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NXP Semiconductors MC33PF8100EPESR2
- Part No.:
- MC33PF8100EPESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8100EPESR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX8 PRE-PR
- Quantity:
- Payment:
- Shipping:
Inventory:4,931
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Product details
Overview
MC33PF8100EPESR2 from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed as the primary power solution for i.MX 8QM processors with LPDDR4 memory (PMIC1 role). It integrates seven high-efficiency buck converters (0.4–1.8 V, 2.5 A each), four 400 mA LDOs, RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B–compliant monitoring circuitry. It powers CPU cores, GPU, memory I/O, and peripherals in infotainment systems.
For engineers reviewing the MC33PF8100EPESR2 datasheet, MC33PF8100EPESR2 pinout, MC33PF8100EPESR2 application, or MC33PF8100EPESR2 equivalent, this page delivers verified technical context, validated pin functions, confirmed automotive safety features, OTP-configurable startup sequencing, and real-world design implications for i.MX 8QM-based platforms requiring QM-level functional safety and LPDDR4 memory support.
Technical Context
The MC33PF8100EPESR2 implements a deterministic state machine for fault-aware power sequencing, supporting programmable soft-start/power-down sequences and fail-safe transitions triggered by thermal, voltage, or watchdog faults. Its 24-channel analog multiplexer enables system-level diagnostics across all regulator outputs and critical nodes.
It features dual-phase and triple-phase configuration capability for SW1–SW4 buck stages, VTT termination mode on SW6, spread-spectrum switching, and manual frequency tuning - all configurable via 3.4 MHz I²C after boot. The integrated OTP memory stores voltage targets, sequencing order, and safety thresholds, eliminating external configuration components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Regulator Count | 7 buck converters + 4 LDOs + VSNVS RTC supply - provides complete core, memory, and peripheral rail coverage for i.MX 8QM. |
| Buck Output Range | SW1–SW6: 0.4–1.8 V (6.25 mV step); SW7: 1.0–4.1 V - supports dynamic voltage scaling for CPU/GPU cores and DDR termination. |
| Current Rating | 2.5 A per buck channel; 400 mA per LDO - sufficient for LPDDR4 I/O, CPU clusters, and auxiliary rails without external current boosting. |
| I²C Interface | Up to 3.4 MHz - enables rapid runtime reconfiguration of voltages, sequencing, and safety thresholds during system state transitions. |
| Safety Compliance | ASIL B monitoring circuit (voltage/thermal/watchdog), ABIST, PGOOD, and FSOB fail-safe output - meets QM functional safety requirements for automotive infotainment. |
| Package | HVQFN56, 8 mm × 8 mm × 0.9 mm, wettable flank - optimized for automated optical inspection (AOI) and thermal performance in automotive PCBs. |
| Operating Temp | −40 °C to +105 °C ambient - qualified for under-dash automotive environments with full derating up to 150 °C junction temperature. |
Pinout & Package
HVQFN56 package with 0.5 mm pitch, thermally enhanced exposed pad (EPAD), and wettable flank for solder joint reliability in automotive reflow profiles. Dimensions: 8 mm × 8 mm × 0.9 mm body height.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (Pin 50) | Main input supply | Accepts 2.7–5.5 V input; powers all internal regulators and logic - requires low-ESR bulk capacitance near pin. |
| SW1FB–SW7FB (Pins 2,3,12,13,30,31,38) | Buck feedback inputs | Resistive divider inputs for closed-loop regulation; tolerance ±1.5 % (SW1–SW6) or ±2 % (SW7) ensures tight voltage accuracy. |
| LDO1OUT–LDO4OUT (Pins 15,18,25,28) | LDO regulated outputs | Each delivers 1.5–5.0 V at 400 mA; optional load switch mode enables rail shutdown without external FETs. |
| VSNVS (Pin 47) | RTC supply output | Provides 1.8/3.0/3.3 V at 10 mA from VIN or coin cell (LICELL, Pin 46) - maintains real-time clock and backup memory during main power loss. |
| SCL/SDA (Pins 55/56) | I²C interface | High-speed (3.4 MHz) bidirectional bus for runtime configuration, monitoring, and fault reporting - requires pull-ups to VDDIO. |
