUCK3, 2.5 V LDO1, 3.3 V LDO2). No field programming is required for standard use - unlike the A0KS variant, which ships unprogrammed and requires OTP configuration before deployment.
MC33FS8530A1KS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8530A1KS FAQ
1.How can I place an order for MC33FS8530A1KS through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8530A1KS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8530A1KS reliable?
The price and inventory of MC33FS8530A1KS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8530A1KS is usually 5 days.
3.What payment methods are accepted for MC33FS8530A1KS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8530A1KS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33FS8530A1KS?
MC33FS8530A1KS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8530A1KS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8530A1KS?
For technical support, including MC33FS8530A1KS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8530A1KS requirements.
6.How does Aetrix verify that MC33FS8530A1KS is sourced from the original manufacturer or authorized distributors?
All MC33FS8530A1KS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8530A1KS meets industry standards.
7.What is the process for return or replacement of MC33FS8530A1KS?
All MC33FS8530A1KS units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8530A1KS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8530A1KS part is unused and in its original packaging.
Return procedure for MC33FS8530A1KS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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