NXP Semiconductors MC33PF3000A4ES
- Part No.:
- MC33PF3000A4ES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC33PF3000A4ES.pdf
- Description:
- POWER MANAGEMENT IC I.MX7 PRE-
- Quantity:
- Payment:

- Shipping:

Inventory:3,045
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC33PF3000A4ES from NXP Semiconductors is a pre-programmed power management IC (PMIC) optimized for i.MX 6SX application processors with DDR3 memory interface, integrating four buck regulators (SW1A: 1.0 A, SW1B: 1.75 A, SW2: 1.25 A, SW3: 1.5 A), six LDOs including V33 (350 mA) and VCC_SD (100 mA), RTC supply (VSNVS, 3.0 V/1.0 mA), DDR reference (VREFDDR, 0.5×SW3_OUT), and coin-cell charger - all in a single 48-pin QFN package.
For engineers reviewing the MC33PF3000A4ES datasheet, MC33PF3000A4ES pinout, MC33PF3000A4ES application, or MC33PF3000A4ES equivalent, this PMIC delivers verified startup sequencing, I²C programmability, dynamic voltage scaling, OTP-configurable power tree, and automotive-grade thermal performance for embedded systems requiring precise rail control and low-quiescent-current operation.
Technical Context
The MC33PF3000A4ES implements a SMARTMOS-based architecture with configurable buck regulator topology: SW1A and SW1B support independent operation (1.0 A / 1.75 A) or combined 2.75 A mode, while SW2 and SW3 provide dedicated core and memory rails with programmable output voltages (SW2: 1.50–1.85 V or 2.50–3.30 V; SW3: 0.90–1.65 V). All bucks support PWM/PFM/APS modes, soft-start sequencing, and current-limit programming.
Its control logic integrates OTP-mapped startup timing (0.5 ms or 2.0 ms per slot), I²C address configuration (0x08–0x0F), PWRON edge/level sensitivity, RESETBMCU fault-mode enablement, and SD_VSEL-driven dual-voltage selection for VCC_SD (1.8 V or 2.85–3.3 V), enabling deterministic boot behavior without external configuration components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8–4.5 V (VIN) or 3.7–5.5 V (VPWR with external PFET); enables flexible system-level input sourcing |
| Buck Regulator Count | Four independent/combined switching regulators (SW1A/B, SW2, SW3); supports full i.MX 6SX core, SOC, DDR, and peripheral rail generation |
| LDO Count & Output | Six LDOs: V33 (350 mA, 2.85–3.30 V), VCC_SD (100 mA, dual-range), VLDO1–VLDO4 (100–350 mA, 0.8–3.3 V); powers I/O, SD card, audio, and low-noise analog blocks |
| VREFDDR Accuracy | 0.5 × SW3 output voltage (±1% typical); provides precise DDR3 reference matching core voltage scaling |
| OTP Configuration | One-time programmable memory storing startup sequence, regulator voltages, I²C address, PWRON mode, and DVS ramp rate; eliminates external resistors and firmware initialization overhead |
| Operating Temperature | −40 °C to +105 °C; qualified for automotive applications per AEC-Q100 stress test requirements |
| Package | 48-pin QFN (7.0 mm × 7.0 mm, wettable flank); supports automated optical inspection and high-density PCB layout |
Pinout & Package
MC33PF3000A4ES uses the 98ASA00933D 48-pin QFN package (7.0 mm × 7.0 mm, wettable flank), with exposed thermal pad (EP) tied to ground for enhanced thermal dissipation. Pin functions are validated per NXP PF3000 Rev. 10.1 datasheet Section 7.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| INTB (Pin 1) | Open-drain interrupt output | Signals faults (OCP, UVLO, thermal) to host processor; requires external pull-up to VDDIO |
| SD_VSEL (Pin 2) | Digital input | Selects VCC_SD output range: LOW = 2.85–3.30 V, HIGH = 1.80–1.85 V for SD card interface compliance |
| RESETBMCU (Pin 3) | Open-drain reset output | Deasserts 2.0 ms after last regulator enables; configurable for fault-triggered assertion (OTP_PG_EN) |
| STANDBY (Pin 4) | Digital input | Enters/exits Standby mode; polarity configurable via OTP_STANDBYINV bit |
| PWRON (Pin 48) | Digital input | Level- or edge-sensitive power-on trigger; debounce programmable (0–750 ms falling edge) |
| SCL/SDA (Pins 46/45) | I²C interface | Configurable slave address (0x08–0x0F); SCL pulled up to VDDIO (1.7–3.6 V) with 4.7 kΩ resistor |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Buck Topology | SW1A/SW1B operate independently (1.0 A / 1.75 A) or combined (2.75 A); enables scalable core rail design for i.MX 6SX performance tiers |
| DDR Memory Reference | VREFDDR outputs 0.5 × SW3 voltage with ±1% accuracy; ensures stable DDR3 termination matching dynamic core voltage scaling |
