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NXP Semiconductors MC33PF8100CFES
- Part No.:
- MC33PF8100CFES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8100CFES.pdf
- Description:
- IC POWER MANAGEMENT I.MX8QXP
- Quantity:
- Payment:
- Shipping:
Inventory:1,214
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Product details
Overview
MC33PF8100CFES from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for i.MX8QXP processors with DDR3L memory. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B-compliant monitoring circuitry. It operates from 2.7 V to 5.5 V input and supports dynamic voltage scaling for CPU/GPU/memory rails in infotainment systems.
For engineers reviewing the MC33PF8100CFES datasheet, MC33PF8100CFES pinout, MC33PF8100CFES application, or MC33PF8100CFES equivalent, this page delivers verified technical context, validated pin functions, confirmed automotive safety features, and real-world use cases aligned with i.MX8QXP + DDR3L platform requirements - all derived from NXP's official PF8100/PF8200 product data sheet Rev. 13.
Technical Context
The MC33PF8100CFES implements a deterministic state machine for fault-aware power sequencing, with OTP-programmed startup configuration and runtime I²C reconfiguration at up to 3.4 MHz. Its seven buck regulators support multi-phase configurations (dual/triple/quad phase) and VTT termination on SW6, while LDOs offer load-switch capability and hardware/software-selectable enable control.
It includes 24-channel analog multiplexer for system diagnostics, independent voltage monitors per rail, thermal shutdown at 150 °C, and fail-safe output (FSOB) triggered by critical faults. The device meets AEC-Q100 with HBM ±2 kV ESD rating and operates across −40 °C to +105 °C ambient temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7 V to 5.5 V - supports wide automotive battery range including cold-crank transients |
| Buck Regulators | 7 channels (SW1–SW7); SW1–SW6: 0.4–1.8 V @ 2.5 A; SW7: 1.0–4.1 V @ 2.5 A - powers CPU cores, GPU, memory I/O, and peripherals |
| LDO Regulators | 4 channels (LDO1–LDO4): 1.5–5.0 V @ 400 mA each - supplies low-noise analog/IO rails and enables load-switch mode for power gating |
| RTC & Backup Supply | VSNVS output: 1.8 V / 3.0 V / 3.3 V @ 10 mA; LICELL input: up to 4.2 V - maintains real-time clock and SRAM during main power loss |
| I²C Interface | Up to 3.4 MHz - enables fast register access for dynamic voltage scaling and runtime fault response |
| Safety Compliance | ASIL B monitoring circuit (voltage, thermal, watchdog, ABIST) - supports functional safety requirements for automotive infotainment |
| Package | HVQFN56, 8 mm × 8 mm × 0.85 mm, 0.5 mm pitch - thermally enhanced wettable flank package for automotive PCB assembly and thermal reliability |
Pinout & Package
HVQFN56, plastic thermally enhanced very thin quad flat package, 56 terminals, 0.5 mm pitch, 8 mm × 8 mm × 0.85 mm body (SOT684-21), with exposed pad (EPAD) connected to ground for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck output voltage feedback | Enables precise closed-loop regulation of each buck output; supports ±1.5 % accuracy for SW1–SW6 |
| SW1IN–SW7IN | Buck input supply | Accepts 2.7–5.5 V input; SW1–SW6 share VIN domain; SW7 may be independently supplied |
| SW1LX–SW7LX | Buck switching node | High-frequency switching output (up to ~2.2 MHz); requires low-inductance layout to limit −3 V transient spikes |
| LDO1OUT–LDO4OUT | LDO regulated output | Delivers stable 1.5–5.0 V outputs with 3 % accuracy; configurable as load switch for zero-quiescent current off-state |
| VSNVS | RTC supply output | Programmable 1.8/3.0/3.3 V rail for always-on domain; powered from VIN or coin cell via LICELL pin |
| SCL/SDA | I²C interface | High-speed (3.4 MHz) bidirectional communication for configuration, monitoring, and DVS control |
| FSOB | Fail-safe output | Open-drain signal asserted LOW during critical faults (thermal, UV/OV, watchdog timeout) to trigger system-level safe state |
| RESETBMCU | MCU reset output | Open-drain active-low reset signal synchronized to PMIC power-up sequence and fault conditions |
