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NXP Semiconductors MC33PF8100CHES
- Part No.:
- MC33PF8100CHES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- -
- Datasheet:
-
MC33PF8100CHES.pdf
- Description:
- POWER MANAGEMENT IC, I.MX8, PRE-
- Quantity:
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Inventory:569
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Product details
Overview
MC33PF8100CHES from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed specifically for i.MX8QM processors with DDR4 memory. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charging, watchdog monitoring, and ASIL B-compliant safety circuitry. It operates from a 2.7 V to 5.5 V input and supports dynamic voltage scaling for CPU, GPU, memory, and peripherals in infotainment and ADAS systems.
For engineers reviewing the MC33PF8100CHES datasheet, MC33PF8100CHES pinout, MC33PF8100CHES application, or MC33PF8100CHES equivalent, this page delivers verified technical context, validated pin functions, confirmed regulator specifications, automotive safety implementation details, and real-world system integration guidance for i.MX8QM-based platforms with DDR4 memory.
Technical Context
The MC33PF8100CHES implements a hierarchical power architecture with seven synchronous buck regulators-six configurable in dual/triple/quad-phase modes (SW1–SW6) and one independent wide-range buck (SW7, 1.0–4.1 V). All bucks support programmable current limit, spread-spectrum modulation, and manual frequency tuning. LDOs LDO1–LDO4 deliver 1.5–5.0 V at 400 mA with optional load-switch mode, while VSNVS provides selectable 1.8/3.0/3.3 V RTC backup with integrated coin cell charger.
Its digital core includes a 3.4 MHz I²C interface, OTP-configurable startup sequence, 24-channel analog multiplexer for system diagnostics, and a state machine supporting hard reset, standby, fault shutdown, and fail-safe transitions. Safety features include independent voltage/thermal monitoring, ABIST, watchdog timer with programmable counter, and I²C CRC protection-all meeting ASIL B requirements per ISO 26262.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7 V to 5.5 V VIN - powers all internal regulators; UVLO threshold at 2.7 V ensures reliable startup under automotive battery transients. |
| Buck Regulators | 7 channels: SW1–SW6 (0.4–1.8 V, ±1.5% accuracy, 2.5 A), SW7 (1.0–4.1 V, ±2%, 2.5 A) - enables full-core, memory, and I/O rail sequencing for i.MX8QM DDR4 systems. |
| LDO Regulators | 4 channels (LDO1–LDO4): 1.5–5.0 V, ±3% accuracy, 400 mA each - supplies low-noise analog, interface, and auxiliary rails with hardware/software enable control. |
| I²C Interface | Up to 3.4 MHz - supports fast register configuration and real-time telemetry during dynamic DVFS transitions without bus contention. |
| Thermal Range | −40 °C to +105 °C ambient - qualified for automotive under-hood and infotainment module environments per AEC-Q100 Grade 2. |
| Safety Compliance | ASIL B functional safety monitoring - includes independent voltage monitors, thermal shutdown, watchdog with fault counter, and ABIST for diagnostic coverage. |
| Package | HVQFN56, 8 mm × 8 mm × 0.9 mm, wettable flank - enables automated optical inspection (AOI) and robust solder joint reliability in automotive PCB assembly. |
Pinout & Package
HVQFN56 package (SOT684-29(D)), 8 mm × 8 mm × 0.9 mm body, 0.5 mm pitch, thermally enhanced with dimple wettable flanks for automotive-grade reflow and AOI compatibility.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck output voltage feedback | High-impedance inputs for closed-loop regulation; support external resistor dividers to set precise output voltages per i.MX8QM DDR4 timing requirements. |
| SW1IN–SW7IN | Buck input supply | Accepts 2.7–5.5 V input; SW1–SW6 share VIN domain, SW7 may be independently powered for isolated VTT or analog bias rails. |
| SW1LX–SW7LX | Buck switching node | High-frequency switched outputs driving external inductors; require tight layout with low-inductance paths to minimize EMI and voltage spikes. |
| LDO1OUT–LDO4OUT | Linear regulator outputs | Low-noise, fast-transient outputs for analog cores, SerDes, and interface I/O; each supports optional load switch control via dedicated EN pins. |
| VSNVS | RTC supply output | Programmable 1.8/3.0/3.3 V output with battery backup capability; maintains real-time clock and SRAM retention during main power loss. |
| SCL/SDA | I²C interface signals | 3.4 MHz capable, 1.6–3.3 V tolerant - connects directly to i.MX8QM's I²C controllers without level-shifting for PMIC configuration and monitoring. |
| PGOOD/INTB/RESETBMCU | System status outputs | Open-drain signals synchronized to regulator readiness, fault events, and MCU reset assertion - enable deterministic boot sequencing and error recovery. |
| EPAD | Exposed thermal pad | Must be soldered to solid ground plane; provides primary thermal path (RθJC = 0.6 °C/W) and electrical grounding for noise-sensitive analog sections. |
