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NXP Semiconductors MC33PF8100EAESR2
- Part No.:
- MC33PF8100EAESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8100EAESR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX8 PRE-PR
- Quantity:
- Payment:
- Shipping:
Inventory:2,692
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Product details
Overview
MC33PF8100EAESR2 from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed for LS1046A processors with DDR4 memory (VDDQ + VTT). It integrates seven high-efficiency buck converters (SW1–SW7), four linear regulators (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B-compliant monitoring circuitry. It operates from 2.7 V to 5.5 V input and supports dynamic voltage scaling for CPU/memory rails in infotainment and telematics systems.
For engineers reviewing the MC33PF8100EAESR2 datasheet, MC33PF8100EAESR2 pinout, MC33PF8100EAESR2 application, or MC33PF8100EAESR2 equivalent, this page delivers verified technical context, validated pin functions, real-world use cases for i.MX/S32x/LS1046A platforms, and confirmed alternative parts with documented functional and safety-grade differences.
Technical Context
The MC33PF8100EAESR2 implements a deterministic state machine for fault-aware power sequencing, supporting programmable startup/shutdown sequences stored in one-time programmable (OTP) memory. Its 3.4 MHz I²C interface enables runtime reconfiguration of regulator voltages, current limits, and DVS profiles without requiring external components.
It features dual-phase and triple-phase configuration capability across SW1–SW4, VTT termination on SW6, and 24-channel analog multiplexer for system-level diagnostics. Thermal shutdown protection activates at 150 °C junction temperature, and its monitoring circuit meets ASIL B requirements via independent voltage/thermal fault detection, ABIST, and CRC-protected register writes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7 V to 5.5 V - powers entire PMIC from single main rail; UVLO threshold at 5.5 V ensures stable operation during automotive transients. |
| Buck Regulators | 7 channels (SW1–SW7) - SW1–SW6: 0.4–1.8 V @ 2.5 A ±1.5 % accuracy; SW7: 1.0–4.1 V @ 2.5 A ±2 % - covers core, I/O, memory, and auxiliary rails. |
| LDO Regulators | 4 channels (LDO1–LDO4): 1.5–5.0 V @ 400 mA ±3 % - supplies low-noise analog/digital peripherals with optional load switch mode. |
| I²C Interface Speed | Up to 3.4 MHz - enables fast runtime tuning of output voltages and sequencing parameters without interrupting system operation. |
| Thermal Protection | Junction shutdown at 150 °C - prevents thermal runaway in sealed automotive enclosures; RθJA = 27 °C/W on 4-layer board ensures reliable heat dissipation. |
| Safety Certification | ASIL B monitoring circuit - includes independent voltage monitors, thermal sensors, watchdog counter, ABIST, and fail-safe output (FSOB) for critical failure response. |
| Package | HVQFN56, 8 mm × 8 mm × 0.9 mm, wettable flank - supports automated optical inspection (AOI) and high-reliability solder joint formation in automotive PCB assembly. |
Pinout & Package
HVQFN56 package with 56 terminals, 0.5 mm pitch, thermally enhanced construction and wettable flank for automotive-grade solder joint reliability. Exposed pad (EPAD) must be connected to ground for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (Pin 50) | Main input supply | Accepts 2.7–5.5 V system rail; powers internal LDOs, logic, and buck controller circuitry. |
| SW1FB–SW7FB (Pins 3,12,13,30,31,38) | Buck feedback inputs | Resistor-divider inputs for precise closed-loop regulation; support ±1.5 % output accuracy. |
| SW1LX–SW7LX (Pins 5,6,9,10,33,34,36) | Switching node outputs | High-frequency switching nodes connecting to external inductors; tolerate −3.0 V transient spikes during dead time. |
| LDO1OUT–LDO4OUT (Pins 15,18,25,28) | LDO regulated outputs | Low-noise, fixed- or programmable-voltage supplies for analog/digital peripherals; each supports 400 mA load. |
| VSNVS (Pin 47) | RTC supply output | 1.8/3.0/3.3 V selectable output @ 10 mA - maintains real-time clock and battery-backed memory during system sleep. |
| SCL/SDA (Pins 55/56) | I²C interface | 3.4 MHz high-speed bus for configuring regulators, reading monitors, and updating OTP shadow registers. |
| FSOB (Pin 29) | Fail-safe output | Open-drain signal asserting LOW on critical faults (e.g., thermal runaway, voltage monitor failure) to trigger system-level safe state. |
| RESETBMCU (Pin 21) | MCU reset output | Open-drain reset signal synchronized to PMIC power-up sequence; asserts HIGH after successful regulator initialization. |
