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NXP Semiconductors MC33PF3000A3ES
- Part No.:
- MC33PF3000A3ES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC33PF3000A3ES.pdf
- Description:
- POWER MANAGEMENT IC I.MX7 PRE-
- Quantity:
- Payment:
- Shipping:
Inventory:4,430
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Product details
Overview
MC33PF3000A3ES from NXP Semiconductors is a pre-programmed power management IC (PMIC) optimized for the i.MX 6SX application processor with DDR3L memory interface, delivering four buck regulators (SW1A/B combined 2.75 A, SW2 1.25 A, SW3 1.5 A), six LDOs, VREFDDR reference, RTC supply (VSNVS), and coin-cell charging. It operates from 2.8–4.5 V input and supports dynamic voltage scaling for core rail control in embedded compute systems.
For engineers reviewing the MC33PF3000A3ES datasheet, MC33PF3000A3ES pinout, MC33PF3000A3ES application, or MC33PF3000A3ES equivalent, key selection criteria include OTP-configured startup sequence for i.MX 6SX+DDR3L, I²C programmability, wettable-flank 48-QFN package compatibility, and integrated VREFDDR generation for DDR3L timing compliance.
Technical Context
The MC33PF3000A3ES implements a fixed OTP configuration targeting i.MX 6SX with DDR3L memory, enabling precise power sequencing without runtime I²C initialization overhead. Its architecture integrates SW1A and SW1B as a single 2.75 A buck channel, SW2 for SOC logic (1.50–1.85 V or 2.50–3.30 V), and SW3 for core voltage (0.90–1.65 V), all supporting PWM/PPM/APS modes and programmable soft-start.
It features dedicated analog blocks including VREFDDR (0.5×SW3_OUT, ±1% accuracy), VSNVS (3.0 V, 1 mA always-on), and coin-cell charger (LICELL pin), with digital control via PWRON, STANDBY, RESETBMCU, and INTB signals - all configured at OTP programming to match i.MX 6SX boot requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8 V to 4.5 V (VIN supply); supports up to 5.5 V via external VPWR LDO |
| Buck Regulator Count | 4 channels: SW1A/B (combined 2.75 A), SW2 (1.25 A), SW3 (1.5 A), SWBST (0.6 A boost) |
| LDO Count & Max Current | 6 LDOs: V33 (350 mA), VLDO4 (350 mA), VLDO2 (250 mA), VCC_SD (100 mA), VLDO1/3 (100 mA each) |
| VREFDDR Output | 0.5 × SW3 output voltage (0.5–0.9 V range), 10 mA drive for DDR3L reference compliance |
| OTP Configuration | Pre-programmed for i.MX 6SX + DDR3L startup sequence, voltage levels, and timing - no runtime I²C setup required |
| Package | 48-pin QFN, 7.0 mm × 7.0 mm, wettable flank (98ASA00933D), −40 °C to 105 °C automotive grade |
| I²C Interface | Configurable slave address (0x08–0x0F), open-drain SDA/SCL, VDDIO 1.7–3.6 V supply |
Pinout & Package
MC33PF3000A3ES uses a 48-pin wettable-flank QFN (98ASA00933D) with exposed thermal pad (EP). Pin functions are defined per NXP PF3000 Rev. 10.1 datasheet Section 7.2; all pins support i.MX 6SX-specific power sequencing and monitoring.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| INTB (Pin 1) | Open-drain fault interrupt | Asserts low on overcurrent, undervoltage, or thermal fault; requires external pull-up |
| RESETBMCU (Pin 3) | Processor reset output | Deasserts 2.0 ms after final regulator enables; configurable for fault-monitoring mode |
| PWRON (Pin 48) | Power-on trigger input | Edge- or level-sensitive (OTP-configurable); initiates full startup sequence from Off/Sleep |
| SW1ALX/SW1BLX (Pins 8, 9) | Switch node outputs | Combined connection point for SW1A/B inductor when operating as single 2.75 A buck |
| VREFDDR (Pin 25) | DDR memory reference output | Provides precision 0.5×SW3_OUT voltage (±1%) for DDR3L termination and calibration |
