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NXP Semiconductors MC33PF8100CCES
- Part No.:
- MC33PF8100CCES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8100CCES.pdf
- Description:
- IC POWER MANAGEMENT I.MX8QXP
- Quantity:
- Payment:
- Shipping:
Inventory:123
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Product details
Overview
MC33PF8100CCES from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed specifically for i.MX8QXP processors with LPDDR4 memory. It integrates seven high-efficiency buck converters (0.4–1.8 V, 2.5 A each), four 400 mA LDOs, RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B-compliant monitoring circuitry. Its OTP-configurable startup sequence powers CPU cores, GPU, DDR I/O, and peripherals in high-performance infotainment systems.
For engineers reviewing the MC33PF8100CCES datasheet, MC33PF8100CCES pinout, MC33PF8100CCES application, or MC33PF8100CCES equivalent, this page delivers verified technical context, exact pin functions, real-world use cases for automotive i.MX8 platforms, and validated alternative parts - all grounded in NXP's PF8100 product data sheet Rev. 13 (March 2026).
Technical Context
The MC33PF8100CCES implements a deterministic state machine for fault-aware power sequencing, supporting programmable soft-start/power-down sequences, dynamic voltage scaling on six buck channels, and triple/quad-phase configurations (e.g., SW1–SW3 up to 7.5 A, SW1–SW4 up to 10 A). Its safety architecture includes independent voltage monitors, thermal shutdown at 150 °C, ABIST, and PGOOD assertion per regulator.
It features a 3.4 MHz I2C interface for runtime configuration, 24-channel analog multiplexer for system diagnostics, and OTP memory storing boot voltage levels, sequencing order, and safety thresholds. The device operates from 2.7–5.5 V input and supports VTT termination on SW6 for DDR memory compliance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 7 buck converters + 4 LDOs + VSNVS RTC supply = 12 regulated outputs for full SoC power tree |
| Buck Output Range | SW1–SW6: 0.4–1.8 V (6.25 mV steps); SW7: 1.0–4.1 V - covers CPU core, GPU, DDR I/O, and auxiliary rails |
| Current Rating | 2.5 A per buck channel; 400 mA per LDO - sufficient for i.MX8QXP CPU clusters and LPDDR4 interface |
| I²C Speed | Up to 3.4 MHz - enables fast runtime reconfiguration of voltage levels and sequencing during DVFS transitions |
| Operating Temp | −40 °C to +105 °C ambient - qualified for automotive cabin and head-unit environments |
| Safety Compliance | ASIL B monitoring circuit (voltage, thermal, watchdog, ABIST) - meets functional safety requirements for infotainment ECUs |
| Package | HVQFN56, 8 mm × 8 mm × 0.85 mm, wettable flanks - supports automated optical inspection and robust thermal dissipation |
Pinout & Package
HVQFN56 package with 0.5 mm pitch, thermally enhanced exposed pad (EPAD), and wettable flanks for solder joint reliability in automotive applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck output voltage feedback | Enables precise closed-loop regulation; supports remote sensing for load-point accuracy |
| SW1IN–SW7IN | Buck input supply | Accepts 2.7–5.5 V main input; each channel independently powered for rail isolation |
| SW1LX–SW7LX | Buck switching node | High-frequency switching output (up to ~2.2 MHz); requires low-inductance layout to limit −3 V transient spikes |
| LDO1OUT–LDO4OUT | LDO regulated outputs | 400 mA, 1.5–5.0 V programmable; support load switch mode for power gating peripherals |
| VSNVS | RTC supply output | 1.8/3.0/3.3 V selectable, 10 mA - powers secure non-volatile memory and real-time clock during deep sleep |
| SCL/SDA | I²C interface | 3.4 MHz high-speed bus for register access, fault logging, and dynamic voltage scaling control |
| PGOOD/INTB/RESETBMCU | System status signals | Open-drain outputs for power-good indication, interrupt reporting, and MCU reset coordination |