Key Features
| Feature | Design Value |
|---|---|
| OTP-based startup configuration | Eliminates external resistor networks for voltage setpoints and power-up sequencing - reduces BOM count and improves repeatability |
| Dual/triple/quad-phase buck capability | SW1–SW4 can be combined to deliver up to 10 A (quad-phase) for high-current CPU/GPU cores - improves efficiency and thermal distribution |
| VTT termination on SW6 | Supports DDR3L memory termination with programmable VTT voltage and current limit - eliminates need for discrete termination IC |
| 24-channel analog multiplexer | Enables system-level diagnostics by routing internal voltage/temperature monitors to a single ADC input - simplifies board-level monitoring |
| ASIL B functional safety architecture | Includes independent voltage monitors, ABIST, CRC-protected registers, and fail-safe output (FSOB) - meets ISO 26262 requirements for automotive infotainment |
| Coin cell charger with programmable control | Charges backup battery at user-defined voltage (2.5–4.2 V) and current (0–100 µA) - extends RTC hold-up time without external charging circuitry |
Applications
| Automotive Infotainment Head Unit | i.MX8QXP-Based Digital Cluster |
|---|---|
Use Scenario: Centralized multimedia system with navigation, voice recognition, and video playback in passenger vehicles. IC Role / Device Role / Timing Role: Primary PMIC supplying CPU cores (SW1–SW3), GPU (SW4), DDR3L memory (SW6 VTT + LDOs), and RTC (VSNVS). Use Value: OTP-configured power tree ensures deterministic boot timing; ASIL B monitoring protects against undervoltage/fault-induced display corruption. |
Use Scenario: Real-time instrument cluster with dual-display rendering and CAN/FlexRay connectivity. IC Role / Device Role / Timing Role: Powers i.MX8QXP application processor, LPDDR4-compatible I/O rails (via LDOs), and safety-critical SNVS domain (VSNVS). Use Value: FSOB-driven fail-safe state halts display updates during thermal overload; 24-channel AMUX enables concurrent rail health monitoring. |
| Advanced Driver Assistance System (ADAS) Gateway | Industrial HMI with Extended Temperature Range |
Use Scenario: Vehicle-to-everything (V2X) gateway aggregating radar, camera, and telematics data. IC Role / Device Role / Timing Role: Delivers tightly regulated 1.0 V core (SW7), 1.8 V I/O (SW2/SW4), and 3.3 V peripherals (LDO2/LDO3) under dynamic load. Use Value: Dynamic voltage scaling on SW1–SW6 reduces power during low-activity states; spread-spectrum switching minimizes EMI in RF-sensitive environments. |
Use Scenario: Factory-floor human-machine interface with fanless enclosure and −40 °C to +105 °C operation. IC Role / Device Role / Timing Role: Supplies i.MX8QXP SoC and DDR3L memory while maintaining RTC via coin cell during mains failure. Use Value: Thermal shutdown at 150 °C junction and RθJB = 11 °C/W ensure reliability in sealed enclosures; wettable flank QFN aids automated optical inspection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DFES | ASIL B safety certification (vs. QM for MC33PF8100CFES); adds ABIST-on-demand, secure I²C write, and fail-safe state transitions | Required for ASIL B–compliant ADAS modules where fault containment must exceed QM level | Select when functional safety certification beyond QM is mandated; not drop-in due to OTP and safety register differences |
| MC34PF8100CFEP | Industrial-grade variant (−40 °C to +105 °C); identical regulator topology and pinout but lacks automotive qualification (AEC-Q100) and wettable flank | Suitable for non-automotive embedded systems using i.MX8QXP + DDR3L where automotive qualification is unnecessary | Choose for cost-sensitive industrial designs; verify thermal performance without wettable flank and confirm AEC-Q100 exemption |
Compared with MC33PF8100CFES, MC33PF8200DFES adds certified ASIL B functionality at the cost of increased design complexity and OTP incompatibility, while MC34PF8100CFEP offers identical power architecture without automotive qualification - enabling trade-offs between safety compliance, qualification scope, and supply chain assurance.
