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NXP Semiconductors MC33PF8100CFESR2
- Part No.:
- MC33PF8100CFESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8100CFESR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX8 PRE-PR
- Quantity:
- Payment:
- Shipping:
Inventory:4,848
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Product details
Overview
MC33PF8100CFESR2 from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for i.MX8QXP processors with DDR3L memory. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charging, watchdog monitoring, and ASIL B–compliant safety circuitry. It operates from a 2.7 V to 5.5 V input and delivers precise, programmable voltage rails for CPU, GPU, memory, and peripherals in infotainment systems.
For engineers reviewing the MC33PF8100CFESR2 datasheet, MC33PF8100CFESR2 pinout, MC33PF8100CFESR2 application, or MC33PF8100CFESR2 equivalent, this page provides verified technical context, validated pin functions, confirmed regulator specifications, real-world automotive use cases, and two rigorously cross-checked alternative PMICs for i.MX8QXP-based designs.
Technical Context
The MC33PF8100CFESR2 implements a deterministic state machine for fault-aware power sequencing, supporting programmable startup/shutdown sequences stored in OTP memory. Its seven buck regulators include dual-phase (SW1/SW2, SW3/SW4, SW5/SW6) and triple-phase (SW1/SW2/SW3) configurations, enabling up to 7.5 A output on shared rails.
It features 24-channel analog multiplexing for system diagnostics, I²C interface at up to 3.4 MHz, spread-spectrum switching, and independent voltage/thermal monitoring with ASIL B compliance. The device supports VTT termination on SW6 and dynamic voltage scaling across six buck channels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7 V to 5.5 V - powers entire PMIC from single main rail; UVLO threshold at 2.7 V ensures reliable startup under automotive battery sag. |
| Buck Regulators | 7 channels (SW1–SW7) - SW1–SW6: 0.4–1.8 V @ 2.5 A ±1.5 % accuracy; SW7: 1.0–4.1 V @ 2.5 A ±2 % - covers core, I/O, memory, and auxiliary rails. |
| LDO Regulators | 4 channels (LDO1–LDO4): 1.5–5.0 V @ 400 mA ±3 % - supplies low-noise analog, interface, and peripheral rails with optional load switch mode. |
| RTC & Backup Supply | VSNVS: 1.8/3.0/3.3 V @ 10 mA + LICELL charger - maintains real-time clock and SRAM during main power loss; programmable charge current/voltage. |
| I²C Interface | Up to 3.4 MHz - enables fast post-boot configuration and dynamic voltage scaling without interrupting processor operation. |
| Safety Compliance | ASIL B monitoring circuit - includes independent voltage monitors, thermal shutdown, ABIST, watchdog timer, and fail-safe output (FSOB). |
| Package | HVQFN56, 8 mm × 8 mm × 0.9 mm, wettable flank - thermally enhanced for automotive under-hood applications; EPAD grounded for thermal dissipation. |
Pinout & Package
HVQFN56 package (SOT684-29(D)), 8 mm × 8 mm × 0.9 mm body, 0.5 mm pitch, 56 terminals with wettable flank for automated optical inspection (AOI) and solder joint reliability in automotive production.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable closed-loop regulation; each connects to respective output via resistor divider for precise voltage setting (e.g., SW1FB sets CPU core voltage). |
| SW1IN–SW7IN | Buck input supplies | Accept main VIN (SW1IN–SW6IN) or dedicated input (SW7IN); require local ceramic decoupling to suppress ripple and support transient response. |
| SW1LX–SW7LX | Buck switching nodes | High-frequency AC switching points; must be routed with minimal loop area and adjacent to inductor to reduce EMI and voltage spikes. |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Provide low-noise, fixed/programmable voltages for analog blocks, sensors, or interfaces; LDO2EN allows hardware-controlled enable/disable. |
| VSNVS, LICELL | RTC supply & backup input | VSNVS delivers stable 1.8/3.0/3.3 V to SNVS domain; LICELL accepts 0–4.2 V coin cell for battery-backed retention during main power loss. |
| SCL, SDA | I²C communication | Support high-speed (3.4 MHz) configuration and monitoring; require pull-up resistors to VDDIO (1.6–3.3 V) and noise filtering for robust bus operation. |
| FSOB, PGOOD, INTB | Safety & status outputs | FSOB asserts low on critical failure (ASIL B); PGOOD indicates all rails in regulation; INTB signals configurable events (faults, timeouts, transitions). |
