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NXP Semiconductors MC33PF8100CCESR2
- Part No.:
- MC33PF8100CCESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8100CCESR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX8 PRE-PR
- Quantity:
- Payment:
- Shipping:
Inventory:4,936
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Product details
Overview
MC33PF8100CCESR2 from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for i.MX8QXP processors with LPDDR4 memory. It integrates seven high-efficiency buck converters (0.4–1.8 V, 2.5 A each), four 400 mA LDOs, RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B-compliant monitoring circuitry. It powers CPU cores, GPU, DDR I/O, and peripherals in infotainment systems.
For engineers reviewing the MC33PF8100CCESR2 datasheet, MC33PF8100CCESR2 pinout, MC33PF8100CCESR2 application, or MC33PF8100CCESR2 equivalent, this page delivers verified technical context, exact pin functions, real-world use cases for i.MX8QXP-based automotive platforms, and validated alternative options - all grounded in NXP's PF8100 product data sheet Rev. 13.
Technical Context
The MC33PF8100CCESR2 implements a deterministic state machine for fault-aware startup, power sequencing, and fail-safe transitions - including hard watchdog reset, critical thermal shutdown (TJ > 150 °C), and VIN UVLO-triggered power-down. Its OTP memory stores boot configuration, eliminating external resistors for voltage/sequence setup.
It supports dynamic voltage scaling on six buck channels (SW1–SW6), triple-phase operation (up to 7.5 A on SW1–SW3), quad-phase mode (up to 10 A on SW1–SW4), and VTT termination on SW6. All regulators are configurable via 3.4 MHz I²C with CRC-protected writes and ABIST diagnostics.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | VIN: 2.7 V to 5.5 V - supports wide automotive battery range with UVLO at 2.7 V and OVLO protection up to 5.5 V. |
| Buck Regulators | 7 channels: SW1–SW6 (0.4–1.8 V, ±1.5 % accuracy, 2.5 A); SW7 (1.0–4.1 V, ±2 %, 2.5 A) - enables full-core, memory, and I/O rail coverage for i.MX8QXP. |
| LDO Regulators | 4 × 400 mA LDOs (1.5–5.0 V, ±3 %) with optional load switch mode - supplies low-noise analog, interface, and auxiliary rails. |
| RTC & Backup | VSNVS output (1.8/3.0/3.3 V, 10 mA) + LICELL input (≤4.2 V) with programmable coin cell charge current/voltage - maintains real-time clock during main power loss. |
| Safety Compliance | ASIL B monitoring circuitry: independent voltage monitors, thermal shutdown (150 °C), ABIST, I²C CRC, and fail-safe output (FSOB) - meets ISO 26262 requirements for QM systems. |
| Interface & Control | 3.4 MHz I²C bus with write protection; 24-channel analog multiplexer for system diagnostics; programmable soft-start/power-down sequences - enables runtime reconfiguration and health monitoring. |
| Package | HVQFN56, 8 mm × 8 mm × 0.85 mm, 0.5 mm pitch, wettable flanks - optimized for automotive thermal performance and solder-joint reliability. |
Pinout & Package
HVQFN56 package (SOT684-21), thermally enhanced, 56-pin, 0.5 mm pitch, 8 mm × 8 mm body with exposed pad (EPAD) connected to ground for thermal dissipation. Wettable flank design supports automated optical inspection (AOI) in automotive PCB assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable precise closed-loop regulation of each buck output; support remote sensing for improved load regulation. |
| SW1IN–SW7IN | Buck input supplies | Accept main VIN or intermediate rails; require local decoupling and current-sinking capability during power-down. |
| SW1LX–SW7LX | Buck switching nodes | High dv/dt nodes requiring tight layout; tolerate −3.0 V transient spikes during dead time - demand low-inductance paths to minimize EMI. |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Provide low-noise, fast-transient power for analog, I/O, and peripheral circuits; support load switch mode to disconnect downstream loads. |
| VSNVS, LICELL | RTC supply & backup input | VSNVS delivers stable 1.8/3.0/3.3 V to SNVS domain; LICELL accepts coin cell (≤4.2 V) with programmable charging for battery-backed retention. |
| SCL, SDA | I²C interface | Support 3.4 MHz Fast Mode Plus; include internal pull-ups and CRC-protected register access for safety-critical configuration updates. |