Availability
MC33PF8100CFES is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, and ADAS gateways requiring stable component supply, AEC-Q100 qualification, and i.MX8QXP + DDR3L platform support.
Supply support for MC33PF8100CFES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based application processors and power management.
The PF8100 series is part of NXP's automotive PMIC portfolio, engineered specifically to deliver integrated, safety-aware power solutions for i.MX 8 and S32x processor platforms - reducing system complexity and accelerating time-to-market for high-performance automotive electronics.
FAQ
What is the primary processor compatibility for the MC33PF8100CFES?
The MC33PF8100CFES is explicitly designed for the NXP i.MX8QXP application processor with DDR3L memory configuration, as confirmed in Table 2 of the official datasheet. It supports optimized power sequencing, dynamic voltage scaling, and VTT termination required by this platform - unlike generic PMICs, its OTP configuration and regulator capabilities are tuned for i.MX8QXP's power architecture.
Does the MC33PF8100CFES support functional safety standards?
The MC33PF8100CFES is qualified to QM (Quality Management) level per ISO 26262 and includes ASIL B-compliant monitoring circuitry - including independent voltage/thermal monitors, watchdog timer, and ABIST - but does not implement full ASIL B fault handling like the PF8200 family. Its safety features provide robust monitoring while relying on system-level arbitration for fail-safe actions.
What package type and thermal characteristics does the MC33PF8100CFES use?
The MC33PF8100CFES uses the HVQFN56 package (SOT684-21) with 8 mm × 8 mm footprint, 0.5 mm pitch, and 0.85 mm height. Its thermal resistance is RθJA = 27 °C/W on a 4-layer board and RθJB = 11 °C/W, enabling reliable operation up to +105 °C ambient with proper PCB copper pour and EPAD grounding - critical for automotive under-hood and dashboard environments.
How does the OTP memory in the MC33PF8100CFES reduce external components?
The OTP memory in the MC33PF8100CFES stores startup voltage setpoints, power-up/down sequencing order, and default protection thresholds - eliminating the need for external resistive dividers, timing capacitors, or configuration EEPROMs. This reduces BOM count, improves boot repeatability, and avoids layout sensitivity associated with analog configuration networks.
Can the MC33PF8100CFES support DDR3L memory termination?
Yes - the MC33PF8100CFES supports DDR3L termination via SW6 configured in VTT mode, delivering programmable VTT voltage and current to match DDR3L specifications. This capability is explicitly documented in Section 12.3 and Figure 4 of the datasheet, removing the need for a separate DDR termination IC in i.MX8QXP + DDR3L designs.
MC33PF8100CFES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8100CFES FAQ
1.How can I place an order for MC33PF8100CFES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8100CFES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8100CFES reliable?
The price and inventory of MC33PF8100CFES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8100CFES is usually 5 days.
3.What payment methods are accepted for MC33PF8100CFES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8100CFES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8100CFES?
MC33PF8100CFES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8100CFES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8100CFES?
For technical support, including MC33PF8100CFES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8100CFES requirements.
6.How does Aetrix verify that MC33PF8100CFES is sourced from the original manufacturer or authorized distributors?
All MC33PF8100CFES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8100CFES meets industry standards.
7.What is the process for return or replacement of MC33PF8100CFES?
All MC33PF8100CFES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8100CFES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8100CFES part is unused and in its original packaging.
Return procedure for MC33PF8100CFES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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