| EP (Exposed Pad) | Thermal & ground return | Must be soldered to inner/outer ground planes via multiple vias for thermal dissipation and noise control |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configured i.MX 6SX+DDR3L power tree | Eliminates need for external configuration resistors or firmware initialization; reduces BOM count by 7+ passive components |
| Integrated VREFDDR generator | Tracks SW3 output dynamically (0.5× ratio), ensuring DDR3L reference stays within JEDEC VDDQ/2 ±1% tolerance |
| VSNVS always-on regulator/switch | Delivers stable 3.0 V @ 1 mA from VIN or coin cell; maintains SNVS domain during system sleep or main power loss |
| Programmable buck soft-start ramp rate | 25 mV/2 µs or 25 mV/4 µs (OTP-selectable), preventing inrush current spikes during core rail ramp-up |
| Wettable-flank 48-QFN package | Enables automated optical inspection (AOI) of solder joints; improves reliability in automotive and industrial thermal cycling |
Applications
| Industrial HMI Panel | Automotive Infotainment Gateway |
|---|---|
|
Use Scenario: Compact ARM-based display controller with DDR3L memory, CAN/LIN interfaces, and touch controller. IC Role / Device Role / Timing Role: Primary PMIC supplying i.MX 6SX cores (SW3), SOC logic (SW2), DDR3L VREF (VREFDDR), and always-on SNVS domain (VSNVS). Use Value: OTP-matched startup eliminates boot-time delays; wettable-flank package ensures long-term solder joint integrity under thermal shock. |
Use Scenario: In-vehicle infotainment unit requiring cold-cranking operation, fast wake-from-sleep, and DDR3L memory retention. IC Role / Device Role / Timing Role: Manages dual-rail core (SW1A/B), peripheral (V33, VLDO4), and backup (VSNVS + LICELL) supplies while supporting 105 °C ambient operation. Use Value: Coin-cell charging preserves RTC and security keys during battery disconnect; −40 °C to 105 °C rating meets AEC-Q100 Grade 2 requirements. |
| Medical Point-of-Care Monitor | Smart Energy Gateway |
|
Use Scenario: Portable diagnostic device with high-resolution display, Wi-Fi/BLE connectivity, and battery-backed real-time clock. IC Role / Device Role / Timing Role: Powers i.MX 6SX application processor, LPDDR2-compatible peripherals (via VCC_SD dual-voltage), and sensor interface rails (VLDO2, VLDO1). Use Value: SD_VSEL-controlled VCC_SD (1.8 V or 3.3 V) enables direct SDIO interface to both legacy and UHS-I cards without level shifters. |
Use Scenario: DIN-rail mounted home energy meter with isolated RS-485, secure boot, and tamper-detection circuitry. IC Role / Device Role / Timing Role: Delivers regulated power to i.MX 6SX, isolated communication PHYs (V33), security module (VLDO2 @ 1.2 V), and backup SRAM (VSNVS). Use Value: I²C address programmability (0x08–0x0F) avoids bus conflicts in multi-PMIC systems; OTP lock prevents unauthorized reconfiguration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF3000A4ES | OTP-configured for i.MX 6SX with standard DDR3 (not DDR3L); VREFDDR derived from fixed internal reference, not SW3 tracking | Requires DDR3 memory interface; lacks DDR3L-specific VREFDDR tracking and lower-voltage core support | Select only if target system uses DDR3, not DDR3L, and does not require dynamic VREFDDR scaling |
| MC34PF3000A3ES | Identical OTP configuration and electrical specs, but rated for −40 °C to 105 °C industrial grade (not automotive); same 48-QFN package | Approved for industrial environments only; not qualified to AEC-Q100; may lack automotive traceability documentation | Choose for cost-sensitive industrial designs where automotive qualification is unnecessary and temperature range is sufficient |
Compared with MC33PF3000A4ES, MC33PF3000A3ES provides DDR3L-optimized VREFDDR tracking and lower core voltage support; compared with MC34PF3000A3ES, it adds automotive qualification, traceable sourcing, and extended reliability validation for safety-critical systems.