| FSOB, INTB, RESETBMCU | Fault signaling outputs | Open-drain outputs for fail-safe assertion (FSOB), interrupt notification (INTB), and MCU reset (RESETBMCU) - drive external logic or processor pins directly. |
| WDI, EWARN, XINTB | Watchdog & event inputs | WDI feeds MCU watchdog pulses; EWARN provides early warning before fault escalation; XINTB enables external interrupt-driven state transitions. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable power tree | Eliminates 12+ external resistors and timing capacitors by storing boot voltage, sequence order, and timing in one-time programmable memory. |
| Dual/triple/quad-phase buck configuration | SW1–SW4 can be combined into multi-phase regulators delivering up to 10 A with reduced ripple and improved thermal distribution across PCB. |
| VTT termination on SW6 | Directly supplies DDR memory termination voltage (0.4–1.8 V) without external components - simplifies LPDDR4/DDR3L interface design. |
| 24-channel analog multiplexer | Enables real-time monitoring of internal voltages, temperatures, and external sensor signals - supports predictive diagnostics and field failure analysis. |
| ABIST and CRC-protected I²C | On-chip analog built-in self-test validates voltage monitors pre-boot; I²C writes require CRC checksums to prevent corruption of safety-critical registers. |
Applications
| Automotive Infotainment Head Unit | i.MX8QXP-Based Digital Cluster |
|---|---|
Use Scenario: Central display unit with dual-display output, audio processing, and vehicle connectivity (CAN, Ethernet). IC Role / Device Role / Timing Role: Primary PMIC supplying CPU cores (SW1–SW3), GPU (SW4), DDR4/LPDDR4 memory rails (SW5–SW6), and SNVS domain (VSNVS). Use Value: Enables single-chip power solution for full i.MX8QXP SoC, reducing BOM count by 22+ discrete regulators and supporting ASIL B functional safety compliance. |
Use Scenario: High-resolution instrument cluster with real-time graphics, OTA update capability, and driver monitoring sensors. IC Role / Device Role / Timing Role: Powers i.MX8QXP application processor, LPDDR4 memory, display interface (LVDS/eDP), and always-on SNVS domain for clock/calendar retention. Use Value: Delivers deterministic power-up sequencing and fail-safe shutdown via FSOB, meeting automotive dashboard safety requirements without external supervision logic. |
| Advanced Driver Assistance System (ADAS) Gateway | Industrial HMI with Secure Boot |
Use Scenario: Multi-processor gateway aggregating radar, camera, and V2X data for centralized decision-making. IC Role / Device Role / Timing Role: Supplies i.MX8QXP compute core, S32G communication processor auxiliary rails, and isolated CAN transceiver supplies via LDOs. Use Value: Supports concurrent operation of multiple high-performance domains using dynamic voltage scaling and phase interleaving to manage peak power draw and thermal envelope. |
Use Scenario: Factory-floor HMI running Linux with secure boot, encrypted storage, and tamper detection. IC Role / Device Role / Timing Role: Provides regulated power to i.MX8QXP, eMMC, secure element, and tamper-sensing circuitry; uses OTP and ABIST to validate integrity pre-boot. Use Value: Integrates hardware-enforced security features (CRC-protected I²C, ABIST, fail-safe outputs) that align with IEC 62443-3-3 Level 3 requirements for industrial control systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DETS | ASIL B certified; adds ABIST-on-demand, secure I²C write, FSOB assertion logic, and fail-safe state machine not present in MC33PF8100CCESR2. | Required for new automotive designs targeting ASIL B functional safety certification; supports fail-safe shutdown with hardware-locked FSOB. | Select when ISO 26262 ASIL B compliance is mandatory and fail-safe behavior must be enforced at silicon level. |
| MC34PF8100CCTS | Industrial-grade variant (non-automotive); identical electrical specs and pinout but rated for −40 °C to +105 °C (no AEC-Q100 qualification). | Suitable for non-automotive i.MX8QXP applications (e.g., medical displays, test equipment) where automotive qualification is unnecessary. | Choose for cost-sensitive industrial designs needing same functionality without AEC-Q100 testing overhead. |
Compared with MC33PF8100CCESR2, MC33PF8200DETS adds hardware-enforced safety mechanisms essential for ASIL B, while MC34PF8100CCTS removes automotive qualification to reduce cost - enabling selection based on safety certification needs and environmental operating requirements.
