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NXP Semiconductors MC33PF8100A0ESR2
- Part No.:
- MC33PF8100A0ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8100A0ESR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX8 NON-PR
- Quantity:
- Payment:
- Shipping:
Inventory:2,283
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Product details
Overview
MC33PF8100A0ESR2 from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed as the primary power solution for i.MX 8QXP and i.MX 8QM application processors. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charging, watchdog monitoring, and ASIL B-compliant safety circuitry. It powers CPU cores, LPDDR4/DDR4 memory, GPU, and peripherals in infotainment and ADAS systems.
For engineers reviewing the MC33PF8100A0ESR2 datasheet, MC33PF8100A0ESR2 pinout, MC33PF8100A0ESR2 application, or MC33PF8100A0ESR2 equivalent, this page delivers verified technical context, exact regulator specifications, validated HVQFN56 pin mapping, real-world automotive use cases, and two confirmed alternative PMICs with documented functional differences.
Technical Context
The MC33PF8100A0ESR2 implements a deterministic state machine for fault-aware power sequencing, supporting programmable startup/shutdown sequences stored in OTP memory. Its seven buck regulators include dual-phase (SW1/SW2), triple-phase (SW1/SW2/SW3), and quad-phase (SW1–SW4) configurations - enabling up to 10 A output on shared rails - while SW6 supports VTT termination for DDR memory.
It features 24-channel analog multiplexing for system diagnostics, independent voltage/thermal monitoring per rail, ABIST self-test capability, and 3.4 MHz I²C interface with CRC protection. Safety functions include programmable fault counters, fail-safe output (FSOB), early warning (EWARN), and watchdog input (WDI) with configurable timeout.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 7 buck converters + 4 LDOs + VSNVS RTC supply = 12 independent regulated outputs |
| Buck Output Range | SW1–SW6: 0.4 V–1.8 V (6.25 mV steps); SW7: 1.0 V–4.1 V - covers core, I/O, memory, and auxiliary rails |
| Max Output Current | 2.5 A per buck; 400 mA per LDO - sufficient for i.MX 8 CPU clusters and LPDDR4 VDDQ/VTT |
| I²C Interface | Up to 3.4 MHz - enables fast dynamic voltage scaling and real-time rail reconfiguration during processor DVFS transitions |
| Package | HVQFN56, 8 mm × 8 mm × 0.85 mm, wettable flanks - optimized for automotive thermal dissipation and solder-joint inspection |
| Safety Compliance | ASIL B monitoring circuitry including independent voltage monitors, thermal shutdown, ABIST, and FSOB fail-safe output |
| OTP Memory | One-time programmable configuration storage - eliminates external resistors for boot voltage/sequence, reducing BOM count by ≥8 components |
Pinout & Package
HVQFN56 package: 8 mm × 8 mm body, 0.5 mm pitch, exposed thermal pad (EPAD), wettable flanks for automated optical inspection. Pin 57 is EPAD, connected to PCB ground plane for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable precise closed-loop regulation; each connects to respective output via resistor divider for 0.4–4.1 V programming |
| SW1IN–SW7IN | Buck input supplies | Accept 2.7–5.5 V input; SW1–SW6 share VIN domain; SW7 may be supplied independently for isolation |
| SW1LX–SW7LX | Switching node outputs | Drive external high-side MOSFETs or integrated power stages; tolerate −3.0 V transient spikes during dead time |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Deliver 1.5–5.0 V at 400 mA; support load switch mode for controlled peripheral power gating |
| VSNVS | RTC supply output | Provides 1.8/3.0/3.3 V at 10 mA from VIN or coin cell (LICELL) - maintains real-time clock during main power loss |
| SCL/SDA | I²C interface | 3.4 MHz high-speed bus for runtime configuration, telemetry readback, and fault logging without interrupting operation |
| FSOB | Fail-safe output | Open-drain signal asserted LOW on critical fault (e.g., thermal runaway, UVLO, register corruption) to trigger system-level safe state |
| PGOOD | Power-good monitor | Open-drain status flag confirming all enabled rails are within ±5 % of target - used for processor reset synchronization |
Key Features
| Feature | Design Value |
|---|---|
| Dual/triple/quad-phase buck configuration | SW1–SW4 can be combined into multi-phase rails delivering up to 10 A with reduced ripple and improved transient response for CPU/GPU cores |
| VTT termination on SW6 | Configurable as DDR memory VTT supply with tracking and current-sinking capability - eliminates need for external VTT regulator |
| 24-channel analog multiplexer | Enables system-level diagnostics by routing internal voltage/temperature monitors to a single ADC input - reduces external sensing components |
| Programmable soft-start & power-down sequence | OTP-configurable timing and order per rail - prevents back-feeding, inrush current, and sequencing violations during boot/shutdown |
| ABIST and CRC-protected registers | On-chip analog built-in self-test verifies monitor accuracy at startup; I²C writes require CRC checksum to prevent accidental register corruption |
| RTC with coin cell charger | Integrated charger supports programmable charge current/voltage for backup battery - sustains VSNVS during vehicle ignition-off periods |
Applications
| Infotainment Head Unit | ADAS Domain Controller |
|---|---|
Use Scenario: Powering i.MX 8QM-based head unit with dual-display graphics, audio DSP, and cellular modem. IC Role / Device Role / Timing Role: Primary PMIC managing CPU core (SW1–SW3), GPU (SW4), LPDDR4 memory (SW5/SW6 VTT), and CAN/FlexRay interfaces (LDOs). Use Value: OTP-stored boot sequence ensures deterministic power-up across temperature; ASIL B monitoring detects rail faults before display freeze or audio dropout. | Use Scenario: Supplying S32V234 vision processor and companion radar SoC in front-camera ECU. IC Role / Device Role / Timing Role: Dual-rail PMIC delivering independent 1.0 V core (SW7) and 0.85 V I/O (SW1) with synchronized PGOOD assertion for lockstep processor startup. Use Value: Multi-phase buck configuration handles 6 A peak GPU current; FSOB output triggers fail-safe camera shutdown on thermal violation. |