| OTP-Driven Startup Sequence | 15-slot programmable timing (0.5/2.0 ms per slot); eliminates boot-time race conditions and guarantees deterministic power-up order |
| Automotive Thermal Rating | −40 °C to +105 °C operation with wettable flank QFN; supports under-hood and infotainment module deployment |
| Integrated Coin-Cell Charger | LICELL pin supports charging and backup for VSNVS (3.0 V, 1.0 mA); maintains RTC and secure non-volatile state during main power loss |
Applications
| Industrial HMI Panels | Automotive Infotainment Gateways |
|---|---|
|
Use Scenario: Ruggedized touch displays with i.MX 6SX SoC, DDR3 memory, and CAN/FlexRay interfaces operating in vehicle cabins. IC Role / Device Role / Timing Role: MC33PF3000A4ES supplies VDD_ARM (1.1 V), VDD_SOC (1.0 V), VREFDDR (0.55 V), V33 (3.3 V), and VCC_SD (1.8 V) with synchronized startup and fault monitoring. Use Value: Automotive temperature rating and OTP-configured sequencing ensure reliable cold-start behavior and ECU interoperability without runtime software intervention. |
Use Scenario: Central gateway modules consolidating Ethernet AVB, Wi-Fi, Bluetooth, and legacy bus protocols in modern vehicles. IC Role / Device Role / Timing Role: MC33PF3000A4ES powers i.MX 6SX application processor cores, DDR3 memory, USB OTG PHY (via SWBST 5.1 V), and secure crypto peripherals (via VLDO2 1.2 V). Use Value: Integrated coin-cell backup (LICELL) preserves secure boot keys and RTC time across ignition cycles, meeting ISO 26262 ASIL-B functional safety prerequisites. |
| Medical Portable Diagnostics | Smart Energy Meters |
|
Use Scenario: Battery-powered ultrasound or ECG devices requiring low-power standby, fast wake-up, and precision analog rail stability. IC Role / Device Role / Timing Role: MC33PF3000A4ES delivers VSNVS (3.0 V) for always-on RTC, VLDO2 (1.2 V) for ADC reference, and SW3 (1.1 V) for low-noise digital core with PFM efficiency. Use Value: Sub-1 μA quiescent current in Sleep/LPSR mode extends battery life; VREFDDR tracking ensures consistent signal chain gain calibration across operating temperatures. |
Use Scenario: DIN-rail mounted electricity meters with i.MX 6SX, RS-485, PLC, and secure SE chip interfacing. IC Role / Device Role / Timing Role: MC33PF3000A4ES generates isolated 3.3 V (V33), 1.8 V (VCC_SD), and 1.2 V (VLDO2) rails while managing VPWR front-end LDO for 24 V input derating. Use Value: VPWR input support (3.7–5.5 V) with external PFET enables direct connection to industrial 24 V supplies; wettable flank QFN ensures IPC-A-610 Class 3 solder joint reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF3000A4ES | Industrial-grade variant (−40 °C to +105 °C), identical OTP programming (i.MX 6SX + DDR3), same pinout and electrical specs | Targeted for industrial control and energy metering where AEC-Q100 is not required but extended temp is needed | Select MC34PF3000A4ES when automotive qualification is unnecessary and cost optimization is prioritized |
| MC32PF3000A4ES | Consumer-grade variant (−40 °C to +85 °C), identical OTP programming and functionality, same 48-pin QFN package | Intended for tablets, eReaders, and home automation where ambient temperature remains below 85 °C | Choose MC32PF3000A4ES for consumer designs with lower thermal margins and reduced BOM cost |
Compared with MC33PF3000A4ES, MC34PF3000A4ES offers identical power delivery and sequencing but omits automotive qualification testing, while MC32PF3000A4ES reduces thermal capability to 85 °C - both retain full compatibility with i.MX 6SX DDR3 reference designs and require no PCB changes.
Availability
MC33PF3000A4ES is available at Aetrix Electronics and suitable for automotive infotainment gateways, industrial HMI panels, and portable medical diagnostics requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant power management.
Supply support for MC33PF3000A4ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with over 30 years of embedded processor and power management innovation.
The PF3000 product line was designed specifically to deliver integrated, OTP-configurable power trees for NXP's i.MX application processors - reducing external component count, simplifying layout, and ensuring deterministic boot behavior across automotive, industrial, and consumer platforms.
FAQ