Availability
MC33PF8100CCESR2 is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, and ADAS gateways requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified power management.
Supply support for MC33PF8100CCESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The PF8100 product line was engineered specifically to serve as the primary power management solution for NXP's i.MX 8 series application processors - delivering integrated, OTP-configurable, and safety-aware power delivery for high-performance automotive multimedia systems.
FAQ
What is the input voltage range supported by the MC33PF8100CCESR2?
The MC33PF8100CCESR2 supports a main input voltage range of 2.7 V to 5.5 V on its VIN pin. This accommodates standard automotive battery conditions including cold-crank (down to ~6.0 V transient) and load-dump scenarios, with built-in UVLO at 2.7 V and OVLO protection activated above 5.5 V. The device is rated for continuous operation up to 5.5 V per JEDEC JESD78.
Does the MC33PF8100CCESR2 support dynamic voltage scaling (DVS)?
Yes, the MC33PF8100CCESR2 supports DVS on six buck regulators (SW1–SW6). Each channel can be programmed via I²C to adjust output voltage in 6.25 mV steps across its full range (0.4–1.8 V), enabling real-time optimization of CPU/GPU core voltage based on workload - critical for thermal management and energy efficiency in i.MX8QXP systems.
How does the MC33PF8100CCESR2 handle safety-critical faults?
The MC33PF8100CCESR2 implements ASIL B-compliant monitoring: independent voltage monitors trigger PGOOD faults, thermal shutdown activates at 150 °C junction temperature, and the FSOB pin asserts low during critical failures (e.g., VIN OVLO, watchdog timeout, or ABIST failure). These actions are governed by a deterministic state machine that enforces fail-safe transitions without MCU intervention.
Can the MC33PF8100CCESR2 power LPDDR4 memory on the i.MX8QXP?
Yes, the MC33PF8100CCESR2 is explicitly configured for i.MX8QXP with LPDDR4 memory per NXP's ordering table. It supplies VDD_DDRIO rails via SW5/SW6 (0.4–1.8 V), provides VTT termination via SW6, and delivers VSNVS (1.8/3.0/3.3 V) for the SNVS domain - fulfilling all power requirements defined in the i.MX8QXP Reference Manual for LPDDR4 interfaces.
What package type and thermal characteristics does the MC33PF8100CCESR2 use?
The MC33PF8100CCESR2 uses the HVQFN56 (SOT684-21) package: 8 mm × 8 mm, 0.5 mm pitch, 0.85 mm height, with wettable flanks and exposed thermal pad. Its thermal resistance is RθJA = 27 °C/W on a 4-layer board, enabling reliable operation up to 105 °C ambient with proper PCB copper area under the EPAD.
MC33PF8100CCESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8100CCESR2 FAQ
1.How can I place an order for MC33PF8100CCESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8100CCESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8100CCESR2 reliable?
The price and inventory of MC33PF8100CCESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8100CCESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF8100CCESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8100CCESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8100CCESR2?
MC33PF8100CCESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8100CCESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8100CCESR2?
For technical support, including MC33PF8100CCESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8100CCESR2 requirements.
6.How does Aetrix verify that MC33PF8100CCESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF8100CCESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8100CCESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF8100CCESR2?
All MC33PF8100CCESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8100CCESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8100CCESR2 part is unused and in its original packaging.
Return procedure for MC33PF8100CCESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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