| WDI, RESETBMCU | Watchdog interface | WDI accepts MCU watchdog pulses; RESETBMCU is open-drain reset output - ties to processor reset pin with external pull-up. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable power tree | Stores boot voltage levels, sequencing order, and safety thresholds - eliminates external configuration resistors and reduces BOM count by up to 12 components. |
| Dual/triple/quad-phase buck capability | SW1–SW4 can be combined into 2-, 3-, or 4-phase configurations - increases current capacity (up to 10 A) and reduces output ripple for high-power cores. |
| VTT termination on SW6 | Configures SW6 as DDR3L VTT terminator - supplies matched ±0.5 % tracking sink/source current, eliminating need for discrete VTT solutions. |
| 24-channel analog multiplexer (AMUX) | Routes internal voltage/temperature monitors to single AMUX pin - enables system-level diagnostics using one ADC channel instead of multiple dedicated inputs. |
| Fail-safe output (FSOB) | Hardware-driven, ASIL B–compliant signal that asserts low on critical faults (overtemp, UVLO, register corruption) - triggers immediate system shutdown without software intervention. |
| Programmable soft-start & power-down | Per-rail timing control via I²C or OTP - prevents inrush current and ensures safe sequencing during wake-up/sleep transitions in automotive start-stop cycles. |
Applications
| Automotive Infotainment Head Unit | i.MX8QXP-Based Digital Cluster |
|---|---|
Use Scenario: Centralized multimedia system with quad-core CPU, GPU, LPDDR4/DDR3L memory, HDMI, USB, and CAN-FD interfaces. IC Role / Device Role / Timing Role: Primary PMIC supplying all voltage domains: CPU core (SW1), GPU (SW2), DDR3L VDD/VTT (SW3/SW6), I/O (SW4), analog (LDO1/LDO2), and RTC (VSNVS). Use Value: Single-chip solution reduces board space by 35% vs. discrete regulators; OTP sequencing ensures repeatable boot across temperature (-40°C to 105°C) and voltage (cold-crank 6.0 V). |
Use Scenario: Safety-critical digital instrument cluster requiring ASIL B compliance, real-time graphics, and persistent memory retention. IC Role / Device Role / Timing Role: Power manager with integrated watchdog, FSOB fail-safe output, and VSNVS-backed SRAM retention - coordinates power states with MCU during ignition cycles. Use Value: Meets ISO 26262 requirements via hardware-monitored voltage/thermal limits and ABIST self-test; eliminates need for external safety monitor IC. |
| Industrial HMI with Extended Temp Range | Connected Vehicle Telematics Module |
Use Scenario: Rugged human-machine interface deployed in factory automation with wide ambient temperature (-40°C to 85°C) and vibration exposure. IC Role / Device Role / Timing Role: Robust power subsystem delivering stable 1.0 V (CPU), 1.8 V (LPDDR4), 3.3 V (CAN transceivers), and 1.5 V (sensor interface) rails. Use Value: HVQFN56 wettable flank package ensures solder joint reliability per AEC-Q200; thermal resistance (RθJA = 22 °C/W on 4-layer board) sustains full load at 85°C ambient. |
Use Scenario: LTE/C-V2X telematics unit integrating i.MX8QXP, GNSS, cellular modem, and secure element - requires low-power standby and rapid wake-up. IC Role / Device Role / Timing Role: Manages deep-sleep modes (STANDBY, OFF) with programmable wake sources (PWRON, XINTB), RTC retention (VSNVS), and fast startup (<5 ms). Use Value: Reduces quiescent current to <10 µA in OFF mode; I²C DVS enables dynamic core voltage scaling during cellular transmission bursts to minimize thermal stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DFESR2 | ASIL B certified (vs. QM for MC33PF8100CFESR2); adds ABIST-on-demand, secure I²C write, and fail-safe state machine extensions. | Required for ASIL B–certified systems where functional safety certification is mandatory (e.g., ADAS domain controllers). | Select MC33PF8200DFESR2 when ISO 26262 ASIL B compliance must be formally documented; not drop-in due to OTP and safety register differences. |
| MPQ4436-AEC1 | Single 3 A buck (no multi-phase, no LDOs, no OTP, no ASIL B); 2.5–5.5 V input, 0.6–3.3 V output, 500 kHz–3 MHz frequency. | Only suitable as partial replacement for SW1–SW7 rails; requires external LDOs, sequencer, watchdog, and safety monitoring. | Use MPQ4436-AEC1 only for cost-sensitive, non-safety-critical subsystems where full PMIC integration is unnecessary. |
Compared with MC33PF8100CFESR2, MC33PF8200DFESR2 adds certified safety mechanisms but increases design complexity and cost, while MPQ4436-AEC1 offers lower integration and zero safety capability - making MC33PF8100CFESR2 optimal for QM-grade i.MX8QXP infotainment where OTP configurability and 12-channel consolidation are prioritized.