Key Features
| Feature | Design Value |
|---|---|
| One-time programmable (OTP) memory | Stores boot-time voltage setpoints, power-up/down sequencing, and safety configuration - eliminates external resistors and reduces BOM count by up to 12 components. |
| Dual/triple/quad-phase buck configuration | SW1–SW4 can be combined into 2-, 3-, or 4-phase configurations delivering up to 10 A - supports high-current CPU cores (e.g., LS1046A Cortex-A72) with reduced ripple and improved transient response. |
| VTT termination on SW6 | Configurable as DDR4 VTT supply (0.6 V ±1 %) with active sink/source capability - meets JEDEC DDR4 termination specs without external circuitry. |
| 24-channel analog multiplexer (AMUX) | Enables system-level diagnostics by routing internal voltage/temperature monitors to a single ADC input - simplifies health monitoring in space-constrained automotive modules. |
| Coin cell charger with programmable control | Charges backup battery at user-defined current/voltage (e.g., 100 µA/3.0 V) - extends RTC uptime during extended vehicle off-state without overcharging risk. |
Applications
| Automotive Infotainment Head Unit | Telematics Control Unit (TCU) |
|---|---|
Use Scenario: Powering i.MX8QM processor, LPDDR4 memory, and display/audio interfaces in a head unit operating across −40 °C to 105 °C ambient. IC Role / Device Role / Timing Role: Primary PMIC managing 7 buck rails (CPU, GPU, DDR, I/O) and 4 LDOs (audio codec, CAN transceiver, sensor interface, RTC). Use Value: OTP-configured sequencing eliminates boot timing uncertainty; ASIL B monitoring ensures fail-safe shutdown during voltage faults, meeting ISO 26262 requirements. |
Use Scenario: Supplying LS1046A SoC, DDR4 memory (VDDQ/VTT), cellular modem, and GNSS receiver in a 5G TCU deployed in engine bay environments. IC Role / Device Role / Timing Role: Dual-role PMIC delivering VDDQ (1.2 V) and VTT (0.6 V) from SW6 while powering modem LDOs and RTC from VSNVS/LDO4. Use Value: VTT termination mode on SW6 meets DDR4 JEDEC spec; spread-spectrum switching reduces EMI in RF-sensitive modules without external filters. |
| Advanced Driver Assistance Systems (ADAS) Domain Controller | Industrial Gateway with Edge AI Acceleration |
Use Scenario: Supporting S32V234 vision processor and MIPI camera interfaces in a front-camera ADAS module requiring functional safety compliance. IC Role / Device Role / Timing Role: Safety-critical PMIC providing ASIL B–compliant monitoring of all 12 rails, with FSOB assertion on any monitored fault (e.g., SW3 UV, thermal overload). Use Value: Independent voltage monitors and ABIST enable diagnostic coverage >90 % per ISO 26262; fail-safe output directly drives system-level watchdog or MCU safety manager. |
Use Scenario: Powering i.MX8QXP with LPDDR4 and NPU co-processor in an industrial gateway operating continuously in factory-floor environments. IC Role / Device Role / Timing Role: High-efficiency PMIC delivering 2.5 A per buck channel with dynamic voltage scaling to reduce power during inference idle states. Use Value: 3.4 MHz I²C allows real-time DVS adjustment based on workload; thermal resistance of 22 °C/W (8-layer board) sustains full load at 85 °C ambient. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DHES | ASIL B safety grade (vs. QM for MC33PF8100EAESR2); adds ABIST-on-demand, secure I²C write, and fail-safe state machine extensions. | Required for ASIL B–certified systems where functional safety certification is mandatory (e.g., ADAS, braking ECUs); not needed for QM-rated infotainment or telematics. | Select MC33PF8200DHES only when ISO 26262 ASIL B certification is required; MC33PF8100EAESR2 suffices for QM applications with lower safety overhead. |
| MC34PF8100EPEP | Industrial-grade variant (−40 °C to 105 °C); identical electrical specs but lacks automotive qualification (AEC-Q100 Grade 2), wettable flank, and ASIL B monitoring circuitry. | Suitable for non-automotive embedded systems (e.g., industrial gateways, medical displays); cannot be used in automotive production due to missing qualification and safety features. | Choose MC34PF8100EPEP for cost-sensitive industrial designs without automotive qualification or safety requirements; avoid in vehicle programs. |
Compared with MC33PF8100EAESR2, MC33PF8200DHES adds certified safety mechanisms at higher cost and complexity, while MC34PF8100EPEP removes automotive-specific features to reduce price-making MC33PF8100EAESR2 the optimal balance of QM-grade reliability, automotive robustness, and feature completeness for LS1046A-based telematics.