| VIN/VDDIO/VDDOTP | Power and configuration inputs | VIN: main 2.7–5.5 V supply; VDDIO: 1.6–3.3 V I/O rail; VDDOTP: OTP programming enable (0–10 V) |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable startup | Eliminates external resistors and sequencing ICs by storing voltage levels, timing, and enable order in one-time programmable memory |
| Dual/triple/quad-phase buck capability | SW1–SW3 can be combined into a 7.5 A triple-phase rail for CPU core; SW1–SW4 into 10 A quad-phase for GPU or DDR VDDQ |
| VTT termination on SW6 | Configurable as DDR VTT supply with ±1% accuracy - directly supports LPDDR4 and DDR3L memory termination requirements |
| 24-channel analog multiplexer | Enables system-level diagnostics by routing internal voltages, temperatures, and reference signals to a single ADC input |
| Coin cell charger with programmable control | Charges backup battery at user-defined current/voltage; maintains VSNVS during main power loss for RTC and SRAM retention |
| ASIL B monitoring subsystem | Dedicated hardware monitors for overvoltage, undervoltage, thermal, and watchdog faults - independent of main state machine for fail-safe response |
Applications
| Automotive Infotainment Head Unit | i.MX8QXP-Based Digital Cluster |
|---|---|
Use Scenario: Central display unit with Android Automotive OS, multi-display video output, and audio processing. IC Role / Device Role / Timing Role: Primary PMIC supplying CPU cores (SW1–SW3), GPU (SW4), DDR4/LPDDR4 memory (SW5–SW6), and I/O rails (LDO1–LDO4). Use Value: OTP-programmed sequencing ensures deterministic boot within <100 ms; ASIL B monitoring protects against rail collapse during CAN bus noise events. |
Use Scenario: Safety-critical instrument cluster with dual-display rendering and HUD integration. IC Role / Device Role / Timing Role: Powers i.MX8QXP application processor and companion microcontroller; provides VSNVS for persistent memory and watchdog supervision. Use Value: Triple-phase SW1–SW3 delivers stable 1.0 V @ 7.5 A to CPU cluster under thermal stress; FSOB pin asserts fail-safe state on critical fault detection. |
| Advanced Driver Assistance System (ADAS) ECU | Industrial HMI with Extended Temp Range |
Use Scenario: Vision-based ADAS controller using i.MX8QXP for camera fusion and neural network inference. IC Role / Device Role / Timing Role: Supplies processor, image signal processors, and LPDDR4 memory; manages power states during sensor wake-up and sleep cycles. Use Value: Dynamic voltage scaling on SW1–SW6 reduces active power by >30% during low-load inference; spread-spectrum mode lowers EMI near radar bands. |
Use Scenario: Factory-floor HMI running Linux with touch interface, Ethernet, and industrial I/O expansion. IC Role / Device Role / Timing Role: Delivers regulated rails to i.MX8QXP, eMMC, SD card, and isolated CAN transceivers across −40 °C to +105 °C ambient. Use Value: Robust thermal design (RθJA = 27 °C/W on 4-layer board) prevents derating at high ambient; wettable flank QFN ensures solder joint integrity in vibration-prone enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8100FJTS | Same PF8100 silicon, dimple wettable flank HVQFN56, recommended for new designs per NXP documentation | Identical i.MX8QXP + LPDDR4 target; same OTP configuration files and register map | Select MC33PF8100FJTS for production designs requiring long-term availability and enhanced manufacturability |
| MC33PF8200DETS | PF8200 variant with ASIL B-certified safety features (ABIST on demand, secure I2C, fail-safe state machine) | Required for ASIL B-compliant systems where functional safety certification is mandatory (e.g., ISO 26262 ASIL B) | Choose MC33PF8200DETS only when full ASIL B qualification is required; not drop-in compatible due to safety register differences |
Compared with MC33PF8100CCES, MC33PF8100FJTS offers identical functionality with improved package reliability, while MC33PF8200DETS adds certified safety mechanisms at the cost of increased design complexity and non-interchangeable OTP configuration.
