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NXP Semiconductors MC33PF3001A6ESR2
- Part No.:
- MC33PF3001A6ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC33PF3001A6ESR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX7 PRE-
- Quantity:
- Payment:
- Shipping:
Inventory:3,029
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Product details
Overview
MC33PF3001A6ESR2 from NXP Semiconductors is a pre-programmed Power Management IC (PMIC) optimized for i.MX 6UL processors with LPDDR2 memory, delivering three buck regulators (SW1: 2.75 A, SW2: 1.25 A, SW3: 1.5 A) and seven LDOs-including VCC_SD (100 mA, dual-voltage SD card support), V33 (350 mA), and VSNVS (1.0 mA RTC supply)-in a 48-pin QFN 7.0 mm × 7.0 mm wettable flank package. It enables full power sequencing for industrial embedded systems requiring stable, low-quiescent-current rail generation.
For engineers reviewing the MC33PF3001A6ESR2 datasheet, MC33PF3001A6ESR2 pinout, MC33PF3001A6ESR2 application, or MC33PF3001A6ESR2 equivalent, this page provides verified regulator output voltages (e.g., SW1 = 1.4 V, SW2 = 3.3 V, SW3 = 1.2 V per OTP A6), I²C programmability, dynamic voltage scaling, integrated coin-cell charging, and thermal/overvoltage protection-key selection criteria for i.MX 6UL-based designs.
Technical Context
The MC33PF3001A6ESR2 implements fixed OTP startup sequencing (SW1_SEQ=3, SW2_SEQ=3, SW3_SEQ=3, VCC_SD_SEQ=3) and uses a trimmed 16 MHz RC oscillator to derive switching frequencies (2.0 MHz for all bucks) and precise timing for DVS ramp rates (6.25 mV/μs). Its control logic integrates PWRON-level-sensitive turn-on, open-drain RESETBMCU (deasserted 2.0 ms after final regulator enable), and INTB fault signaling with maskable interrupts.
Power architecture separates high-current paths: SW1LX/SW2LX/SW3LX drive external inductors; GNDREF1/GNDREF2/GNDREF isolate analog references; VPWR supports optional front-end LDO via external PMOS (LDOG gate drive) for input voltages up to 5.5 V; and VSNVS operates as either 3.0 V LDO or bypass switch powered by VIN or coin cell (LICELL).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8–4.5 V (VIN) or 3.7–5.5 V (VPWR with external PMOS); enables flexible system-level power path design |
| SW1 Output | 1.4 V / 2.75 A (OTP A6); powers i.MX 6UL core domain with dynamic voltage scaling support |
| SW2 Output | 3.3 V / 1.25 A (OTP A6); supplies DDR3L I/O and peripheral rails |
| VCC_SD Output | 3.3 V / 100 mA or 1.85 V / 100 mA (SD_VSEL-selectable); meets dual-voltage SD card interface requirements |
| VSNVS Output | 3.0 V / 1.0 mA; powers i.MX SNVS/SRTC domain with battery backup and coin-cell charging capability |
| I²C Address | 0x08 (default); allows direct integration into existing i.MX 6UL boot firmware without address conflict |
| Operating Temperature | −40 °C to +105 °C; qualified for industrial applications per ordering code A6 |
| Package | 48-pin QFN 7.0 mm × 7.0 mm WF-type; wettable flank enables automated optical solder-joint inspection |
Pinout & Package
MC33PF3001A6ESR2 uses a 48-pin QFN 7.0 mm × 7.0 mm wettable flank (WF-type) package (NXP package code 98ASA00933D) with exposed thermal pad (EP) tied to ground for enhanced thermal dissipation. Pin functions are defined per NXP PF3001 Rev. 5.1 datasheet Section 7.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 INTB | Digital interrupt output | Open-drain fault indicator; asserts low on unmasked overvoltage, thermal, or short-circuit events |
| 2 SD_VSEL | Digital configuration input | Selects VCC_SD output: LOW = 2.85–3.3 V, HIGH = 1.8–1.85 V; defaults to HIGH if VDDIO absent |
| 3 RESETBMCU | Digital reset output | Open-drain active-low signal deasserted 2.0 ms after last regulator enables; used to release i.MX 6UL from POR |
| 6 SW1FB | Analog feedback input | Closes SW1 regulation loop; requires dedicated trace routing away from high-current paths for stability |
| 8,9 SW1LX | Analog switch node | Connects to SW1 inductor; dual pins reduce parasitic inductance in high-current 2.75 A path |
| 34 VSNVS | Analog always-on supply | Provides 3.0 V to i.MX SNVS domain; sourced from VIN or LICELL; supports RTC retention during main power loss |
| 45 SDA, 46 SCL | I²C bidirectional interface | Enable runtime reconfiguration of registers (e.g., DVS ramp rate, fault masks); require 4.7 kΩ pull-ups to VDDIO |
| EP | Thermal ground pad | Exposed copper pad connected to internal GND planes; must be vias-to-ground for thermal management & EMI reduction |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configured startup sequence | Fixed A6 configuration (SW1=1.4 V, SW2=3.3 V, SW3=1.2 V, VCC_SD=3.3 V/1.85 V) eliminates external configuration components and ensures repeatable i.MX 6UL boot timing |
