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NXP Semiconductors MC33PF3000A4ESR2
- Part No.:
- MC33PF3000A4ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC33PF3000A4ESR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX7 PRE-
- Quantity:
- Payment:
- Shipping:
Inventory:2,916
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Product details
Overview
MC33PF3000A4ESR2 from NXP Semiconductors is a pre-programmed power management IC (PMIC) optimized for i.MX 6SX application processors with DDR3 memory, delivering four buck regulators (SW1A/B up to 2.75 A combined, SW2 at 1.25 A, SW3 at 1.5 A), six LDOs including V33 (350 mA) and VCC_SD (100 mA), and integrated DDR reference (VREFDDR) with 0.5×VDDR scaling. It supports dynamic voltage scaling, I²C programmability, and coin-cell backup for RTC retention in portable industrial and consumer systems.
For engineers reviewing the MC33PF3000A4ESR2 datasheet, MC33PF3000A4ESR2 pinout, MC33PF3000A4ESR2 application, or MC33PF3000A4ESR2 equivalent, this page provides verified regulator output ranges, OTP-configured startup sequence for i.MX 6SX+DDR3, wettable-flank QFN-48 package details, and validated alternative PMICs with documented functional alignment to the same processor family.
Technical Context
The MC33PF3000A4ESR2 implements a SMARTMOS-based multi-rail architecture with configurable buck topology: SW1A and SW1B can operate independently (1.0 A / 1.75 A) or in parallel (2.75 A), while SW2 and SW3 support programmable output voltages (1.5–1.85 V / 0.9–1.65 V) and switching modes (PWM/PPM/APS). Its OTP memory stores i.MX 6SX-specific startup timing, voltage setpoints, and I²C address (0x08 default), eliminating external configuration components.
It integrates dedicated power domains for i.MX 6SX subsystems: VREFDDR (0.5×SW3_OUT, 10 mA) for DDR3 termination, VSNVS (3.0 V, 1.0 mA) for secure real-time clock retention, and dual-range VCC_SD (1.8 V or 2.85–3.3 V) controlled by SD_VSEL. The device accepts input via VIN (≤4.5 V) or VPWR (3.7–5.5 V with external PFET), enabling flexible system-level power path design.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8–4.5 V on VIN; 3.7–5.5 V on VPWR (requires external PFET) |
| SW1A/B Combined Output | 0.7–1.425 V / 0.7–1.475 V, 2.75 A - powers i.MX 6SX core (VDD_ARM/VDD_SOC) |
| SW2 Output | 1.50–1.85 V or 2.50–3.30 V, 1.25 A - supplies DDR3 I/O (NVCC_DRAM_CKE) and logic rails |
| VREFDDR Accuracy | 0.5 × SW3 output, ±1% tolerance - matches DDR3 termination requirements without external resistors |
| VCC_SD Dual Range | 1.80–1.85 V or 2.85–3.30 V, 100 mA - supports high-speed SD card interface voltage selection |
| I²C Address | Programmable 0x08–0x0F (default 0x08) - avoids bus conflicts in multi-PMIC designs |
| OTP Configuration | Pre-programmed for i.MX 6SX + DDR3 (code A4) - defines startup sequence, DVS ramp rate, and PWRON edge-sensitivity |
Pinout & Package
MC33PF3000A4ESR2 uses a 48-pin QFN package (98ASA00933D), 7.0 mm × 7.0 mm with wettable flanks for automated optical inspection. Exposed pad (EP) serves as thermal and ground return for buck/boost regulators and must be connected to inner/external ground planes via multiple vias.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 INTB | Open-drain fault interrupt | Asserts low on overcurrent, undervoltage, or thermal fault; requires external pull-up to VDDIO |
| 2 SD_VSEL | Digital input for VCC_SD range select | High = 1.80–1.85 V; Low = 2.85–3.30 V - enables SD card interface voltage flexibility |
| 3 RESETBMCU | Open-drain reset output | Deasserts 2.0 ms after last regulator enables - signals i.MX 6SX ready for boot |
| 4 STANDBY | Standby mode control input | Active-high entry to low-power state; supports active-low via OTP STANDBYINV bit |
| 35 SWBSTLX | Boost switch node | Connects to SWBST inductor and Schottky diode anode - enables USB OTG 5.0–5.15 V supply |
| 36 LICELL | Coin-cell charger interface | Bidirectional analog terminal for 3 V coin cell - maintains VSNVS during main power loss |
