My Inquiry
My Account
NXP Semiconductors MC33PF8100EPES
- Part No.:
- MC33PF8100EPES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8100EPES.pdf
- Description:
- IC POWER MANAGEMENT I.MX8QM
- Quantity:
- Payment:
- Shipping:
Inventory:201
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC33PF8100EPES from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed as the primary power solution for i.MX8QM processors with LPDDR4 memory (PMIC1 role). It integrates seven high-efficiency buck converters (SW1–SW7), four 400 mA LDOs (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B-compliant monitoring circuitry. It operates from a 2.7–5.5 V input and delivers precise, programmable rail voltages for CPU, GPU, memory, and peripherals in infotainment systems.
For engineers reviewing the MC33PF8100EPES datasheet, MC33PF8100EPES pinout, MC33PF8100EPES application, or MC33PF8100EPES equivalent, this page provides verified technical context, validated pin functions, confirmed automotive safety features, I²C-configurable dynamic voltage scaling, and real-world use cases for i.MX8QM-based LPDDR4 platforms.
Technical Context
The MC33PF8100EPES implements a deterministic state machine for fault-aware startup, power sequencing, and fail-safe transitions - including hard watchdog reset, critical thermal shutdown (TJ > 150 °C), and VIN OVLO-triggered power-down. Its architecture supports dual-phase (SW1/SW2, SW3/SW4, SW5/SW6), triple-phase (SW1/SW2/SW3), and quad-phase (SW1–SW4) configurations to deliver up to 10 A peak current for high-performance cores.
It embeds 24-channel analog multiplexing for system-level diagnostics, OTP-programmed boot configuration, and hardware-enforced safety monitoring including independent voltage monitors, ABIST, and programmable fault counters - all meeting QM (Quality Management) automotive safety grade per Table 2 of the datasheet.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7 V to 5.5 V - powers entire PMIC from single main rail; UVLO threshold at 2.7 V ensures reliable startup under automotive battery transients. |
| Buck Regulators | 7 channels (SW1–SW7): SW1–SW6 output 0.4–1.8 V @ 2.5 A ±1.5 % accuracy; SW7 outputs 1.0–4.1 V @ 2.5 A ±2 % - enables full-core, memory, and I/O rail support for i.MX8QM. |
| LDO Regulators | 4 × 400 mA LDOs (LDO1–LDO4): 1.5–5.0 V output range, ±3 % accuracy, optional load switch mode - supplies low-noise analog, I/O, and auxiliary rails with fast transient response. |
| I²C Interface | Up to 3.4 MHz - enables rapid post-boot reconfiguration of voltage, sequencing, DVS, and protection thresholds without interrupting system operation. |
| Package | HVQFN56, 8 mm × 8 mm × 0.85 mm, 0.5 mm pitch, wettable flanks - thermally enhanced for automotive under-hood environments; EPAD tied to GND for optimal thermal dissipation (RθJC = 0.6 °C/W). |
| Safety Compliance | ASIL B monitoring circuitry (voltage, thermal, watchdog, ABIST), QM functional safety grade - certified for automotive infotainment applications requiring robust fault detection and fail-safe behavior. |
| Operating Temperature | −40 °C to +105 °C ambient - qualified for extended automotive temperature range; junction limit 150 °C with thermal derating guidance provided. |
Pinout & Package
HVQFN56 package: 8 mm × 8 mm × 0.85 mm body, 56-pin thermally enhanced wettable flank QFN with exposed pad (EPAD) for ground and thermal conduction. Pin 1 marked by dot; pins numbered counterclockwise from top-left corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Monitor regulated output voltage for closed-loop control; support external resistor dividers for precise VOUT programming (e.g., SW1FB sets CPU core voltage). |
| SW1IN–SW7IN | Buck input supplies | Accept main input (VIN) or intermediate rails; SW1IN–SW4IN typically fed from VIN; SW5IN–SW7IN may be cascaded from earlier bucks for efficiency optimization. |
| SW1LX–SW7LX | Switching node outputs | Drive external high-side MOSFETs or integrated power stages; require careful layout to minimize EMI and voltage spikes (−3.0 V transient tolerance during dead time). |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Deliver low-noise, fixed/programmable voltages to analog subsystems, I/O banks, or sensors; each supports optional load switch control via dedicated enable pins (e.g., LDO2EN). |
| VSNVS, LICELL | RTC power & backup | VSNVS provides 1.8/3.0/3.3 V @ 10 mA for secure non-volatile memory; LICELL accepts 0–4.2 V coin cell input with programmable charge current/voltage for battery backup. |
| SCL, SDA | I²C interface | High-speed (up to 3.4 MHz) bidirectional communication for runtime configuration, telemetry readback, and fault logging - essential for adaptive power management. |
| RESETBMCU, INTB, EWARN | System control signals | Open-drain outputs for MCU reset assertion, interrupt notification, and early warning of impending faults (e.g., thermal pre-warning before shutdown). |