| Integrated coin-cell charger | LICELL pin supports automatic trickle-charge of backup battery; maintains RTC operation during main power failure without external circuitry |
| Dynamic voltage scaling (DVS) | 6.25 mV/μs ramp rate (OTP A6) enables controlled core voltage transitions during i.MX 6UL frequency scaling, reducing transient current spikes |
| Front-end VPWR LDO support | LDOG pin drives external PMOS to regulate >4.5 V inputs down to ≤4.5 V, protecting internal regulators while maintaining compatibility with 5 V industrial supplies |
| Multi-rail monitoring & protection | Independent overvoltage detection on VPWR (6.0 V threshold), thermal shutdown, and short-circuit protection per buck regulator ensure system reliability |
| Low-noise clocking | Trimmed 16 MHz RC oscillator provides stable 2.0 MHz switching frequency and accurate DVS timing; ±3% factory trim adjustment available for EMI optimization |
Applications
| Industrial HMI Panel | Secure IoT Gateway |
|---|---|
Use Scenario: Fanless, DIN-rail mounted human-machine interface running Linux on i.MX 6UL with CAN/Ethernet connectivity and local SD card logging. IC Role / Device Role / Timing Role: MC33PF3001A6ESR2 delivers sequenced core (1.4 V), DDR (3.3 V), and I/O (3.3 V) rails; VSNVS maintains RTC across AC brownouts; VCC_SD powers SD card at 3.3 V. Use Value: OTP A6 configuration matches i.MX 6UL LPDDR2 timing; −40 °C to +105 °C rating ensures operation in uncontrolled enclosures; wettable flank package supports AOI inspection for high-reliability manufacturing. |
Use Scenario: Edge gateway aggregating sensor data via BLE/Wi-Fi, performing local encryption, and forwarding to cloud via LTE, deployed in remote utility substations. IC Role / Device Role / Timing Role: MC33PF3001A6ESR2 powers i.MX 6UL application processor, crypto accelerator, and wireless SoCs; VSNVS + LICELL preserves secure time-stamping during grid outages. Use Value: Integrated coin-cell charging eliminates discrete backup power circuitry; I²C programmability allows field-updatable DVS profiles for varying compute loads; VPWR LDO support enables direct 5 V input from PoE-powered Ethernet ports. |
| Medical Point-of-Care Monitor | Ruggedized Field Tablet |
Use Scenario: Battery-backed portable monitor displaying real-time vitals, interfacing with USB peripherals and SD storage, requiring continuous RTC and low-power sleep modes. IC Role / Device Role / Timing Role: MC33PF3001A6ESR2 supplies i.MX 6UL core, display interface, and USB PHY; VSNVS retains time/date during battery swaps; SW1 enters PFM mode during deep sleep. Use Value: 1.0 mA VSNVS quiescent current extends battery life; OTP-fixed sequencing avoids boot failures due to software corruption; dual-voltage VCC_SD supports legacy SDHC cards. |
Use Scenario: MIL-STD-810G certified tablet for warehouse logistics, using i.MX 6UL, barcode scanner, and cellular modem, operating in wide ambient temperature ranges. IC Role / Device Role / Timing Role: MC33PF3001A6ESR2 generates all rails for processor, memory, and peripherals; thermal shutdown protects against sustained high-temp operation; GNDREF isolation minimizes noise coupling to analog sensors. Use Value: −40 °C to +105 °C qualification ensures functionality in desert or freezer environments; wettable flank QFN simplifies rework in repair depots; 48-pin layout accommodates dense PCB routing for compact form factors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF3001A7ESR2 | Same OTP architecture but configured for i.MX 6UL with DDR3L (SW1=1.4 V, SW2=3.3 V, SW3=1.35 V, VCC_SD=3.3 V/1.85 V); identical package and pinout | Targets DDR3L memory interface instead of LPDDR2; requires matching memory subsystem design | Select MC33PF3001A7ESR2 only when DDR3L is used; otherwise MC33PF3001A6ESR2 is optimal for LPDDR2-based i.MX 6UL designs |
| PF0100A0BNK | Legacy NXP PMIC for i.MX 6SoloX; lacks VSNVS coin-cell charging, has lower SW1 current (2.5 A vs. 2.75 A), and no VPWR LDO support | Designed for older i.MX 6SX platforms; not OTP-configured for i.MX 6UL LPDDR2 sequences | MC33PF3001A6ESR2 offers higher integration, better efficiency, and direct i.MX 6UL support; PF0100A0BNK is suitable only for legacy redesigns with unchanged hardware |
Compared with MC33PF3001A7ESR2, MC33PF3001A6ESR2 delivers optimized voltage setpoints for LPDDR2 timing margins and reduced startup delay for memory initialization; versus PF0100A0BNK, it adds coin-cell charging, higher buck current capability, and VPWR LDO flexibility-critical for new industrial i.MX 6UL designs requiring long-term RTC retention and 5 V input compatibility.