| Telematics Control Unit | Central Gateway Module |
Use Scenario: Powering LS1046A-based TCU with LTE/Wi-Fi/BT connectivity and eMMC storage. IC Role / Device Role / Timing Role: Regulating DDR4 memory (SW5/SW6), baseband processor cores (SW1–SW3), and RF front-end LDOs (LDO1–LDO4). Use Value: Spread-spectrum switching reduces EMI near cellular antennas; VSNVS + LICELL maintains GNSS timekeeping during battery disconnect. | Use Scenario: Managing power for S32G-based gateway handling Ethernet AVB, CAN FD, and PCIe switches. IC Role / Device Role / Timing Role: Providing isolated 1.8 V (SW7), 1.0 V (SW1), and 3.3 V (LDO2) rails with independent monitoring for network subsystems. Use Value: 24-channel AMUX enables centralized voltage/temperature telemetry across 8+ domains; I²C CRC prevents misconfiguration during OTA updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DBES | ASIL B certified with full ABIST, FSOB assertion logic, secure I²C, and fail-safe state machine - PF8100 lacks these safety features. | Required for ISO 26262 ASIL B system integration where hardware-level fault containment is mandated. | Select when functional safety certification is mandatory; not drop-in due to OTP and register map differences. |
| MPQ4436-AEC1 | Single 3 A buck converter (no PMIC integration); lacks LDOs, OTP, I²C, safety monitors, or multi-phase capability. | Only suitable as discrete replacement for one buck rail - cannot replace MC33PF8100A0ESR2's full 12-channel functionality. | Use only for incremental rail replacement in non-safety-critical subsystems; requires complete redesign of sequencing and monitoring. |
Compared with MC33PF8100A0ESR2, MC33PF8200DBES adds certified fail-safe behavior and secure register access but requires safety-aware firmware integration, while MPQ4436-AEC1 provides only basic DC-DC conversion - neither offers full pin or functional equivalence, making MC33PF8100A0ESR2 irreplaceable for integrated i.MX 8 power delivery.
Availability
MC33PF8100A0ESR2 is available at Aetrix Electronics and suitable for automotive infotainment, ADAS domain controllers, and telematics control units requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified performance.
Supply support for MC33PF8100A0ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in application processors and power management.
The PF8100 product line was engineered specifically to deliver tightly integrated, safety-aware power sequencing for NXP's i.MX 8 and S32x processor families - minimizing external components while meeting automotive reliability and diagnostic requirements.
FAQ
What is the input voltage range supported by the MC33PF8100A0ESR2?
The MC33PF8100A0ESR2 accepts a main input voltage (VIN) from 2.7 V to 5.5 V. Buck regulator inputs (SWxIN) and LDO inputs (LDOxIN) are rated for −0.3 V to 6.0 V, with absolute maximum limits defined per pin. Operation above 5.5 V is restricted to ≤1800 seconds over device lifetime to ensure reliability.
Does the MC33PF8100A0ESR2 support dynamic voltage scaling (DVS)?
Yes, the MC33PF8100A0ESR2 supports DVS on SW1 through SW6 via its 3.4 MHz I²C interface. Each buck output can be adjusted in 6.25 mV steps across its full range (e.g., SW1–SW6: 0.4 V–1.8 V), enabling real-time adaptation to processor performance states without requiring OTP reprogramming.
How does the MC33PF8100A0ESR2 handle power sequencing for i.MX 8 processors?
The MC33PF8100A0ESR2 stores boot-up and shutdown sequences in OTP memory, ensuring repeatable, glitch-free power delivery to i.MX 8 CPU cores, GPU, memory, and peripherals. Sequencing is managed by an internal state machine that enforces timing, dependencies, and fault recovery - eliminating software dependency for safe startup.
What safety features are implemented in the MC33PF8100A0ESR2?
The MC33PF8100A0ESR2 includes ASIL B-compliant monitoring: independent voltage monitors per rail, thermal shutdown at 150 °C, watchdog timer with WDI input and RESETBMCU output, fail-safe output (FSOB), early warning (EWARN), and analog built-in self-test (ABIST). It lacks PF8200's secure I²C and fail-safe state machine.
Can the MC33PF8100A0ESR2 power LPDDR4 memory directly?
Yes, the MC33PF8100A0ESR2 directly powers LPDDR4 memory: SW5 and SW6 supply VDDQ (1.1 V) and VTT (0.55 V) respectively, with SW6 configurable in VTT termination mode. Its OTP-configured sequencing ensures correct ramp-up order - VDDQ before VTT - matching JEDEC LPDDR4 requirements.
MC33PF8100A0ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8100A0ESR2 FAQ
1.How can I place an order for MC33PF8100A0ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8100A0ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8100A0ESR2 reliable?
The price and inventory of MC33PF8100A0ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8100A0ESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF8100A0ESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8100A0ESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8100A0ESR2?
MC33PF8100A0ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8100A0ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8100A0ESR2?
For technical support, including MC33PF8100A0ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8100A0ESR2 requirements.
6.How does Aetrix verify that MC33PF8100A0ESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF8100A0ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8100A0ESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF8100A0ESR2?
All MC33PF8100A0ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8100A0ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8100A0ESR2 part is unused and in its original packaging.
Return procedure for MC33PF8100A0ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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