| PGOOD | Power-good monitor | Active-low open-drain signal indicating all enabled regulators are within regulation tolerance - used by host processor to gate boot sequence. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-Configured Startup Sequence | Eliminates external resistors and timing components by storing boot voltage, sequencing order, and timing in one-time programmable memory - reduces BOM count and improves startup repeatability. |
| Dual/Triple/Quad-Phase Buck Configurability | SW1–SW4 can be combined into multi-phase regulators delivering up to 10 A (quad-phase) with interleaved switching - lowers output ripple, improves transient response, and reduces capacitor count for CPU cores. |
| VTT Termination on SW6 | SW6 supports DDR VTT termination mode (0.4–1.8 V, 2.5 A) with programmable current limit - directly powers LPDDR4 VTT rail without external components. |
| 24-Channel Analog Multiplexer (AMUX) | Enables real-time monitoring of internal voltages, temperatures, and external sensor inputs through a single ADC channel - simplifies system diagnostics and predictive maintenance. |
| ASIL B Monitoring Circuitry | Independent voltage monitors, thermal sensors, watchdog timers, and ABIST self-test ensure compliance with ISO 26262 ASIL B requirements - critical for automotive infotainment safety integrity. |
| Programmable Soft-Start & Power-Down Sequencing | Per-rail delay, slew rate, and enable/disable order configurable via OTP or I²C - prevents inrush current, avoids bus contention, and ensures safe power cycling in complex SoC systems. |
Applications
| Automotive Infotainment Head Unit | i.MX8QM-Based ADAS Camera Hub |
|---|---|
|
Use Scenario: Central display unit integrating navigation, media, voice assistant, and vehicle data visualization in premium vehicles. IC Role / Device Role / Timing Role: Primary PMIC supplying CPU (SW1–SW3), GPU (SW4), LPDDR4 memory (SW5/SW6 VDD/VTT), and I/O rails (LDO1–LDO4); manages cold-start sequencing and thermal throttling. Use Value: Enables deterministic boot within 100 ms, supports dynamic voltage scaling during UI rendering, and maintains ASIL B-compliant fault reporting for dashboard safety-critical alerts. |
Use Scenario: Multi-camera processing hub aggregating feeds from surround-view, driver monitoring, and forward ADAS sensors. IC Role / Device Role / Timing Role: Dual-role PMIC (PMIC1 per Table 2) powering i.MX8QM CPU clusters and LPDDR4 memory; coordinates power states across camera interfaces (MIPI CSI-2) and neural compute accelerators. Use Value: Delivers 10 A peak current via quad-phase SW1–SW4 for burst-mode AI inference, while VSNVS and coin cell charging preserve context during ignition-off periods. |
| Industrial HMI with Secure Boot | Connected Vehicle Telematics Gateway |
|
Use Scenario: Ruggedized human-machine interface for factory automation, supporting encrypted firmware updates and tamper detection. IC Role / Device Role / Timing Role: Manages secure power-up sequence for i.MX8QM's TrustZone-enabled boot ROM; isolates secure domain rails (VDD_SNVS, VDD_SCU) using LDO1/LDO2 with load switch control. Use Value: OTP-stored configuration prevents unauthorized modification; watchdog and PGOOD signals integrate with secure bootloader to abort boot on power anomaly. |
Use Scenario: Cellular-connected gateway aggregating CAN, LIN, and Ethernet data for OTA updates and remote diagnostics. IC Role / Device Role / Timing Role: Supplies i.MX8QM application processor, eMMC storage, LTE modem, and GNSS receiver; uses SW7 for 3.3 V modem I/O and LDO3 for GNSS RF bias. Use Value: I²C-reconfigurable rail voltages allow dynamic power optimization during cellular transmit bursts; thermal monitoring prevents throttling during sustained LTE+GNSS concurrent operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200ESES | ASIL B safety certification (vs. QM for MC33PF8100EPES); adds ABIST-on-demand, secure I²C write, FSOB fail-safe assertion, and enhanced fault counter logic. | Required for ASIL B–compliant systems where fail-safe shutdown must be hardware-enforced (e.g., instrument cluster, HUD); not needed for QM-rated infotainment head units. | Select MC33PF8200ESES only if ISO 26262 ASIL B functional safety certification is mandated; otherwise MC33PF8100EPES offers identical power capability with lower cost and simpler qualification path. |
| MC34PF8100EPEP | Industrial-grade variant (non-automotive); same electrical specs and pinout but rated for −40 °C to +105 °C industrial temp range and lacks automotive qualification (AEC-Q100 Grade 2, PPAP support). | Suitable for non-automotive edge computing or industrial HMI using i.MX8QM; excludes automotive-specific features like XFAILB sync and certain watchdog timeout profiles. | Choose MC34PF8100EPEP for cost-sensitive industrial designs without automotive qualification requirements; verify thermal design margins since RθJA differs slightly (27 °C/W vs. 22 °C/W for 4-layer board). |
Compared with MC33PF8100EPES, MC33PF8200ESES adds hardware-enforced fail-safe states and secure register writes for ASIL B systems, while MC34PF8100EPEP removes automotive qualification overhead for industrial use - enabling optimized selection based on safety grade and market certification needs.