| FSOB (Pin 29) | Fail-safe output | Open-drain signal asserted LOW during critical faults (thermal runaway, UV/OV, watchdog timeout) - triggers system-level safe state entry. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-based startup configuration | Eliminates 12+ external resistors and timing capacitors for voltage setting and power-up sequence - reduces BOM count and layout area. |
| Dual/triple-phase buck configuration | SW1–SW4 can be combined into 2-, 3-, or 4-phase configurations (up to 10 A total) - enables high-current CPU core rails with reduced ripple and improved transient response. |
| VTT termination on SW6 | Configurable as DDR VTT supply (0.4–1.8 V) with active sink/source - supports LPDDR4 and DDR4 memory termination without external circuitry. |
| 24-channel analog multiplexer | Enables real-time monitoring of all 12 regulator outputs plus internal references and temperatures - supports predictive diagnostics and field failure analysis. |
| ASIL B–compliant monitoring | Independent voltage monitors, thermal shutdown, watchdog supervision, and I²C CRC protection - satisfies ISO 26262 QM requirements for automotive infotainment. |
Applications
| Automotive Infotainment Head Unit | i.MX 8QM-Based ADAS Display |
|---|---|
Use Scenario: Central display unit with multi-core CPU, GPU, LPDDR4 memory, and multiple video interfaces in vehicle cockpit. IC Role / Device Role / Timing Role: Primary PMIC supplying VDD_CPU, VDD_GPU, VDD_DDRIO, VDD_SNVS, and VTT rails with synchronized startup and fault containment. Use Value: Reduces external component count by >30% vs discrete solutions; OTP eliminates calibration during manufacturing; ASIL B monitoring enables functional safety compliance without additional safety MCU. |
Use Scenario: Safety-critical digital instrument cluster rendering real-time vehicle data with fail-safe fallback modes. IC Role / Device Role / Timing Role: Power controller managing processor core, graphics, memory, and display interface rails while asserting FSOB on thermal or voltage fault. Use Value: Fail-safe output (FSOB) directly interfaces with display controller's reset domain; VSNVS maintains timekeeping during ignition cycles; 105 °C operation sustains reliability in sealed dash environments. |
| Industrial HMI with i.MX 8QM | Connected Vehicle Telematics Gateway |
Use Scenario: Ruggedized human-machine interface for factory automation with extended temperature and ESD requirements. IC Role / Device Role / Timing Role: Single-chip power source for i.MX 8QM, eMMC, Ethernet PHY, and CAN transceivers - configured via I²C for flexible rail assignment. Use Value: 2000 V HBM ESD rating meets industrial immunity standards; 4-layer board thermal resistance (27 °C/W) enables passive cooling; programmable soft-start prevents inrush current tripping upstream supplies. |
Use Scenario: Cellular-connected gateway aggregating CAN, LIN, and Ethernet data for OTA updates and remote diagnostics. IC Role / Device Role / Timing Role: Dual-role PMIC powering application processor and communication subsystems (LTE modem, GNSS, Wi-Fi/BT SoC) with independent sequencing domains. Use Value: Coin cell charging (LICELL) preserves secure key storage during battery disconnect; watchdog timer (WDI/RESETBMCU) ensures recovery from firmware hangs; PGOOD signals coordinate power domain enablement across subsystems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200ESES | Includes ASIL B–specific safety features (ABIST on demand, secure I²C write, FSOB assertion logic) not present in MC33PF8100EPESR2. | Required for ASIL B–certified systems where fail-safe state control and register integrity verification are mandated. | Select MC33PF8200ESES when functional safety certification (ISO 26262) is required beyond QM-level monitoring. |
| MC34PF8100EPEP | Industrial-grade variant (non-automotive qualification); same OTP configuration and regulator architecture but rated for −40 °C to +105 °C without AEC-Q100 stress testing. | Suitable for non-automotive embedded systems using i.MX 8QM (e.g., medical displays, test equipment) where automotive qualification is unnecessary. | Choose MC34PF8100EPEP for cost-sensitive industrial designs without automotive qualification requirements. |
Compared with MC33PF8100EPESR2, MC33PF8200ESES adds certified fail-safe mechanisms for ASIL B deployment, while MC34PF8100EPEP removes automotive qualification overhead - enabling selection based on safety certification needs and end-market compliance scope.