| 45 SDA / 46 SCL | I²C data/clock lines | Open-drain, 4.7 kΩ pull-up to VDDIO (1.7–3.6 V) - enables runtime reconfiguration of regulators |
| 48 PWRON | Power-on trigger input | Edge-sensitive (OTP-configurable) - mechanical switch debounce up to 750 ms prevents false turn-on |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configured i.MX 6SX+DDR3 power tree | Startup sequence, voltage setpoints, and timing pre-loaded for immediate use - eliminates board-level resistor networks |
| SW1A/SW1B parallel operation | 2.75 A combined current delivery at 0.7–1.425 V - meets i.MX 6SX core rail transient demands without external current sharing |
| VREFDDR with VDD_DDR tracking | 0.5 × SW3 output with ±1% accuracy - satisfies DDR3 termination spec without external feedback divider |
| Programmable PWRON debounce | Configurable falling-edge debounce (0/31.25/125/750 ms) - ensures reliable wake-up from mechanical buttons in industrial HMI |
| VSNVS retention from coin cell | 3.0 V, 1.0 mA always-on supply - preserves RTC and security context across main power cycles in battery-backed systems |
| Wettable flank QFN-48 | 7.0 mm × 7.0 mm footprint with solderable side walls - enables AOI verification of solder joint integrity in high-reliability manufacturing |
Applications
| Industrial HMI Panels | Secure Edge Gateways |
|---|---|
|
Use Scenario: Ruggedized touch panels in factory automation requiring continuous RTC operation and DDR3 memory stability under variable input voltage. IC Role / Device Role / Timing Role: MC33PF3000A4ESR2 delivers core (SW1A/B), I/O (SW2), DDR (VREFDDR), and backup (VSNVS) rails while managing i.MX 6SX power states via STANDBY/PWRON. Use Value: Pre-programmed DDR3 timing and coin-cell-backed VSNVS ensure deterministic boot and secure timekeeping without firmware intervention. |
Use Scenario: Network-connected gateways aggregating sensor data in smart buildings, operating 24/7 with periodic firmware updates. IC Role / Device Role / Timing Role: MC33PF3000A4ESR2 powers i.MX 6SX CPU, DDR3 memory, Ethernet PHY (via V33), and secure element (via VLDO2) with coordinated startup sequencing. Use Value: OTP-stored startup order guarantees correct power-up of memory before CPU initialization, preventing bus contention during OTA updates. |
| POS Terminals with SD Card | Medical Data Loggers |
|
Use Scenario: Portable point-of-sale terminals using high-speed SD cards for transaction logging and firmware storage. IC Role / Device Role / Timing Role: MC33PF3000A4ESR2 supplies dual-voltage VCC_SD (1.8 V/3.3 V) and V33 (3.3 V) while regulating DDR3 memory for application processing. Use Value: SD_VSEL-controlled VCC_SD range selection enables automatic voltage negotiation with SDHC/SDXC cards, reducing host driver complexity. |
Use Scenario: Battery-powered patient monitors capturing ECG waveforms and storing data locally before cloud upload. IC Role / Device Role / Timing Role: MC33PF3000A4ESR2 manages ultra-low-quiescent power states (Sleep/LPSR), coin-cell-backed RTC (VSNVS), and precision analog rails (VLDO2 at 0.8–1.55 V). Use Value: Programmable sleep mode entry/exit via STANDBY and edge-triggered PWRON extends battery life while maintaining timestamp accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF3000A4ESR2 | Rated for -40 °C to 105 °C (industrial grade); identical OTP programming and pinout | Required for extended temperature environments (e.g., outdoor kiosks, factory floors) | Select when ambient operating temperature exceeds 85 °C or lifecycle reliability mandates industrial qualification |
| MC33PF3000A3ESR2 | OTP programmed for i.MX 6SX with DDR3L (lower voltage DDR), not DDR3 | Supports DDR3L memory (1.35 V) instead of standard DDR3 (1.5 V); incompatible VREFDDR scaling | Choose only if target system uses DDR3L; verify VREFDDR output matches memory VDDQ specification before substitution |
Compared with MC33PF3000A4ESR2, MC34PF3000A4ESR2 offers extended temperature capability without layout changes, while MC33PF3000A3ESR2 targets DDR3L memory systems and requires validation of VREFDDR scaling against DDR3L VDDQ tolerance.
