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NXP Semiconductors MC33PF8100A0ES
- Part No.:
- MC33PF8100A0ES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8100A0ES.pdf
- Description:
- IC POWER MANAGEMENT
- Quantity:
- Payment:
- Shipping:
Inventory:2,616
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Product details
Overview
MC33PF8100A0ES from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed as the primary power solution for i.MX 8 and S32x application processors. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B-compliant monitoring circuitry. It powers CPU cores, LPDDR4/DDR4 memory, GPU, and peripherals in infotainment and ADAS systems.
For engineers reviewing the MC33PF8100A0ES datasheet, MC33PF8100A0ES pinout, MC33PF8100A0ES application, or MC33PF8100A0ES equivalent, this page delivers verified technical context, validated pin functions, confirmed automotive safety features, OTP-configurable startup sequencing, and I²C-programmable DVS for dynamic power states - all specific to the MC33PF8100A0ES variant.
Technical Context
The MC33PF8100A0ES implements a deterministic state machine with hard WD reset, fault shutdown, and fail-safe transitions, supporting QM (Quality Management) safety grade without ASIL B hardware safety mechanisms. Its seven buck regulators include SW1–SW6 (0.4 V–1.8 V, ±1.5 % accuracy, 2.5 A each) and SW7 (1.0 V–4.1 V, ±2 %, 2.5 A), with configurable multi-phase operation up to quad-phase (10 A).
It features 24-channel analog multiplexer for system diagnostics, OTP memory storing voltage setpoints and power-up sequence, and 3.4 MHz I²C interface for runtime reconfiguration. The device supports VTT termination on SW6, spread-spectrum switching, and programmable soft-start/power-down sequences - all validated for automotive ambient temperatures (−40 °C to +105 °C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 12 channels: 7 buck (SW1–SW7) + 4 LDOs (LDO1–LDO4) + VSNVS RTC supply |
| Buck Output Range | SW1–SW6: 0.4 V–1.8 V (6.25 mV step); SW7: 1.0 V–4.1 V - enables precise core/memory rail targeting |
| Current Rating | 2.5 A per buck channel; 400 mA per LDO - sufficient for i.MX8QM/QXP CPU clusters and LPDDR4 I/O |
| I²C Interface | Up to 3.4 MHz - supports fast runtime voltage scaling and fault register polling in real-time OS environments |
| Safety Grade | QM (Quality Management) - certified for automotive infotainment with built-in voltage/thermal monitoring and ABIST |
| Operating Temp | −40 °C to +105 °C ambient - qualified for under-dash automotive deployment without derating |
| Package | HVQFN56, 8 mm × 8 mm × 0.85 mm, wettable flanks - enables automated optical inspection and robust thermal dissipation (RθJA = 27 °C/W on 4-layer board) |
Pinout & Package
HVQFN56 package (SOT684-21), thermally enhanced, 0.5 mm pitch, 8 mm × 8 mm body with exposed pad (EPAD) connected to GND for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (Pin 50) | Main input supply | Accepts 2.7 V–5.5 V system rail; powers internal LDOs and buck controllers - must be decoupled per layout guidelines |
| SW1FB–SW7FB (Pins 3,12,13,30,31,38) | Buck output feedback | Resistive divider inputs for closed-loop regulation; support ±1.5 % (SW1–SW6) or ±2 % (SW7) output accuracy |
| LDO1OUT–LDO4OUT (Pins 15,18,25,28) | LDO regulated outputs | Deliver 1.5 V–5.0 V at 400 mA each; configurable as load switches for peripheral power gating |
| VSNVS (Pin 47) | RTC supply output | Provides 1.8 V / 3.0 V / 3.3 V at 10 mA from VIN or coin cell (LICELL) - maintains real-time clock during system sleep |
| SCL/SDA (Pins 55/56) | I²C interface | 3.4 MHz high-speed bus for configuring DVS, reading PGOOD status, and accessing 24-channel AMUX diagnostics |
| RESETBMCU (Pin 21) | Open-drain MCU reset | Asserts low on startup failure or critical fault - directly interfaces with i.MX8 reset controller without external pull-up |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable startup sequence | Eliminates external resistors and timing components; stores voltage setpoints, enable order, and soft-start delays in one-time programmable memory |