Availability
MC33PF8100EAESR2 is available at Aetrix Electronics and suitable for automotive infotainment, telematics control units, and ADAS domain controllers requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified performance.
Supply support for MC33PF8100EAESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in power management for high-performance processors.
The PF8100 product line was engineered specifically to deliver integrated, OTP-configurable power solutions for NXP's i.MX 8 and S32x application processors-enabling simplified design, reduced footprint, and ASIL-ready functionality in automotive edge computing.
FAQ
What is the primary target processor for MC33PF8100EAESR2?
The MC33PF8100EAESR2 is specifically configured for the NXP LS1046A processor with DDR4 memory (VDDQ + VTT), as indicated in its OTP configuration and ordering information. It also supports i.MX 8QXP, i.MX 8QM, and S32x series processors through software reconfiguration via its 3.4 MHz I²C interface. The MC33PF8100EAESR2 leverages OTP programming to optimize startup sequencing and voltage setpoints for LS1046A's power architecture.
Does MC33PF8100EAESR2 support VTT termination for DDR4 memory?
Yes, MC33PF8100EAESR2 supports VTT termination through SW6, which is configurable as a DDR4-compliant VTT supply (0.6 V ±1 %) with active sink/source capability. This function is explicitly documented in the power tree summary and functional block diagram. The MC33PF8100EAESR2 eliminates the need for external VTT termination circuitry when powering DDR4 memory in LS1046A-based systems.
What safety level does MC33PF8100EAESR2 meet?
MC33PF8100EAESR2 is rated for QM (Quality Management) automotive safety level-not ASIL B. Its monitoring circuit supports ASIL B–capable architecture but is configured for QM applications per its OTP settings and ordering code (EAES). For ASIL B–certified designs, MC33PF8200DHES is the designated alternative. The MC33PF8100EAESR2 includes voltage/thermal monitoring and FSOB output but lacks ABIST-on-demand and secure I²C features required for formal ASIL B certification.
Can MC33PF8100EAESR2 be reconfigured after power-up?
Yes, MC33PF8100EAESR2 supports full runtime reconfiguration via its 3.4 MHz I²C interface-including dynamic voltage scaling (DVS) on SW1–SW6, output voltage adjustment, current limit changes, and sequencing updates. OTP stores boot defaults, but all regulator parameters and safety thresholds are writable post-startup. This capability enables adaptive power management in the MC33PF8100EAESR2 for varying workload conditions without firmware reset.
What package type and thermal performance does MC33PF8100EAESR2 use?
MC33PF8100EAESR2 uses the HVQFN56 package (8 mm × 8 mm × 0.9 mm) with wettable flank for automotive AOI compatibility. Its thermal resistance is 27 °C/W (Junction-to-Ambient, 4-layer board) and 22 °C/W (8-layer board), enabling sustained 2.5 A operation per buck channel at 105 °C ambient. The exposed pad (EPAD) must be soldered to a thermal pad for optimal heat transfer. This thermal profile is validated in the MC33PF8100EAESR2 datasheet's thermal characteristics table.
MC33PF8100EAESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8100EAESR2 FAQ
1.How can I place an order for MC33PF8100EAESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8100EAESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8100EAESR2 reliable?
The price and inventory of MC33PF8100EAESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8100EAESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF8100EAESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8100EAESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8100EAESR2?
MC33PF8100EAESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8100EAESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8100EAESR2?
For technical support, including MC33PF8100EAESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8100EAESR2 requirements.
6.How does Aetrix verify that MC33PF8100EAESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF8100EAESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8100EAESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF8100EAESR2?
All MC33PF8100EAESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8100EAESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8100EAESR2 part is unused and in its original packaging.
Return procedure for MC33PF8100EAESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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