Availability
MC33PF3000A4ESR2 is available at Aetrix Electronics and suitable for industrial HMI panels, secure edge gateways, POS terminals, and medical data loggers requiring stable component supply across long production lifecycles.
Supply support for MC33PF3000A4ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and associated power management.
The PF3000 product line was designed specifically to deliver complete, OTP-configured power trees for NXP's i.MX 6 and i.MX 7 families, minimizing external components and enabling rapid bring-up of complex SoC-based systems.
FAQ
What is the OTP programming configuration for MC33PF3000A4ESR2?
MC33PF3000A4ESR2 is pre-programmed with OTP code A4, which configures it for i.MX 6SX processors using standard DDR3 memory. This includes fixed startup sequence timing, SW1A/B parallel mode, VREFDDR scaling to 0.5×SW3 output, and edge-sensitive PWRON behavior. The OTP content cannot be modified post-manufacture.
Does MC33PF3000A4ESR2 support DDR3L memory?
No, MC33PF3000A4ESR2 is configured for standard DDR3 (1.5 V) operation. For DDR3L (1.35 V) support, use MC33PF3000A3ESR2, which has OTP code A3 and different VREFDDR scaling. Substituting MC33PF3000A4ESR2 in a DDR3L design risks incorrect memory termination voltage and system instability.
How does the VCC_SD regulator voltage selection work on MC33PF3000A4ESR2?
MC33PF3000A4ESR2's VCC_SD output switches between 1.80–1.85 V (low range) and 2.85–3.30 V (high range) based on the logic level of the SD_VSEL pin. When SD_VSEL is high, the low range activates; when low, the high range activates. The SD_VSEL buffer is powered by VDDIO, defaulting to high if VDDIO is absent.
Can MC33PF3000A4ESR2 operate with a 5 V input supply?
Yes, MC33PF3000A4ESR2 accepts 3.7–5.5 V input on the VPWR pin when used with an external PFET front-end LDO. Direct connection of 5 V to VIN is not allowed, as VIN is rated only for 2.8–4.5 V. The VPWR path enables compatibility with standard 5 V system rails while protecting internal regulators.
What is the function of the LICELL pin on MC33PF3000A4ESR2?
The LICELL pin on MC33PF3000A4ESR2 provides bidirectional connection to a 3 V coin cell for backup power. During main power operation, it charges the cell; during main power loss, it supplies current to the VSNVS rail (3.0 V, 1.0 mA) to retain RTC and security context. A 0.1 μF capacitor must be placed between LICELL and GND.
MC33PF3000A4ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- i.MX Processors
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 48-QFN (7x7)
MC33PF3000A4ESR2 FAQ
1.How can I place an order for MC33PF3000A4ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF3000A4ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF3000A4ESR2 reliable?
The price and inventory of MC33PF3000A4ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF3000A4ESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF3000A4ESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF3000A4ESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF3000A4ESR2?
MC33PF3000A4ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF3000A4ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF3000A4ESR2?
For technical support, including MC33PF3000A4ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF3000A4ESR2 requirements.
6.How does Aetrix verify that MC33PF3000A4ESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF3000A4ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF3000A4ESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF3000A4ESR2?
All MC33PF3000A4ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF3000A4ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF3000A4ESR2 part is unused and in its original packaging.
Return procedure for MC33PF3000A4ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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