| Multi-phase buck configuration | SW1–SW4 can be combined into quad-phase regulator (up to 10 A) for high-current CPU cores - reduces ripple and improves transient response |
| VTT termination on SW6 | Enables DDR memory termination compliance without external components - supports LPDDR4/DDR4 VTT rails directly |
| 24-channel analog multiplexer (AMUX) | Routes internal voltage/temperature monitors to single ADC input - simplifies system-level health diagnostics and reduces BOM count |
| QM-grade functional safety | Includes independent voltage monitoring, thermal shutdown, watchdog supervision, and ABIST - meets ISO 26262 QM requirements for infotainment |
Applications
| Automotive Infotainment Head Unit | i.MX 8QM-Based ADAS Domain Controller |
|---|---|
|
Use Scenario: Central display unit with Android Automotive OS, dual-display output, and audio DSP requiring stable multi-rail power. IC Role / Device Role / Timing Role: Primary PMIC supplying CPU cores (SW1–SW3), GPU (SW4), LPDDR4 memory (SW5/SW6), and I/O rails (LDO1–LDO4). Use Value: OTP-stored sequencing ensures deterministic boot across temperature; VTT on SW6 eliminates discrete termination resistor for LPDDR4 compliance. |
Use Scenario: Sensor fusion ECU integrating camera, radar, and CAN FD, running AUTOSAR on i.MX 8QM with safety-critical partitioning. IC Role / Device Role / Timing Role: QM-grade power manager delivering isolated power domains for ASIL-B software partitions and non-safety peripherals. Use Value: Independent voltage monitors and ABIST enable runtime self-test; 24-channel AMUX supports diagnostic logging without additional ADC resources. |
| Industrial HMI with i.MX 8QXP | Connected Vehicle Telematics Gateway |
|
Use Scenario: Ruggedized factory-floor HMI with touch interface, Ethernet, and eMMC storage operating in extended temperature range. IC Role / Device Role / Timing Role: Single-chip power solution for i.MX 8QXP CPU, DDR3L memory, and 3.3 V/1.8 V I/O peripherals. Use Value: −40 °C to +105 °C rating ensures reliability in uncontrolled environments; spread-spectrum switching reduces EMI in dense PCB layouts. |
Use Scenario: LTE/V2X gateway aggregating cellular, GNSS, and CAN data for OTA updates and fleet telematics. IC Role / Device Role / Timing Role: Power manager for LS1046A or i.MX 8QM host processor, DDR4 memory, SIM card, and RF front-end bias supplies. Use Value: Coin cell charger (LICELL) maintains secure boot keys and timekeeping during main power loss; PGOOD signals coordinate safe firmware update sequencing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200A0ES | ASIL B safety certification; adds FSOB fail-safe output, ABIST-on-demand, secure I²C write, and fault counter registers not present in MC33PF8100A0ES | Required for ASIL B–compliant safety islands (e.g., instrument cluster, ADAS sensor fusion); not needed for QM-only infotainment | Select MC33PF8200A0ES only when functional safety hardware features are mandated by system architecture. |
| MC33PF8100FJTS | Same PF8100 family, identical QM safety grade and regulator topology, but pre-programmed OTP for i.MX 8QXP + LPDDR4; TS suffix indicates dimple wettable flank package recommended for new designs | Optimized for latest i.MX 8QXP-based platforms with LPDDR4 memory; ES variant requires external OTP programming | Choose MC33PF8100FJTS for new i.MX 8QXP designs to avoid OTP programming overhead and leverage improved manufacturability. |
Compared with MC33PF8200A0ES, the MC33PF8100A0ES omits ASIL B hardware safety logic but retains full QM functionality and identical power delivery capability; versus MC33PF8100FJTS, it offers identical performance but requires OTP configuration for target processor support - making it suitable for flexible prototyping or legacy platform reuse.
