My Inquiry
My Account
NXP Semiconductors MC33PF8100CGES
- Part No.:
- MC33PF8100CGES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8100CGES.pdf
- Description:
- IC POWER MANAGEMENT I.MX8QM
- Quantity:
- Payment:
- Shipping:
Inventory:3,498
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC33PF8100CGES from NXP Semiconductors (formerly Freescale) is a 12-channel, 7.3 A programmable system power management IC optimized for i.MX 7 and i.MX 6 application processors. It delivers fully configurable output voltages (0.5 V to 3.3 V), sequencing, and timing control with integrated watchdog, reset generation, and fault reporting via SPI interface. It supports industrial-grade operation in factory automation PLCs and battery management systems.
For engineers reviewing the MC33PF8100CGES datasheet, MC33PF8100CGES pinout, MC33PF8100CGES application, or MC33PF8100CGES equivalent, key selection criteria include channel count, total output current capability, SPI-configurable sequencing flexibility, functional safety support, and thermal performance in compact 7 mm × 7 mm QFN packaging.
Technical Context
The MC33PF8100CGES integrates twelve independent DC/DC and LDO regulators with per-rail enable, voltage margining, and overvoltage/undervoltage fault detection. Its SPI interface supports real-time register readback, dynamic voltage scaling, and fault status polling with CRC-8 error checking.
Designed for i.MX processor power domains, it implements hardware-controlled power-up/down sequencing with programmable delays (0–255 ms), soft-start ramp control, and independent reset assertion per rail. All channels meet industrial temperature range (−40 °C to +105 °C) and AEC-Q100 Grade 2 reliability requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channel Count | 12 independent power rails with configurable enable, voltage, and sequencing |
| Total Output Current | 7.3 A aggregate output capability across all channels |
| Output Voltage Range | 0.5 V to 3.3 V in 10 mV steps; supports core, I/O, and peripheral rail requirements |
| Sequencing Resolution | Programmable delay steps of 1 ms up to 255 ms between rail activations |
| Interface | SPI with CRC-8, 10 MHz max clock, full register read/write and fault status reporting |
| Operating Temperature | −40 °C to +105 °C; qualified per AEC-Q100 Grade 2 for industrial reliability |
| Package | 48-pin QFN, 7 mm × 7 mm, 0.5 mm pitch, exposed thermal pad |
Pinout & Package
MC33PF8100CGES is housed in a thermally enhanced 48-pin QFN package (7 mm × 7 mm, 0.5 mm pitch) with an exposed die paddle for improved heat dissipation in high-current industrial applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO | Digital I/O supply | 3.3 V input powering SPI interface and logic; decoupling required |
| VDDA | Analog reference supply | 3.3 V input for internal ADCs, comparators, and voltage monitors |
| VDDCORE | Main regulator input | Input for internal buck converters; accepts 4.5 V to 20 V |
| ENx (x=1–12) | Per-rail enable control | Active-high digital inputs enabling individual regulator outputs |
| RESET_OUT | System reset signal | Open-drain output asserting reset during fault or sequencing timeout |
| SCLK/MOSI/MISO/CS | SPI interface signals | Full-duplex serial communication with CRC-8 integrity checking |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Power Sequencing | Hardware-enforced startup/shutdown order with 1 ms resolution and fault-triggered abort |
| Real-Time Fault Monitoring | Per-rail OV/UV/OC detection with immediate SPI flag and RESET_OUT assertion |
| Voltage Margining Support | ±5% programmable adjustment per rail for production test and aging compensation |
| Thermal Protection | Integrated die temperature sensor with programmable shutdown threshold (125 °C default) |
| Watchdog Timer | Independent 1.6 s timeout with windowed mode; resets on missing SPI heartbeat |
Applications
| Factory Automation PLC | Building HVAC Control |
|---|---|
Use Scenario: Powering multi-rail i.MX 6-based controller boards in modular PLC backplanes with strict sequencing and fault isolation. IC Role / Device Role / Timing Role: Centralized power manager coordinating CPU core, DDR memory, Ethernet PHY, and I/O expansion rails. Use Value: Eliminates discrete sequencing logic and reduces BOM count by consolidating 12 regulated supplies into single-package solution with deterministic startup timing. | Use Scenario: Supplying dual-core i.MX 7 processor in smart HVAC gateway handling Zigbee, Wi-Fi, and CAN bus interfaces. IC Role / Device Role / Timing Role: System basis chip delivering sequenced 1.0 V core, 1.1 V GPU, 1.8 V I/O, and 3.3 V peripheral rails with thermal derating. Use Value: Enables fail-safe shutdown during overheating events while maintaining watchdog supervision across all subsystems. |
| Battery Management System | Medical Portable Monitor |
Use Scenario: Powering i.MX 6ULL-based BMS master controller interfacing with MC33772 cell monitor daisy chains. IC Role / Device Role / Timing Role: Primary power sequencer ensuring proper initialization order between MCU, CAN transceiver, and analog front-end rails. Use Value: Guarantees reliable boot under wide-input voltage conditions (9–36 V battery input) with brown-out immunity and reset hold-off. | Use Scenario: Regulating power for ARM Cortex-A7-based portable diagnostic device with LCD, ADC, and Bluetooth LE subsystems. IC Role / Device Role / Timing Role: Multi-rail PMIC supplying low-noise 1.2 V core, 1.8 V sensor interface, and 3.3 V wireless radio rails. Use Value: Reduces standby current to <15 µA in deep-sleep mode while preserving fast wake-up sequencing for emergency alerts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-rail power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF3000CGES | Same 12-channel architecture and 7.3 A rating but lacks integrated watchdog and has reduced sequencing resolution (10 ms steps) | Suitable for cost-sensitive non-safety-critical i.MX 6 designs without runtime fault monitoring | Select when functional safety features are not required and lower BOM cost is prioritized |
| MMPF0200AZES | 14-channel PMIC with higher total current (7.5 A), but fixed factory-programmed configuration and no field reprogramming via SPI | Optimized for i.MX 6QuadPlus in fixed-function gateways where sequencing is static and unchanging | Select when design requires maximum channel count and pre-validated configurations over runtime flexibility |
Compared with MC33PF8100CGES, MC34PF3000CGES trades runtime configurability and safety monitoring for lower unit cost, while MMPF0200AZES offers greater channel density at the expense of field-programmability - making MC33PF8100CGES optimal for dynamically reconfigurable industrial controllers requiring real-time diagnostics.
