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NXP Semiconductors MC33PF3000A6ESR2

Part No.:
MC33PF3000A6ESR2
Manufacturer:
NXP Semiconductors
Category:
Power Management - Specialized
Package:
48-VFQFN Exposed Pad
Datasheet:
AetrixMC33PF3000A6ESR2.pdf
Description:
POWER MANAGEMENT IC I.MX7 PRE-
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,894

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Product details

Overview

MC33PF3000A6ESR2 from NXP Semiconductors is a pre-programmed power management IC (PMIC) optimized for the i.MX 6UL application processor with LPDDR2 memory, delivering four buck regulators (SW1A: 1.0 A, SW1B: 1.75 A, SW2: 1.25 A, SW3: 1.5 A), six LDOs including V33 (350 mA) and VCC_SD (100 mA), and integrated DDR reference (VREFDDR). It supports dynamic voltage scaling, I²C programmability, and coin-cell backup for RTC.

For engineers reviewing the MC33PF3000A6ESR2 datasheet, MC33PF3000A6ESR2 pinout, MC33PF3000A6ESR2 application, or MC33PF3000A6ESR2 equivalent, key selection considerations include its OTP-configured startup sequence for i.MX 6UL/LPDDR2, VPWR input support up to 5.5 V, wettable-flank 48-QFN package, and dedicated VSNVS 3.0 V always-on rail for secure real-time clock operation.

Technical Context

The MC33PF3000A6ESR2 implements a multi-rail architecture with configurable buck regulator pairing (SW1A/SW1B as independent or combined 2.75 A), programmable soft-start timing (0.5 ms or 2.0 ms per slot), and DVS-controlled core supply ramping (25 mV/2–4 μs steps). Its OTP memory stores startup sequence, voltage setpoints, PWRON edge/level configuration, and I²C address (0x08–0x0F).

It integrates a 5.0–5.15 V/600 mA boost regulator for USB OTG, a 3.0 V/1.0 mA VSNVS rail for SNVS domain power or coin-cell backup, and a 0.5×SW3_OUT DDR reference generator. All LDOs-including VLDO2 (0.80–1.55 V, 250 mA) and VLDO4 (1.8–3.3 V, 350 mA)-support system peripheral powering with VIN or switcher-derived inputs.

Key Specifications

Parameter Value and Actual Design Meaning
Input Voltage Range 2.8–4.5 V (VIN) or 3.7–5.5 V (VPWR); enables direct battery or higher-voltage adapter compatibility
SW1A Output 0.7–1.425 V / 1.8 V / 3.3 V, 1.0 A; supplies i.MX 6UL ARM core with DVS-capable regulation
SW1B Output 0.7–1.475 V, 1.75 A; powers i.MX 6UL SOC logic or memory I/O when used independently
V33 Output 2.85–3.30 V, 350 mA; delivers stable 3.3 V for GPIO, USB PHY, and peripheral interfaces
VREFDDR Output 0.5 × SW3 output (0.45–0.825 V), 10 mA; provides precision DDR memory reference matching SW3 rail
VSNVS Output 3.0 V, 1.0 mA; maintains secure non-volatile storage and RTC during main power loss
I²C Address Programmable 0x08–0x0F; avoids bus conflicts in multi-PMIC or mixed-device systems

Pinout & Package

MC33PF3000A6ESR2 uses a 48-pin QFN package (98ASA00933D), 7.0 mm × 7.0 mm, wettable flank, with exposed thermal pad (EP) tied to ground for thermal dissipation.

Pin/Terminal Circuit Role Design Meaning
INTB Open-drain fault interrupt Signals overcurrent, UVLO, or regulator fault to host processor; requires external pull-up
RESETBMCU Open-drain reset output Deasserts 2.0 ms after final regulator enable; indicates full power rail readiness to i.MX 6UL
PWRON Power-on control input Configurable edge- or level-triggered start; supports mechanical switch debouncing (up to 750 ms)
SD_VSEL VCC_SD voltage select input Chooses 1.8 V/1.85 V (HIGH) or 2.85–3.3 V (LOW) for SD card interface compliance
SCL/SDA I²C interface Enables runtime reconfiguration of voltages, sequencing, and operating modes post-boot
VIN / VPWR Main power inputs VIN accepts ≤4.5 V; VPWR + external PFET supports 3.7–5.5 V input without regulator stress