Key Features
| Feature | Design Value |
|---|---|
| Dual/triple/quad-phase buck configuration | SW1–SW4 can be combined into up to 10 A quad-phase regulator for high-current CPU/GPU cores - eliminates need for external phase-interleaving controllers. |
| VTT termination on SW6 | Configurable as DDR4 VTT supply with precision tracking and current sink/source capability - meets JEDEC DDR4 termination specs without external components. |
| OTP-based startup configuration | One-time programmable memory stores voltage levels, sequencing order, and safety thresholds - reduces external resistors, EEPROM, and firmware initialization overhead. |
| 24-channel analog multiplexer | Enables real-time monitoring of all regulator outputs, die temperature, and external sensors via single ADC input - simplifies board-level diagnostics and predictive maintenance. |
| ASIL B safety monitoring | Independent voltage/thermal watchdogs, ABIST, and fail-safe output (FSOB) - satisfies ISO 26262 requirements for automotive infotainment without external safety co-processor. |
| RTC with coin cell charger | Integrated charger with programmable current/voltage and automatic switchover between VIN and LICELL - ensures uninterrupted timekeeping and memory retention across ignition cycles. |
Applications
| Automotive Infotainment Head Unit | ADAS Domain Controller Power |
|---|---|
Use Scenario: Centralized multimedia system with i.MX8QM SoC, DDR4 memory, GPU, display interfaces, and audio codecs. IC Role / Device Role / Timing Role: Primary PMIC supplying all core, memory, I/O, and RTC rails with strict sequencing and ASIL B safety monitoring. Use Value: Eliminates discrete DC/DC and LDO count by 12+ components; enables single-chip power solution compliant with automotive thermal and EMC requirements. |
Use Scenario: Sensor fusion controller integrating camera, radar, and CAN FD, requiring low-noise analog supplies and fast wake-up from standby. IC Role / Device Role / Timing Role: System power manager delivering sequenced, monitored, and dynamically scaled rails for vision processing and real-time communication subsystems. Use Value: Reduces BOM cost and PCB area by consolidating 7 bucks + 4 LDOs + RTC + charger + safety logic into one AEC-Q100 qualified device. |
| i.MX8QM-Based Telematics Gateway | Industrial Edge AI Module |
Use Scenario: Cellular-connected vehicle gateway handling OTA updates, secure boot, and multi-network connectivity (LTE, Wi-Fi, Bluetooth). IC Role / Device Role / Timing Role: High-reliability power source with fail-safe output (FSOB), watchdog supervision, and coin-cell-backed RTC for secure time-stamping. Use Value: Ensures deterministic power-up and fault containment during critical firmware updates; supports secure lifecycle management via OTP-locked configurations. |
Use Scenario: Ruggedized edge AI appliance using i.MX8QM for inferencing, with extended temperature operation and long-term field deployment. IC Role / Device Role / Timing Role: Automotive-grade PMIC providing DDR4-compatible VDDQ/VTT, low-noise analog rails, and thermal-aware throttling for sustained compute loads. Use Value: Extends product lifetime through ASIL B diagnostics, robust thermal management (150 °C junction limit), and wettable-flank packaging for high-reliability solder joints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DHES | Includes ASIL B safety enhancements not present in PF8100: ABIST-on-demand, secure I²C write, FSOB assertion logic, and fail-safe state machine extensions. | Required for systems needing full ISO 26262 ASIL B certification beyond monitoring - e.g., ADAS perception modules where fault containment must be hardware-enforced. | Select MC33PF8200DHES when functional safety compliance requires certified fail-safe behavior, not just monitoring; MC33PF8100CHES suffices for ASIL B monitoring-only use cases. |
| MPQ4436-AEC1 | Single 3 A buck converter (no LDOs, no OTP, no I²C, no safety features); requires external sequencing logic and discrete LDOs for full i.MX8QM support. | Only suitable as partial replacement for individual rails (e.g., CPU core); cannot replace MC33PF8100CHES as a complete PMIC solution. | Use MPQ4436-AEC1 only for cost-sensitive, non-safety-critical auxiliary rails; it does not provide the integrated 12-channel, safety-monitored, OTP-configured functionality of MC33PF8100CHES. |
Compared with MC33PF8200DHES, MC33PF8100CHES offers identical power architecture and i.MX8QM DDR4 support but omits advanced fail-safe state transitions and secure register writes - making it ideal for ASIL B *monitoring* applications like infotainment, where full fail-safe enforcement is unnecessary. Versus MPQ4436-AEC1, MC33PF8100CHES delivers 12-channel integration, safety logic, and OTP configuration in one package, eliminating 15+ discrete components and associated layout complexity.
