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NXP Semiconductors MC33PF8100CHESR2
- Part No.:
- MC33PF8100CHESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8100CHESR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX8 PRE-PR
- Quantity:
- Payment:
- Shipping:
Inventory:2,529
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Product details
Overview
MC33PF8100CHESR2 from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed as the primary power solution for i.MX8QM processors with DDR4 memory. It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B-compliant monitoring circuitry. It operates from 2.7 V to 5.5 V input and supports dynamic voltage scaling for CPU, GPU, memory, and peripherals in infotainment systems.
For engineers reviewing the MC33PF8100CHESR2 datasheet, MC33PF8100CHESR2 pinout, MC33PF8100CHESR2 application, or MC33PF8100CHESR2 equivalent, this page delivers verified technical context, exact pin functions, real-world use cases for i.MX8QM-based automotive platforms, and validated alternative options - all grounded in NXP's PF8100 product data sheet Rev. 13 (March 2026).
Technical Context
The MC33PF8100CHESR2 implements a deterministic state machine for fault-aware power sequencing, with OTP-programmed startup configuration and runtime I²C reconfiguration at up to 3.4 MHz. Its architecture supports multi-phase configurations: SW1–SW3 can operate as triple-phase (7.5 A), SW1–SW4 as quad-phase (10 A), and SW6 in VTT termination mode for DDR4 memory interfaces.
It features 24-channel analog multiplexing for system diagnostics, independent voltage/thermal monitoring per regulator, ABIST self-test, and fail-safe logic including FSOB assertion and programmable fault counters - all meeting automotive QM safety grade requirements without ASIL B hardware redundancy (unlike PF8200).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 7 buck converters + 4 LDOs + VSNVS RTC supply - powers full i.MX8QM SoC, DDR4 memory, and peripherals from single PMIC. |
| Buck Output Range | SW1–SW6: 0.4 V–1.8 V (6.25 mV step); SW7: 1.0 V–4.1 V - covers core, I/O, GPU, and DDR termination rails. |
| Current Rating | 2.5 A per buck channel; 400 mA per LDO - sufficient for i.MX8QM CPU clusters, LPDDR4/DDR4 memory, and auxiliary logic. |
| I²C Interface | Up to 3.4 MHz - enables fast runtime voltage tuning and status polling during dynamic performance states. |
| Input Voltage Range | 2.7 V–5.5 V VIN - compatible with automotive 3.3 V/5 V supplies and battery-backed operation. |
| Safety Grade | QM (Quality Management) - includes watchdog, PGOOD, thermal shutdown, and voltage monitors; no ASIL B hardware safety features. |
| OTP Memory | One-time programmable storage for boot configuration - eliminates external resistors for voltage setpoints and power-up sequence. |
Pinout & Package
HVQFN56 package: 8 mm × 8 mm × 0.85 mm body, 0.5 mm pitch, thermally enhanced wettable flanks, exposed EPAD for thermal dissipation and ground connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (Pin 50) | Main input supply | Accepts 2.7–5.5 V; powers internal regulators and OTP circuitry - requires local bulk capacitance and ESD protection. |
| SW1FB–SW7FB (Pins 2,3,12,13,30,31,38) | Buck feedback inputs | Resistor-divider inputs for closed-loop output voltage regulation; support ±1.5 % (SW1–SW6) or ±2 % (SW7) accuracy. |
| LDO1OUT–LDO4OUT (Pins 15,18,25,28) | LDO regulated outputs | Deliver 1.5–5.0 V @ 400 mA each; configurable as load switches - used for I/O rails, sensors, and low-noise analog blocks. |
| VSNVS (Pin 47) | RTC supply output | Provides 1.8/3.0/3.3 V @ 10 mA from VIN or coin cell (LICELL); maintains real-time clock during system sleep or main power loss. |
| SCL/SDA (Pins 55/56) | I²C interface | Supports Fast Mode Plus (3.4 MHz); enables dynamic DVS, fault logging, and register readback without interrupting operation. |
| FSOB (Pin 29) | Failsafe output | Open-drain signal asserted on critical faults (e.g., overtemperature, UVLO, watchdog timeout) - drives system-level safe state entry. |
Key Features
| Feature | Design Value |
|---|---|
| Multi-phase buck configuration | SW1–SW3 triple-phase (7.5 A) or SW1–SW4 quad-phase (10 A) - delivers high-current CPU/GPU rails with reduced ripple and improved transient response. |
| VTT termination mode | SW6 programmable as DDR4 VTT sink/source - eliminates need for external termination IC in memory subsystems. |
| 24-channel analog multiplexer | Enables system-level diagnostics via single ADC input - monitors voltages, temperatures, and currents across PMIC and board-level sensors. |
| Programmable soft-start/sequence | OTP-configurable power-up/down timing and ordering - ensures correct voltage ramping for i.MX8QM core, memory, and peripherals. |
| Coin cell charging | Integrated charger with programmable current/voltage - sustains RTC and backup SRAM during vehicle ignition-off periods. |
Applications
| Automotive Infotainment Head Unit | i.MX8QM-Based Digital Cluster |
|---|---|
Use Scenario: Centralized multimedia system with dual-display graphics, audio processing, and connectivity modules. IC Role / Device Role / Timing Role: Primary PMIC supplying CPU cores, GPU, DDR4 memory, display interfaces, and CAN/FlexRay transceivers. Use Value: Reduces BOM count by consolidating 12 power rails; OTP eliminates 14+ external configuration resistors and simplifies layout. |
Use Scenario: Safety-critical instrument cluster requiring high-reliability power sequencing and runtime monitoring. IC Role / Device Role / Timing Role: Power controller managing i.MX8QM real-time domain, graphics domain, and memory subsystem with fail-safe signaling. Use Value: FSOB output triggers MCU safe state on thermal or voltage fault; 24-channel AMUX enables continuous health monitoring of all rail voltages. |
| Advanced Driver Assistance System (ADAS) Sensor Hub | Vehicle Telematics Control Unit (TCU) |