Key Features

Feature Design Value
OTP-configured startup sequence Eliminates external timing components; supports 15-slot programmable delay (0.5/2.0 ms per slot) for i.MX 6UL power tree alignment
Dual-mode SW1A/SW1B buck configuration Enables flexible core rail design: independent 1.0 A + 1.75 A outputs or combined 2.75 A single-phase supply
VCC_SD dual-voltage LDO Meets SD 3.0/4.0 specification requirements via SD_VSEL pin-no external voltage translator needed
VSNVS coin-cell charger & switch Provides seamless RTC backup: switches between VIN and coin cell automatically; charges Li-ion/Li-MnO₂ cells
DDR reference generation VREFDDR tracks 50% of SW3 output, ensuring accurate DDR termination without external resistor divider

Applications

Industrial HMI Panel Smart Energy Gateway

Use Scenario: Compact, fanless industrial display with i.MX 6UL, LPDDR2, eMMC, and CAN/RS-485 interfaces.

IC Role / Device Role / Timing Role: MC33PF3000A6ESR2 supplies all rails: SW1A/B for CPU/SOC, SW2 for DDR I/O, V33 for communication peripherals, and VSNVS for secure RTC logging.

Use Value: OTP pre-configuration ensures deterministic boot timing; wettable-flank QFN aids automated optical inspection in high-reliability manufacturing.

Use Scenario: DIN-rail mounted home energy monitor with Zigbee/Wi-Fi connectivity, real-time metering, and local data logging.

IC Role / Device Role / Timing Role: MC33PF3000A6ESR2 powers i.MX 6UL application processor, LPDDR2 memory, RF modules, and isolated sensor interfaces using V33 and VLDO2 rails.

Use Value: Coin-cell-backed VSNVS maintains time-stamped event logs during grid outages; SWBST enables USB OTG firmware updates in field.

Medical Wearable Hub Retail POS Terminal

Use Scenario: Portable patient vitals aggregator with Bluetooth LE, OLED display, and rechargeable battery.

IC Role / Device Role / Timing Role: MC33PF3000A6ESR2 manages low-quiescent power sequencing: SW3 for display driver, VLDO2 for analog sensors, VCC_SD for microSD data storage.

Use Value: Programmable sleep mode reduces system standby current; SD_VSEL supports both legacy and UHS-I SD cards in same BOM.

Use Scenario: Compact countertop payment terminal with touchscreen, EMV reader, thermal printer, and cellular modem.

IC Role / Device Role / Timing Role: MC33PF3000A6ESR2 delivers regulated rails to i.MX 6UL, LPDDR2, secure element, and peripheral controllers-V33 for printer logic, VLDO4 for modem interface.

Use Value: VPWR input support allows direct 5 V USB-C power delivery; I²C reprogramming enables firmware-based rail tuning during certification testing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC33PF3000A5ESR2 Pre-programmed for i.MX 6SL with LPDDR2; different OTP startup sequence and voltage setpoints Targets i.MX 6SL-based designs-not compatible with i.MX 6UL memory map or power sequencing Select only if migrating from i.MX 6SL hardware; requires PCB-level validation of SWx timing and VREFDDR sourcing
MC33PF3000A7ESR2 Pre-programmed for i.MX 6UL with DDR3L; VREFDDR derived from SW2 instead of SW3; higher V33 current (500 mA) Designed for DDR3L memory interface-not suitable for LPDDR2 timing or voltage profiles Use only when upgrading memory to DDR3L; verify DDR3L termination and i.MX 6UL DDR controller register settings

Compared with MC33PF3000A5ESR2 and MC33PF3000A7ESR2, the MC33PF3000A6ESR2 uniquely matches the i.MX 6UL + LPDDR2 power tree with SW3-sourced VREFDDR, optimized SW1A/B sequencing, and VCC_SD voltage range selection-making it the only drop-in solution for this specific processor-memory combination.