Availability
MC33PF3001A6ESR2 is available at Aetrix Electronics and suitable for industrial HMI panels, secure IoT gateways, medical point-of-care monitors, and ruggedized field tablets requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for MC33PF3001A6ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure, energy-efficient processing solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and their power ecosystems.
The PF3001 product line was designed specifically to deliver fully integrated, OTP-configured power management for NXP's i.MX 6 and i.MX 7 application processors-reducing design complexity, eliminating external configuration components, and ensuring robust, repeatable power sequencing in industrial and automotive systems.
FAQ
What is the default I²C address of the MC33PF3001A6ESR2?
The MC33PF3001A6ESR2 uses a fixed default I²C address of 0x08, as specified in Table 4 of the PF3001 datasheet Rev. 5.1. This address is hard-coded in OTP and cannot be altered. The MC33PF3001A6ESR2 supports standard-mode (100 kHz) and fast-mode (400 kHz) I²C communication for register read/write operations, including dynamic voltage scaling control and fault status monitoring.
How does the MC33PF3001A6ESR2 support i.MX 6UL with LPDDR2 memory?
The MC33PF3001A6ESR2 is pre-programmed with OTP configuration A6, which sets SW1 to 1.4 V (core), SW2 to 3.3 V (I/O), SW3 to 1.2 V (LPDDR2 VDDQ), and VCC_SD to 3.3 V/1.85 V-matching the exact voltage and sequencing requirements of i.MX 6UL with LPDDR2. Its fixed startup timing (SEQ_CLK_SPEED = 2000 µs) ensures reliable memory initialization without software intervention.
Does the MC33PF3001A6ESR2 include battery backup capability?
Yes, the MC33PF3001A6ESR2 integrates a dedicated VSNVS regulator (3.0 V / 1.0 mA) with built-in coin-cell charging via the LICELL pin. When a coin cell is connected, the MC33PF3001A6ESR2 automatically trickle-charges it and switches to coin-cell power during main supply loss-ensuring continuous RTC operation and secure time-stamping in industrial and medical applications.
What package type and thermal features does the MC33PF3001A6ESR2 use?
The MC33PF3001A6ESR2 uses a 48-pin QFN 7.0 mm × 7.0 mm wettable flank (WF-type) package (NXP code 98ASA00933D) with an exposed thermal pad (EP). This pad must be connected to internal and external ground planes via multiple vias to enable effective thermal dissipation-critical for maintaining performance under continuous 2.75 A SW1 load and industrial temperature operation up to +105 °C.
Can the MC33PF3001A6ESR2 operate with a 5 V input supply?
Yes, the MC33PF3001A6ESR2 supports 5 V input via its VPWR pin using an external PMOS pass FET driven by the LDOG pin. This front-end LDO configuration regulates 5 V down to ≤4.5 V for internal regulators, protecting them from overvoltage. For inputs ≤4.5 V, the VIN pin is used directly-no external FET required. Both configurations are supported without hardware changes.
MC33PF3001A6ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Processor
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-HVQFN (7x7)
MC33PF3001A6ESR2 FAQ
1.How can I place an order for MC33PF3001A6ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF3001A6ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF3001A6ESR2 reliable?
The price and inventory of MC33PF3001A6ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF3001A6ESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF3001A6ESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF3001A6ESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF3001A6ESR2?
MC33PF3001A6ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF3001A6ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF3001A6ESR2?
For technical support, including MC33PF3001A6ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF3001A6ESR2 requirements.
6.How does Aetrix verify that MC33PF3001A6ESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF3001A6ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF3001A6ESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF3001A6ESR2?
All MC33PF3001A6ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF3001A6ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF3001A6ESR2 part is unused and in its original packaging.
Return procedure for MC33PF3001A6ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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