NXP Semiconductors MC33PF3001A6ES

Overview

MC33PF3001A6ES from NXP Semiconductors is a pre-programmed Power Management IC (PMIC) optimized for i.MX 6UL processors with LPDDR2 memory, delivering three buck regulators (SW1: 2.75 A, SW2: 1.25 A, SW3: 1.5 A) and seven LDOs-including VCC_SD (100 mA, dual-voltage SD card support), V33 (350 mA), and VSNVS (3.0 V, 1.0 mA RTC supply)-in a 48-pin QFN 7.0 mm × 7.0 mm wettable flank package. It enables full power sequencing for industrial embedded systems requiring stable low-noise core and I/O rails.

For engineers reviewing the MC33PF3001A6ES datasheet, MC33PF3001A6ES pinout, MC33PF3001A6ES application, or MC33PF3001A6ES equivalent, key selection criteria include its fixed OTP startup sequence (SW1=1.4 V, SW2=3.3 V, SW3=1.2 V), -40 °C to 105 °C automotive-grade temperature range, I²C programmability, and integrated coin cell charger for battery-backed memory retention.

Technical Context

The MC33PF3001A6ES implements a fixed-OTP, non-reprogrammable power tree with deterministic startup timing controlled by a trimmed 32 kHz clock, supporting i.MX 6UL-specific voltage domains: SW1 powers the ARM Cortex-A7 core (1.4 V), SW2 supplies DDR3L I/O (3.3 V), and SW3 drives logic rails (1.2 V). Its architecture integrates dynamic voltage scaling (DVS) with programmable slew rate (6.25 mV/μs) and supports both PWM and PFM switching modes per regulator.

Control is hybrid: I²C (address 0x08) enables runtime reconfiguration of output voltages and fault registers, while dedicated logic pins-PWRON (level-sensitive turn-on), RESETBMCU (2 ms post-sequence deassertion), INTB (open-drain fault interrupt), and SD_VSEL (VCC_SD voltage selection)-provide direct hardware coordination with the host processor without software overhead.

Key Specifications

Pinout & Package

MC33PF3001A6ES uses a 48-pin QFN 7.0 mm × 7.0 mm wettable flank (WF-type) package (98ASA00933D), featuring an exposed thermal pad (EP) for enhanced heat dissipation and solder joint inspection. Pin functions are fixed per OTP configuration and include dedicated feedback (SWxFB), switch node (SWxLX), and input (SWxIN) terminals for each buck regulator, plus isolated ground references (GNDREF1, GNDREF2, GNDREF) to minimize noise coupling between analog and power domains.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Compared with MC33PF3001A6ES, MC33PF3001A7ES offers higher SW3 output (1.35 V) for DDR3L termination, while MC34PF3001A6ES provides identical functionality with industrial-grade qualification-enabling design reuse across automotive and industrial segments with minimal BOM or layout changes.

Availability

MC33PF3001A6ES is available at Aetrix Electronics and suitable for industrial control HMI, automotive infotainment gateways, medical patient monitors, smart energy meters, and secure IoT edge devices requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for MC33PF3001A6ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and associated power management.

The PF3001 product line was designed specifically to deliver fully integrated, OTP-configured power solutions for NXP's i.MX 6 and i.MX 7 application processors-reducing design risk, eliminating external sequencing components, and accelerating time-to-market for embedded systems.

FAQ

What is the default I²C address for the MC33PF3001A6ES?

The MC33PF3001A6ES has a fixed default I²C address of 0x08, as programmed in its one-time-programmable (OTP) memory. This address cannot be altered in the field and is shared across all PF3001 variants. The MC33PF3001A6ES uses this address for register read/write operations including voltage adjustment, fault status polling, and mode control-ensuring consistent communication without address jumpers or configuration pins.

How does the MC33PF3001A6ES support i.MX 6UL with LPDDR2 memory?

The MC33PF3001A6ES supports i.MX 6UL with LPDDR2 through its OTP-configured power tree: SW1 delivers 1.4 V @ 2.75 A to the ARM Cortex-A7 core, SW2 supplies 3.3 V @ 1.25 A to LPDDR2 I/O, and SW3 provides 1.2 V @ 1.5 A to logic domains. Its startup sequence (SW1_SEQ=3, SW2_SEQ=3, SW3_SEQ=3) and timing parameters (SEQ_CLK_SPEED=2000 µs) match i.MX 6UL LPDDR2 initialization requirements, ensuring reliable boot without external sequencing logic.

Can the MC33PF3001A6ES operate with a 5 V input supply?

Yes, the MC33PF3001A6ES can operate with a 5 V input supply using its optional front-end LDO: connect the 5 V rail to VPWR, populate an external P-MOSFET (e.g., FDMA908PZ), and route VIN to the LDO output. This keeps internal regulator inputs ≤4.5 V. If input is ≤4.5 V, bypass VPWR (ground it) and connect directly to VIN. The MC33PF3001A6ES detects input source automatically and configures internal paths accordingly.

What is the function of the SD_VSEL pin on the MC33PF3001A6ES?

The SD_VSEL pin on the MC33PF3001A6ES selects the output voltage of the VCC_SD LDO regulator: when SD_VSEL = LOW, VCC_SD outputs 2.85–3.3 V; when SD_VSEL = HIGH, it outputs 1.8–1.85 V. This enables single-hardware support for both high-speed SD cards (3.3 V) and UHS-I cards (1.8 V), with automatic selection driven by the i.MX 6UL's SDIO controller-no software intervention required for voltage switching.

Does the MC33PF3001A6ES include thermal protection?

Yes, the MC33PF3001A6ES includes thermal protection that triggers an overtemperature fault reported via the INTB pin. When die temperature exceeds the threshold, the IC asserts INTB (open-drain low) and sets the corresponding bit in the INTSTAT3 register. This fault is maskable via I²C, and recovery occurs automatically after temperature falls below hysteresis. The MC33PF3001A6ES also features an exposed thermal pad (EP) to enhance heat dissipation in its 48-pin QFN package.