Availability

MC33PF3000A6ESR2 is available at Aetrix Electronics and suitable for industrial HMI panels, smart energy gateways, medical wearable hubs, and retail POS terminals requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MC33PF3000A6ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and power management.

The PF3000 product line was designed specifically to simplify power architecture for NXP's i.MX 6 and i.MX 7 families-integrating OTP-programmable sequencing, DDR reference generation, and coin-cell backup into a single wettable-flank QFN package.

FAQ

What is the operating temperature range for MC33PF3000A6ESR2?

MC33PF3000A6ESR2 is rated for −40 °C to +105 °C ambient operation, qualifying it for automotive and industrial applications. This rating aligns with the MC33 prefix variant (as opposed to MC32 or MC34), and is confirmed in Table 1 of the PF3000 datasheet under "MC33PF3000A7ES" notes-where MC33-grade parts share the same 98ASA00933D package and thermal specifications. The A6ESR2 suffix denotes tape-and-reel packaging (R2) and i.MX 6UL/LPDDR2 OTP configuration.

Does MC33PF3000A6ESR2 support DDR3L memory?

No, MC33PF3000A6ESR2 is specifically programmed for LPDDR2 memory on the i.MX 6UL. Its VREFDDR output is derived from SW3 (0.5 × SW3_OUT), matching LPDDR2's VDDQ/2 reference requirement. DDR3L support requires MC33PF3000A7ESR2, which sources VREFDDR from SW2 and configures different startup timing and voltage setpoints per Table 1 of the datasheet.

Can MC33PF3000A6ESR2 be used with input voltages above 4.5 V?

Yes-MC33PF3000A6ESR2 supports up to 5.5 V via the VPWR pin when paired with an external P-channel MOSFET as a front-end LDO. The internal regulators remain protected at ≤4.5 V. When using VIN directly, the maximum is 4.5 V. This dual-input architecture is explicitly defined in Section 1 and Table 3 of the PF3000 datasheet.

How is the VCC_SD output voltage selected on MC33PF3000A6ESR2?

VCC_SD voltage on MC33PF3000A6ESR2 is selected dynamically by the SD_VSEL pin: logic HIGH yields 1.80–1.85 V (for UHS-I SD cards), logic LOW yields 2.85–3.30 V (for standard SD/SDIO). The SD_VSEL buffer is powered by VDDIO, and defaults to HIGH if VDDIO is absent-ensuring safe default behavior during power-up sequences.

Is MC33PF3000A6ESR2 pin-compatible with other PF3000 variants?

Yes-MC33PF3000A6ESR2 shares identical 48-QFN pinout, footprint, and thermal pad layout with all PF3000 family members (e.g., MC33PF3000A5ESR2, MC33PF3000A7ESR2). Differences are confined to OTP programming, not physical connectivity. This enables hardware reuse across i.MX 6SL/6UL/6SX platforms when supported by appropriate firmware and board-level decoupling.

MC33PF3000A6ESR2 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
48-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
i.MX Processors
Current - Supply:
-
Voltage - Supply:
2.8V ~ 5.5V
Operating Temperature:
-40°C ~ 105°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
48-QFN (7x7)

MC33PF3000A6ESR2 FAQ

1.How can I place an order for MC33PF3000A6ESR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for MC33PF3000A6ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC33PF3000A6ESR2 reliable?

The price and inventory of MC33PF3000A6ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF3000A6ESR2 is usually 5 days.

3.What payment methods are accepted for MC33PF3000A6ESR2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF3000A6ESR2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC33PF3000A6ESR2?

MC33PF3000A6ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC33PF3000A6ESR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC33PF3000A6ESR2?

For technical support, including MC33PF3000A6ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF3000A6ESR2 requirements.

6.How does Aetrix verify that MC33PF3000A6ESR2 is sourced from the original manufacturer or authorized distributors?

All MC33PF3000A6ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF3000A6ESR2 meets industry standards.

7.What is the process for return or replacement of MC33PF3000A6ESR2?

All MC33PF3000A6ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF3000A6ESR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC33PF3000A6ESR2 part is unused and in its original packaging.

Return procedure for MC33PF3000A6ESR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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