What is the primary application processor compatibility for MC33PF3000A4ES?
MC33PF3000A4ES is pre-programmed for use with NXP i.MX 6SX processors interfacing DDR3 memory, as indicated by its OTP code "4" in Table 1 of the PF3000 datasheet. It is not configured for i.MX 7, i.MX 6SL, or i.MX 6UL variants - those require different part numbers (e.g., MC33PF3000A1ES, A5ES, A6ES). The device's internal power tree and startup sequence are hardened for i.MX 6SX voltage domains and timing requirements.
Does MC33PF3000A4ES support DDR3L or only standard DDR3 memory?
MC33PF3000A4ES is programmed for standard DDR3 (not DDR3L), as confirmed by its ordering code "4 (i.MX 6SX with DDR3)" in Table 1. While VREFDDR derives from SW3 output and supports adjustable ranges (0.5×SW3_OUT), the OTP configuration fixes SW3 startup voltage and sequencing to match standard DDR3 VDDQ (1.5 V) and termination requirements - DDR3L compatibility would require different OTP settings found in MC33PF3000A3ES (code "3", i.MX 6SX with DDR3L).
How does the VCC_SD regulator voltage selection work on MC33PF3000A4ES?
MC33PF3000A4ES uses the SD_VSEL pin (Pin 2) to select VCC_SD output: logic LOW configures 2.85–3.30 V for standard SD cards, while logic HIGH selects 1.80–1.85 V for UHS-I SDIO operation. The SD_VSEL buffer is powered by VDDIO; if VDDIO is absent, the default logic HIGH forces 1.8 V mode. This dual-range capability is retained across all PF3000 variants, including MC33PF3000A4ES, and is implemented in hardware without OTP dependency.
Can MC33PF3000A4ES operate with a 5.0 V input supply?
Yes - MC33PF3000A4ES supports 3.7–5.5 V input via the VPWR pin (Pin 31) when used with an external P-channel MOSFET as a front-end LDO, limiting internal regulator input to ≤4.5 V. Direct 5.0 V application to VIN (Pin 42) is not permitted; doing so exceeds the 4.5 V absolute maximum rating. The VPWR path must be implemented per Figure 4 and Section 8.2 of the datasheet to safely accommodate 5.0 V system rails.
What is the function of the LICELL pin on MC33PF3000A4ES?
The LICELL pin (Pin 36) on MC33PF3000A4ES serves as bidirectional coin-cell interface: it charges a 3 V lithium cell (via internal linear charger) when main power is present and backs up the VSNVS rail (3.0 V, 1.0 mA) during main power loss. This preserves RTC time, secure non-volatile registers, and SNVS domain state - critical for automotive and medical applications requiring persistent timekeeping and cryptographic key retention across power cycles.
MC33PF3000A4ES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- i.MX Processors
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 48-QFN (7x7)
MC33PF3000A4ES FAQ
1.How can I place an order for MC33PF3000A4ES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF3000A4ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF3000A4ES reliable?
The price and inventory of MC33PF3000A4ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF3000A4ES is usually 5 days.
3.What payment methods are accepted for MC33PF3000A4ES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF3000A4ES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF3000A4ES?
MC33PF3000A4ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF3000A4ES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF3000A4ES?
For technical support, including MC33PF3000A4ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF3000A4ES requirements.
6.How does Aetrix verify that MC33PF3000A4ES is sourced from the original manufacturer or authorized distributors?
All MC33PF3000A4ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF3000A4ES meets industry standards.
7.What is the process for return or replacement of MC33PF3000A4ES?
All MC33PF3000A4ES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF3000A4ES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF3000A4ES part is unused and in its original packaging.
Return procedure for MC33PF3000A4ES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC33PF3000A4ES Tags

-
TPS2511DGNR
Texas Instruments

-
UTC2000/MG
Microchip Technology

-
TUSB320HAIRWBR
Texas Instruments

-
TPS61252DSGR
Texas Instruments

-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments

-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments

-
STUSB1600AQTR
STMicroelectronics

-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments

-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