Availability
MC33PF8100EPES is available at Aetrix Electronics and suitable for automotive infotainment head units, i.MX8QM-based ADAS camera hubs, and industrial HMIs requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified sourcing.
Supply support for MC33PF8100EPES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in application processors and power management.
The PF8100 product line was engineered specifically to serve as the primary power companion for NXP's i.MX 8 series processors - delivering tightly integrated, OTP-configurable, and safety-aware power delivery for high-performance multimedia and automotive computing platforms.
FAQ
What is the primary application target for the MC33PF8100EPES?
The MC33PF8100EPES is specifically configured for i.MX8QM processors with LPDDR4 memory in the PMIC1 role, as documented in Table 2 of the datasheet. It powers CPU cores, GPU, memory rails (VDD/VTT), and peripheral I/O in automotive infotainment and ADAS systems - delivering deterministic startup, dynamic voltage scaling, and ASIL B-compliant monitoring.
Does the MC33PF8100EPES support dynamic voltage scaling (DVS)?
Yes, the MC33PF8100EPES supports DVS on SW1 through SW6 via I²C commands, enabling real-time adjustment of output voltage during operation - for example, lowering CPU core voltage during idle states to reduce power consumption. DVS is implemented in hardware with sub-10 µs step response and no external components required.
What safety grade does the MC33PF8100EPES meet, and what does that mean for system design?
The MC33PF8100EPES carries QM (Quality Management) functional safety grade per ISO 26262, with ASIL B-compliant monitoring circuitry. This means it provides robust voltage, thermal, and watchdog monitoring suitable for automotive infotainment - but does not implement hardware-enforced fail-safe shutdown like ASIL B-certified variants (e.g., MC33PF8200ESES).
Can the MC33PF8100EPES power both VDD and VTT rails for LPDDR4 memory?
Yes - SW5 supplies the LPDDR4 VDD rail (0.4–1.8 V, 2.5 A), and SW6 operates in VTT termination mode (0.4–1.8 V, 2.5 A) to supply the termination voltage. Both rails are independently programmable and monitored, enabling full LPDDR4 power delivery without external VTT regulators.
What package type and thermal performance does the MC33PF8100EPES use?
The MC33PF8100EPES uses the HVQFN56 package (8 mm × 8 mm × 0.85 mm) with wettable flanks and exposed thermal pad. On a 4-layer PCB, its junction-to-ambient thermal resistance is 27 °C/W, and junction-to-case is 0.6 °C/W - enabling reliable operation up to 105 °C ambient with proper copper pour and thermal vias under the EPAD.
MC33PF8100EPES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8100EPES FAQ
1.How can I place an order for MC33PF8100EPES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8100EPES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8100EPES reliable?
The price and inventory of MC33PF8100EPES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8100EPES is usually 5 days.
3.What payment methods are accepted for MC33PF8100EPES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8100EPES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8100EPES?
MC33PF8100EPES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8100EPES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8100EPES?
For technical support, including MC33PF8100EPES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8100EPES requirements.
6.How does Aetrix verify that MC33PF8100EPES is sourced from the original manufacturer or authorized distributors?
All MC33PF8100EPES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8100EPES meets industry standards.
7.What is the process for return or replacement of MC33PF8100EPES?
All MC33PF8100EPES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8100EPES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8100EPES part is unused and in its original packaging.
Return procedure for MC33PF8100EPES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC33PF8100EPES Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