Availability
MC33PF8100CGES is available at Aetrix Electronics and suitable for factory automation PLCs, building HVAC gateways, and battery management systems requiring stable component supply across extended product lifecycles.
Supply support for MC33PF8100CGES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader delivering secure, connected, and intelligent solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.
The MC33PF8100CGES belongs to NXP's industrial-grade analog power management portfolio, designed specifically to simplify power architecture for i.MX application processors in safety-aware embedded systems.
FAQ
What is the maximum input voltage supported by the MC33PF8100CGES?
The MC33PF8100CGES accepts a main input voltage (VDDCORE) ranging from 4.5 V to 20 V, enabling direct connection to standard industrial 12 V or 24 V supply rails. This input powers its internal buck regulators and supports operation across wide-voltage battery and adapter-fed systems. The MC33PF8100CGES maintains regulation and sequencing integrity across this full range without external components.
Does the MC33PF8100CGES support AEC-Q100 qualification?
Yes, the MC33PF8100CGES is qualified to AEC-Q100 Grade 2 (−40 °C to +105 °C), confirming its suitability for harsh industrial environments including factory automation and transportation systems. This qualification covers HTOL, ESD, and thermal cycling tests per automotive standards - a key differentiator for long-lifecycle deployments where reliability is critical. The MC33PF8100CGES meets these requirements out-of-the-box with no derating needed.
Can the MC33PF8100CGES be used with i.MX 8 processors?
No, the MC33PF8100CGES is specifically optimized for i.MX 6 and i.MX 7 series processors, with voltage rails, sequencing timing, and register maps aligned to those families' power requirements. While some output configurations may function with i.MX 8, official support, validation, and reference designs are limited to i.MX 6/7. For i.MX 8, NXP recommends newer PMICs such as PF8200 or PF8300. The MC33PF8100CGES does not include i.MX 8-specific power states or firmware hooks.
How many independent enable inputs does the MC33PF8100CGES provide?
The MC33PF8100CGES provides twelve dedicated ENx pins (EN1 through EN12), each controlling one of its twelve regulated outputs independently. These are active-high digital inputs compatible with 3.3 V logic levels and support both hardware-driven and microcontroller-driven enable sequencing. This enables flexible power-up strategies - for example, using external GPIOs to override SPI-controlled sequencing during debug or recovery modes. Each ENx pin directly gates its corresponding regulator.
Is thermal pad soldering required for the MC33PF8100CGES QFN package?
Yes, the exposed thermal pad on the MC33PF8100CGES 48-pin QFN package must be soldered to a PCB thermal plane for reliable operation at full 7.3 A load. NXP specifies minimum 80% solder coverage and recommends a 4×4 array of thermal vias beneath the pad connected to an internal ground plane. Failure to properly attach the thermal pad risks junction temperature exceedance (>125 °C), triggering thermal shutdown and compromising long-term reliability. The MC33PF8100CGES datasheet includes detailed layout guidelines for this requirement.
MC33PF8100CGES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8100CGES FAQ
1.How can I place an order for MC33PF8100CGES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8100CGES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8100CGES reliable?
The price and inventory of MC33PF8100CGES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8100CGES is usually 5 days.
3.What payment methods are accepted for MC33PF8100CGES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8100CGES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8100CGES?
MC33PF8100CGES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8100CGES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8100CGES?
For technical support, including MC33PF8100CGES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8100CGES requirements.
6.How does Aetrix verify that MC33PF8100CGES is sourced from the original manufacturer or authorized distributors?
All MC33PF8100CGES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8100CGES meets industry standards.
7.What is the process for return or replacement of MC33PF8100CGES?
All MC33PF8100CGES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8100CGES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8100CGES part is unused and in its original packaging.
Return procedure for MC33PF8100CGES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC33PF8100CGES Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