Availability
MC33PF8100CCES is available at Aetrix Electronics and suitable for automotive infotainment, digital instrument clusters, and ADAS ECUs requiring stable component supply, long-lifecycle support, and AEC-Q100 qualified power management.
Supply support for MC33PF8100CCES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in application processor power management.
The PF8100 product line was engineered to serve as the primary power solution for NXP's i.MX 8 series processors, delivering integrated, OTP-configurable, and safety-aware power delivery for high-performance automotive multimedia systems.
FAQ
What is the input voltage range supported by the MC33PF8100CCES?
The MC33PF8100CCES accepts a main input voltage (VIN) from 2.7 V to 5.5 V, with absolute maximum rating of 6.0 V. Operation above 5.5 V is limited to ≤1800 seconds over the device lifetime to ensure long-term reliability. Each buck converter also accepts its own dedicated input (SWxIN), and LDOs draw from LDO12IN, LDO3IN, or LDO4IN rails - all rated for −0.3 V to 6.0 V.
Does the MC33PF8100CCES support dynamic voltage scaling (DVS)?
Yes, the MC33PF8100CCES supports DVS on SW1 through SW6 buck converters via its high-speed I2C interface (up to 3.4 MHz). Voltage levels can be adjusted in 6.25 mV steps across the 0.4–1.8 V range, enabling real-time adaptation to CPU/GPU load states. This capability is used extensively in i.MX8QXP-based systems to optimize power efficiency during variable workloads.
Is the MC33PF8100CCES pin-compatible with the MC33PF8200 series?
No, the MC33PF8100CCES is not pin-compatible with the MC33PF8200 series. While both share the same HVQFN56 package and core regulator architecture, the PF8200 includes additional safety-related pins (e.g., FSOB assert logic, secure I2C controls) and different OTP register mapping. Hardware redesign and firmware updates are required to migrate from MC33PF8100CCES to any PF8200 variant.
What safety certifications does the MC33PF8100CCES meet?
The MC33PF8100CCES incorporates a monitoring circuit compliant with ASIL B per ISO 26262, including independent voltage/thermal watchdogs, ABIST, and fault-tolerant state machine logic. It is AEC-Q100 qualified (Grade 2, −40 °C to +105 °C), with HBM ESD rating of 2000 V and CDM rating of 500 V. Note: Full ASIL B certification applies only to the PF8200 family.
Can the MC33PF8100CCES power LPDDR4 memory on the i.MX8QXP platform?
Yes, the MC33PF8100CCES is explicitly configured for i.MX8QXP with LPDDR4 memory per NXP's ordering table. SW5 and SW6 supply VDDQ and VTT rails respectively, with SW6 supporting DDR VTT termination mode. The OTP configuration file MC33PF8100CC.zip (referenced in NXP's documentation) contains pre-validated settings for LPDDR4 timing, voltage levels, and sequencing - ensuring reliable memory initialization and operation.
MC33PF8100CCES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8100CCES FAQ
1.How can I place an order for MC33PF8100CCES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8100CCES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8100CCES reliable?
The price and inventory of MC33PF8100CCES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8100CCES is usually 5 days.
3.What payment methods are accepted for MC33PF8100CCES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8100CCES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8100CCES?
MC33PF8100CCES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8100CCES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8100CCES?
For technical support, including MC33PF8100CCES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8100CCES requirements.
6.How does Aetrix verify that MC33PF8100CCES is sourced from the original manufacturer or authorized distributors?
All MC33PF8100CCES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8100CCES meets industry standards.
7.What is the process for return or replacement of MC33PF8100CCES?
All MC33PF8100CCES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8100CCES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8100CCES part is unused and in its original packaging.
Return procedure for MC33PF8100CCES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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