Availability
MC33PF8100CHES is available at Aetrix Electronics and suitable for automotive infotainment head units, ADAS domain controllers, and i.MX8QM-based telematics gateways requiring stable component supply, AEC-Q100 qualification, and long-term automotive lifecycle support.
Supply support for MC33PF8100CHES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and power management.
The PF8100 product line was engineered as the reference PMIC for NXP's i.MX 8 family - delivering tightly integrated, OTP-configurable, safety-aware power delivery optimized for high-performance multimedia and real-time automotive computing.
FAQ
What processor families is the MC33PF8100CHES specifically designed to support?
The MC33PF8100CHES is explicitly designed for NXP i.MX8QM processors with DDR4 memory, as indicated in its ordering information and application diagrams. It also supports other i.MX8 variants (e.g., i.MX8QXP) and select S32x series devices, but its OTP configuration, power tree, and pinout are optimized for i.MX8QM DDR4 system requirements including VDDQ, VTT, and GPU core sequencing.
Does the MC33PF8100CHES include built-in safety features for automotive applications?
Yes, the MC33PF8100CHES includes ASIL B-compliant safety monitoring circuitry: independent voltage/thermal monitors, watchdog timer with fault counter, I²C CRC protection, and analog built-in self-test (ABIST). While it lacks the full fail-safe state machine of the PF8200 series, its monitoring capabilities meet ASIL B requirements for automotive infotainment and telematics applications per ISO 26262.
How does the OTP memory in the MC33PF8100CHES reduce system design complexity?
The OTP memory in the MC33PF8100CHES stores startup voltage levels, power-up/down sequencing order, safety thresholds, and default I²C register settings - eliminating the need for external configuration resistors, EEPROM, or boot-time firmware initialization. This reduces BOM count, improves boot reliability, and accelerates time-to-market for i.MX8QM-based designs.
Can the MC33PF8100CHES support DDR4 memory termination requirements?
Yes, the MC33PF8100CHES supports DDR4 VTT termination through SW6, which is configurable as a precision-tracking VTT regulator with current sink/source capability. Its 0.4–1.8 V output range, ±1.5% accuracy, and programmable current limit meet JEDEC DDR4 termination specifications without requiring external components.
What is the role of the VSNVS output on the MC33PF8100CHES?
The VSNVS output on the MC33PF8100CHES provides a selectable 1.8 V, 3.0 V, or 3.3 V supply for real-time clock (RTC) and always-on logic. It is backed by either the main VIN supply or an external coin cell (via LICELL pin), with integrated charging circuitry - ensuring continuous timekeeping and SRAM retention during vehicle ignition-off periods.
MC33PF8100CHES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Applications:
- -
- Current - Supply:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
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- Supplier Device Package:
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MC33PF8100CHES FAQ
1.How can I place an order for MC33PF8100CHES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8100CHES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8100CHES reliable?
The price and inventory of MC33PF8100CHES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8100CHES is usually 5 days.
3.What payment methods are accepted for MC33PF8100CHES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8100CHES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8100CHES?
MC33PF8100CHES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8100CHES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8100CHES?
For technical support, including MC33PF8100CHES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8100CHES requirements.
6.How does Aetrix verify that MC33PF8100CHES is sourced from the original manufacturer or authorized distributors?
All MC33PF8100CHES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8100CHES meets industry standards.
7.What is the process for return or replacement of MC33PF8100CHES?
All MC33PF8100CHES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8100CHES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8100CHES part is unused and in its original packaging.
Return procedure for MC33PF8100CHES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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