Availability
MC33PF8100EPESR2 is available at Aetrix Electronics and suitable for automotive infotainment, digital instrument clusters, and industrial HMIs requiring stable component supply, AEC-Q100 qualified sourcing, and long-term lifecycle support.
Supply support for MC33PF8100EPESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and power management.
The PF8100 product line was engineered specifically to deliver integrated, OTP-configurable power solutions for NXP's i.MX 8 series processors - reducing system complexity, improving power efficiency, and accelerating time-to-market for high-performance automotive and industrial edge devices.
FAQ
What is the primary target processor for MC33PF8100EPESR2?
The MC33PF8100EPESR2 is specifically configured for the i.MX 8QM processor with LPDDR4 memory in the PMIC1 role, as indicated by its part number suffix "EP" and associated OTP configuration file (MC33PF8100EP.zip). It powers CPU clusters, GPU, memory I/O, and SNVS domains with optimized sequencing and voltage accuracy.
Does MC33PF8100EPESR2 support ASIL B functional safety?
MC33PF8100EPESR2 includes ASIL B–compliant monitoring circuitry (voltage, thermal, watchdog) and meets QM functional safety requirements per ISO 26262, but lacks the full ASIL B–certifiable features (e.g., ABIST on demand, secure I²C write) found in the PF8200 family. Its safety grade is QM, not ASIL B.
How does the OTP memory in MC33PF8100EPESR2 reduce external components?
The OTP memory in MC33PF8100EPESR2 stores startup voltage targets, power-up/down sequencing order, soft-start timing, and safety thresholds - eliminating the need for external resistor dividers, timing capacitors, and configuration EEPROMs typically required in discrete PMIC implementations.
Can MC33PF8100EPESR2 support DDR4 memory termination?
MC33PF8100EPESR2 supports LPDDR4 memory termination via SW6 in VTT mode, but does not support DDR4 VTT due to its fixed 0.4–1.8 V output range and lack of DDR4-specific timing and current-sinking specifications. For DDR4, NXP recommends MC33PF8100ERES or MC33PF8200DHES variants.
What is the function of the FSOB pin on MC33PF8100EPESR2?
The FSOB (Fail-Safe Output) pin on MC33PF8100EPESR2 is an open-drain output that asserts LOW during critical faults - including thermal shutdown, input undervoltage/overvoltage, watchdog timeout, or internal self-test failure - enabling system-level safe state activation without software intervention.
MC33PF8100EPESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8100EPESR2 FAQ
1.How can I place an order for MC33PF8100EPESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8100EPESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8100EPESR2 reliable?
The price and inventory of MC33PF8100EPESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8100EPESR2 is usually 5 days.
3.What payment methods are accepted for MC33PF8100EPESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8100EPESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8100EPESR2?
MC33PF8100EPESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8100EPESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8100EPESR2?
For technical support, including MC33PF8100EPESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8100EPESR2 requirements.
6.How does Aetrix verify that MC33PF8100EPESR2 is sourced from the original manufacturer or authorized distributors?
All MC33PF8100EPESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8100EPESR2 meets industry standards.
7.What is the process for return or replacement of MC33PF8100EPESR2?
All MC33PF8100EPESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8100EPESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8100EPESR2 part is unused and in its original packaging.
Return procedure for MC33PF8100EPESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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