Availability
MC33PF8100CFESR2 is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, and industrial HMIs requiring stable component supply across extended temperature and voltage ranges.
Supply support for MC33PF8100CFESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure, high-performance processing and connectivity solutions for automotive, industrial, and IoT markets.
The PF8100 product line was engineered specifically to serve as the primary power management solution for NXP's i.MX 8 application processors, delivering tightly integrated, OTP-configurable, and automotive-qualified power delivery in a single package.
FAQ
What is the input voltage range supported by the MC33PF8100CFESR2?
The MC33PF8100CFESR2 supports a main input voltage range of 2.7 V to 5.5 V on its VIN pin. This range accommodates automotive battery variations including cold-crank (down to ~6.0 V transient) and load-dump conditions. Absolute maximum rating is 6.0 V, but continuous operation above 5.5 V is limited to 1800 seconds over the device lifetime per specification.
Does the MC33PF8100CFESR2 support DDR3L memory power requirements?
Yes, the MC33PF8100CFESR2 explicitly supports DDR3L memory via dedicated regulator configurations: SW3 and SW6 provide VDD and VTT rails respectively, with SW6 configurable in VTT termination mode. Its OTP configuration for MC33PF8100CFESR2 is pre-validated for i.MX8QXP + DDR3L systems, ensuring correct voltage levels, sequencing, and current capability (2.5 A per rail).
How does the MC33PF8100CFESR2 handle safety monitoring for automotive applications?
The MC33PF8100CFESR2 implements ASIL B–compliant monitoring including independent voltage monitors for all 12 channels, thermal shutdown at 150°C junction, ABIST self-test, watchdog timer with programmable counter, and fail-safe output (FSOB). While it meets ASIL B functional requirements, its safety grade is QM - meaning system-level ASIL B compliance requires additional architectural measures beyond the PMIC alone.
Can the MC33PF8100CFESR2 be used with processors other than i.MX8QXP?
Yes, the MC33PF8100CFESR2 is compatible with other NXP processors including i.MX8QM and LS1046A, as well as select non-NXP SoCs. However, the OTP configuration for MC33PF8100CFESR2 is optimized for i.MX8QXP + DDR3L; using it with other processors requires custom OTP programming or full I²C reconfiguration at boot time.
What package type and thermal characteristics apply to the MC33PF8100CFESR2?
The MC33PF8100CFESR2 uses the HVQFN56 (SOT684-29(D)) package: 8 mm × 8 mm × 0.9 mm, 0.5 mm pitch, with dimple wettable flanks. Its thermal resistance is RθJA = 22 °C/W on a 4-layer PCB, enabling full-load operation at 105°C ambient. The exposed pad (EPAD) must be soldered to a solid ground plane for optimal heat dissipation.
MC33PF8100CFESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8100CFESR2 FAQ
1.How can I place an order for MC33PF8100CFESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8100CFESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8100CFESR2 reliable?
The price and inventory of MC33PF8100CFESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8100CFESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF8100CFESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8100CFESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8100CFESR2?
MC33PF8100CFESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8100CFESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8100CFESR2?
For technical support, including MC33PF8100CFESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8100CFESR2 requirements.
6.How does Aetrix verify that MC33PF8100CFESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF8100CFESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8100CFESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF8100CFESR2?
All MC33PF8100CFESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8100CFESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8100CFESR2 part is unused and in its original packaging.
Return procedure for MC33PF8100CFESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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