Availability
MC33PF8100A0ES is available at Aetrix Electronics and suitable for automotive infotainment head units, i.MX 8QM-based ADAS domain controllers, and industrial HMIs requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified power management.
Supply support for MC33PF8100A0ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in application processor ecosystems and power management.
The PF8100 product line was engineered specifically to serve as the reference PMIC for NXP's i.MX 8 and S32x families - delivering tightly integrated, OTP-configurable, and automotive-qualified power delivery with minimal external components.
FAQ
What is the safety qualification level of the MC33PF8100A0ES?
The MC33PF8100A0ES is qualified to QM (Quality Management) level per ISO 26262, with built-in voltage/thermal monitoring and ABIST, but does not include ASIL B hardware safety mechanisms like FSOB or secure I²C. It is intended for non-safety-critical automotive domains such as infotainment, where functional safety is managed at the system level rather than the PMIC silicon level. MC33PF8100A0ES meets AEC-Q100 Grade 2 requirements.
Does the MC33PF8100A0ES support dynamic voltage scaling (DVS) for processor cores?
Yes, the MC33PF8100A0ES supports DVS on SW1 through SW6 via its 3.4 MHz I²C interface, enabling real-time adjustment of output voltages in 6.25 mV steps to match CPU frequency scaling. This capability is used in i.MX 8 platforms to reduce dynamic power consumption during low-load states while maintaining stability across temperature and load transients.
Can the MC33PF8100A0ES power LPDDR4 memory directly?
Yes, the MC33PF8100A0ES supports LPDDR4 memory through dedicated regulator channels: SW5 and SW6 provide core and I/O supplies, and SW6 includes VTT termination mode compliant with JEDEC LPDDR4 specifications. Its OTP configuration can be tailored for i.MX 8QXP or i.MX 8QM LPDDR4 timing and voltage requirements - confirmed in NXP's MC33PF8100FJ and MC33PF8100EP reference designs.
What package type and thermal performance does the MC33PF8100A0ES use?
The MC33PF8100A0ES uses the HVQFN56 (SOT684-21) package: 8 mm × 8 mm × 0.85 mm with wettable flanks and exposed thermal pad. On a standard 4-layer PCB, its junction-to-ambient thermal resistance is 27 °C/W, enabling reliable operation at full load up to +105 °C ambient. The EPAD must be soldered to a solid GND plane for optimal thermal and EMI performance.
How is the MC33PF8100A0ES configured for different processor platforms?
The MC33PF8100A0ES uses OTP memory to store platform-specific settings including voltage setpoints, power-up sequencing order, soft-start timing, and regulator enable/disable states. While MC33PF8100A0ES ships unprogrammed ('A0' variant), NXP provides pre-compiled OTP images (e.g., MC33PF8100FJ.zip for i.MX 8QXP) that can be loaded via I²C or dedicated programming tools - enabling rapid adaptation across i.MX 8 and S32x derivatives without hardware changes.
MC33PF8100A0ES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8100A0ES FAQ
1.How can I place an order for MC33PF8100A0ES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8100A0ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8100A0ES reliable?
The price and inventory of MC33PF8100A0ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8100A0ES is usually 5 days.
3.What payment methods are accepted for MC33PF8100A0ES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8100A0ES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8100A0ES?
MC33PF8100A0ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8100A0ES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8100A0ES?
For technical support, including MC33PF8100A0ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8100A0ES requirements.
6.How does Aetrix verify that MC33PF8100A0ES is sourced from the original manufacturer or authorized distributors?
All MC33PF8100A0ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8100A0ES meets industry standards.
7.What is the process for return or replacement of MC33PF8100A0ES?
All MC33PF8100A0ES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8100A0ES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8100A0ES part is unused and in its original packaging.
Return procedure for MC33PF8100A0ES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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