NXP Semiconductors MC33PF3000A6ES

Overview

MC33PF3000A6ES from NXP Semiconductors is a power management IC (PMIC) engineered for the i.MX 6UL application processor with LPDDR2 memory, delivering four buck regulators (SW1A: 1.0 A, SW1B: 1.75 A, SW2: 1.25 A, SW3: 1.5 A), six LDOs including V33 (350 mA) and VCC_SD (100 mA), and integrated DDR reference (VREFDDR). It supports dynamic voltage scaling, I²C programmability, and coin-cell backup for RTC retention in portable industrial edge devices.

For engineers reviewing the MC33PF3000A6ES datasheet, MC33PF3000A6ES pinout, MC33PF3000A6ES application, or MC33PF3000A6ES equivalent, key selection criteria include OTP-programmable startup sequence, SW1A/SW1B independent vs. combined operation mode, VIN input range (2.8–4.5 V), VSNVS 3.0 V always-on rail, and compatibility with i.MX 6UL LPDDR2 power tree requirements.

Technical Context

The MC33PF3000A6ES implements a SMARTMOS-based multi-rail architecture with configurable buck regulator topology: SW1A and SW1B can operate independently (1.0 A / 1.75 A) or combined as a single 2.75 A channel. Its OTP memory stores startup timing, voltage setpoints, PWRON configuration, and I²C address (0x08–0x0F), eliminating external configuration components.

Regulator control includes dynamic voltage scaling (DVS) with PWM/PPM/APS modes, programmable soft-start ramp (25 mV/2 µs or 4 µs), and fault handling via open-drain INTB and RESETBMCU outputs. The VREFDDR output tracks 0.5 × SW3_OUT for precise DDR termination, while VSNVS provides 3.0 V at 1.0 mA from VIN or coin cell for secure non-volatile subsystems.

Key Specifications

Pinout & Package

MC33PF3000A6ES uses a 48-pin QFN package (7.0 mm × 7.0 mm, wettable flank, 98ASA00933D), rated for −40 °C to +105 °C automotive temperature range. Exposed pad (EP) serves as thermal and ground return path for buck/boost regulators.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Compared with MC33PF3000A5ES and MC33PF3000A7ES, MC33PF3000A6ES uniquely supports i.MX 6UL + LPDDR2 timing and voltage profiles, including SW3 output range (0.9–1.65 V) aligned to LPDDR2 VDDQ and VREFDDR tracking ratio.

Availability

MC33PF3000A6ES is available at Aetrix Electronics and suitable for industrial edge gateways, medical wearables, POS terminals, smart home hubs, and automotive infotainment systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MC33PF3000A6ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure, high-performance processing and power solutions for automotive, industrial, and IoT applications.

The PF3000 product line delivers highly integrated, OTP-programmable PMICs optimized for NXP's i.MX application processors, reducing external component count while enabling flexible, reliable power sequencing for memory-rich embedded systems.

FAQ

What is the operating temperature range for MC33PF3000A6ES?

MC33PF3000A6ES is rated for −40 °C to +105 °C, qualifying it for automotive and industrial applications. This extended range is enabled by its 48-pin QFN wettable flank package (98ASA00933D) and internal SMARTMOS process. The device maintains full specification compliance-including SW1A/SW1B current capability and VREFDDR accuracy-across this entire range. Thermal performance is enhanced by the exposed pad (EP), which must be connected to inner/external ground planes via multiple vias.

How does MC33PF3000A6ES support i.MX 6UL with LPDDR2 memory?

MC33PF3000A6ES supports i.MX 6UL with LPDDR2 through OTP-programmed voltage setpoints and timing: SW3 delivers 0.9–1.65 V (LPDDR2 VDDQ), VREFDDR outputs 0.5 × SW3_OUT (0.45–0.825 V) for precise termination, and startup sequencing aligns with i.MX 6UL boot requirements. Its SW1A/SW1B combination mode provides scalable core power, while VCC_SD's dual-voltage capability meets SDIO interface needs. This configuration is pre-validated in the A6 OTP variant per Table 1 of the datasheet.

Can MC33PF3000A6ES operate without an external coin cell?

Yes, MC33PF3000A6ES can operate without an external coin cell, but VSNVS will be powered solely from VIN. However, Standby mode entry/exit becomes unreliable below VIN ≤ 2.85 V without coin-cell backup. For robust RTC retention and guaranteed low-power state transitions-especially in battery-backed or energy-harvesting systems-the LICELL pin should be connected to a 1.2–3.0 V coin cell with 0.1 µF bypass capacitance, as specified in Section 7.2 of the datasheet.

What I²C address options are available for MC33PF3000A6ES?

MC33PF3000A6ES supports eight programmable I²C slave addresses: 0x08 through 0x0F. This is configured via the OTP_I2C_ADDR register, where I2C_SLV_ADDR[3] is hard-coded to 1 and bits [2:0] are user-programmable. The default address is 0x08 (when USE_DEFAULT_ADD bit is set). Address changes take effect immediately after OTP programming, enabling conflict-free integration in multi-PMIC systems such as those with separate power domains for CPU, memory, and peripherals.

Does MC33PF3000A6ES support dynamic voltage scaling (DVS) for processor cores?

Yes, MC33PF3000A6ES supports DVS on SW1A and SW1B buck regulators via I²C-controlled voltage updates and programmable soft-start ramp rates (25 mV/2 µs or 4 µs). This allows real-time adjustment of i.MX 6UL core voltage during varying computational loads-reducing dynamic power consumption without compromising performance. DVS operation is independent of OTP startup configuration and remains active during normal runtime, enabling adaptive power management in Linux or bare-metal environments.