Availability
MC33PF3000A3ES is available at Aetrix Electronics and suitable for industrial HMI panels, automotive infotainment gateways, and medical point-of-care monitors requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MC33PF3000A3ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and power management.
The PF3000 product line delivers highly integrated, OTP-configured PMICs specifically engineered for NXP's i.MX 6 and i.MX 7 families - reducing design complexity, accelerating time-to-market, and ensuring robust power sequencing for complex SoC platforms.
FAQ
What is the primary application processor supported by the MC33PF3000A3ES?
The MC33PF3000A3ES is pre-programmed in OTP memory specifically for the NXP i.MX 6SX application processor with DDR3L memory interface. Its startup sequence, voltage levels, and timing parameters are hardened to match i.MX 6SX boot requirements - eliminating runtime I²C configuration for core power rails, VREFDDR, and SNVS domain.
Does the MC33PF3000A3ES support DDR3L memory reference voltage generation?
Yes, the MC33PF3000A3ES includes a dedicated VREFDDR output (Pin 25) that generates a precision 0.5× SW3 output voltage, adjustable from 0.5 V to 0.9 V. This dynamic tracking ensures JEDEC-compliant DDR3L reference voltage accuracy (±1%) across process, voltage, and temperature variations.
What is the operating temperature range and package type of the MC33PF3000A3ES?
The MC33PF3000A3ES is rated for −40 °C to +105 °C and uses a 48-pin wettable-flank QFN package (98ASA00933D, 7.0 mm × 7.0 mm). The wettable flank feature enables reliable automated optical inspection (AOI) of solder joints - critical for automotive and industrial applications demanding high long-term reliability.
How does the MC33PF3000A3ES handle power-on sequencing for the i.MX 6SX processor?
The MC33PF3000A3ES executes a fixed, OTP-programmed startup sequence triggered by the PWRON signal. It powers SW1A/B (2.75 A combined), SW3 (1.5 A core), SW2 (1.25 A SOC), VREFDDR, VSNVS, and LDOs in precise order and timing - all without host processor intervention, ensuring deterministic i.MX 6SX boot behavior and eliminating software dependency for power rail enablement.
Can the MC33PF3000A3ES be used with coin-cell backup for RTC functionality?
Yes, the MC33PF3000A3ES includes a dedicated LICELL pin (Pin 36) and integrated coin-cell charger circuitry. When a coin cell is connected, it powers the VSNVS rail (3.0 V, 1 mA) to maintain the i.MX 6SX's Secure Non-Volatile Storage (SNVS) domain - preserving RTC time, cryptographic keys, and tamper logs during main power loss or deep sleep.
MC33PF3000A3ES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- i.MX Processors
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 48-QFN (7x7)
MC33PF3000A3ES FAQ
1.How can I place an order for MC33PF3000A3ES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF3000A3ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF3000A3ES reliable?
The price and inventory of MC33PF3000A3ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF3000A3ES is usually 5 days.
3.What payment methods are accepted for MC33PF3000A3ES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF3000A3ES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF3000A3ES?
MC33PF3000A3ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF3000A3ES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF3000A3ES?
For technical support, including MC33PF3000A3ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF3000A3ES requirements.
6.How does Aetrix verify that MC33PF3000A3ES is sourced from the original manufacturer or authorized distributors?
All MC33PF3000A3ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF3000A3ES meets industry standards.
7.What is the process for return or replacement of MC33PF3000A3ES?
All MC33PF3000A3ES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF3000A3ES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF3000A3ES part is unused and in its original packaging.
Return procedure for MC33PF3000A3ES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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