Use Scenario: Multi-camera fusion module with ISP, radar preprocessor, and Ethernet backhaul. IC Role / Device Role / Timing Role: Power manager delivering synchronized, low-noise supplies to image sensors, ISPs, and high-speed SerDes links. Use Value: Spread-spectrum switching and independent LDOs minimize EMI coupling into analog sensor paths; VSNVS maintains timestamp integrity during power transitions. |
Use Scenario: Cellular-connected gateway handling OTA updates, fleet diagnostics, and secure boot. IC Role / Device Role / Timing Role: Core power IC enabling secure boot sequence, cryptographic accelerator supply, and modem interface rails. Use Value: Watchdog timer and PGOOD monitoring ensure firmware update integrity; I²C CRC prevents unauthorized register writes during field operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DHESR2 | ASIL B certified; adds ABIST-on-demand, FSOB active safe state, secure I²C write, and fail-safe counter logic - not present in MC33PF8100CHESR2. | Required for ISO 26262 ASIL B system-level compliance; supports fail-operational behavior in safety-critical domains. | Select when functional safety certification is mandatory; not drop-in - requires OTP reprogramming and safety software integration. |
| MC34PF8100CHESR2 | Industrial-grade variant; identical electrical specs and pinout but rated for −40°C to +105°C (same as automotive) and lacks automotive qualification (AEC-Q100 Grade 2). | Suitable for non-automotive high-performance embedded systems (e.g., industrial HMI, medical imaging) where AEC-Q100 is not required. | Select for cost-sensitive industrial designs needing same functionality without automotive qualification overhead. |
Compared with MC33PF8100CHESR2, MC33PF8200DHESR2 adds hardware safety mechanisms for ASIL B compliance but increases design complexity, while MC34PF8100CHESR2 offers identical power capability at lower qualification cost for non-automotive use - making MC33PF8100CHESR2 the optimal QM-grade choice for i.MX8QM infotainment without safety certification overhead.
Availability
MC33PF8100CHESR2 is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, and ADAS sensor hubs requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified power management.
Supply support for MC33PF8100CHESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based application processors and power management.
The PF8100 product line is engineered specifically for NXP's i.MX 8 series processors, delivering integrated, OTP-configurable power sequencing and monitoring to simplify high-performance automotive and industrial system design.
FAQ
What is the input voltage range supported by the MC33PF8100CHESR2?
The MC33PF8100CHESR2 supports a main input voltage range of 2.7 V to 5.5 V on its VIN pin (Pin 50). This range accommodates standard automotive 3.3 V and 5 V supplies, as well as battery-backed operation. Absolute maximum rating is 6.0 V, but sustained operation above 5.5 V is limited to ≤1800 seconds over device lifetime per NXP specification.
Does the MC33PF8100CHESR2 support DDR4 memory termination?
Yes, the MC33PF8100CHESR2 supports DDR4 memory termination via SW6, which can be configured in VTT mode. SW6 delivers 0.4 V to 1.8 V at 2.5 A with 6.25 mV programmable steps - meeting JEDEC DDR4 VTT requirements for point-to-point or multi-drop topologies in i.MX8QM-based systems.
How does the MC33PF8100CHESR2 handle power sequencing for the i.MX8QM processor?
The MC33PF8100CHESR2 uses OTP-stored configuration to execute precise, deterministic power-up and power-down sequences for the i.MX8QM. It controls voltage ramp rates, inter-rail timing delays, and enable/disable ordering - all programmable via OTP or runtime I²C - ensuring compliance with i.MX8QM's strict sequencing requirements for CPU, GPU, memory, and peripherals.
Is the MC33PF8100CHESR2 pin-compatible with the MC33PF8200DHESR2?
Yes, the MC33PF8100CHESR2 and MC33PF8200DHESR2 share identical HVQFN56 pinout, package dimensions, and electrical pin functions. However, MC33PF8200DHESR2 includes additional ASIL B safety features (e.g., secure I²C, ABIST-on-demand) not present in MC33PF8100CHESR2 - requiring firmware and safety software changes despite mechanical compatibility.
What safety certification level does the MC33PF8100CHESR2 meet?
The MC33PF8100CHESR2 is qualified to AEC-Q100 Grade 2 and classified as QM (Quality Management) grade - meaning it includes robust monitoring (watchdog, thermal, voltage), fault reporting (FSOB, INTB), and fail-safe logic, but lacks the hardware redundancy and diagnostic coverage required for ASIL B certification, which is provided only in the PF8200 family.
MC33PF8100CHESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8100CHESR2 FAQ
1.How can I place an order for MC33PF8100CHESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8100CHESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8100CHESR2 reliable?
The price and inventory of MC33PF8100CHESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8100CHESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF8100CHESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8100CHESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8100CHESR2?
MC33PF8100CHESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8100CHESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8100CHESR2?
For technical support, including MC33PF8100CHESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8100CHESR2 requirements.
6.How does Aetrix verify that MC33PF8100CHESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF8100CHESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8100CHESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF8100CHESR2?
All MC33PF8100CHESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8100CHESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8100CHESR2 part is unused and in its original packaging.
Return procedure for MC33PF8100CHESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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