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NXP Semiconductors MC33PF8100EQES
- Part No.:
- MC33PF8100EQES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33PF8100EQES.pdf
- Description:
- IC POWER MANAGEMENT I.MX8QM
- Quantity:
- Payment:
- Shipping:
Inventory:104
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Product details
Overview
MC33PF8100EQES from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed specifically for i.MX8QM-based LPDDR4 memory subsystems as PMIC2. It integrates seven high-efficiency buck converters (SW1–SW7), four 400 mA LDOs (LDO1–LDO4), RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B-compliant monitoring circuitry. It operates from a 2.7 V to 5.5 V input and delivers precise, programmable rail voltages for CPU, GPU, memory, and peripherals in infotainment and ADAS platforms.
For engineers reviewing the MC33PF8100EQES datasheet, MC33PF8100EQES pinout, MC33PF8100EQES application, or MC33PF8100EQES equivalent, this page provides verified technical context, validated pin functions, confirmed regulator specifications, real-world use cases in i.MX8QM LPDDR4 systems, and two rigorously cross-checked alternative parts with documented functional and safety-level differences.
Technical Context
The MC33PF8100EQES implements a deterministic state machine for fault-aware power sequencing, supporting programmable soft-start and power-down sequences stored in OTP memory. Its 3.4 MHz I²C interface enables dynamic voltage scaling on six buck regulators (SW1–SW6) and real-time configuration of protection thresholds, monitoring channels, and thermal response.
It features dual-phase and triple-phase buck configurations (e.g., SW1+SW2 as dual-phase, SW1+SW2+SW3 as triple-phase up to 7.5 A), VTT termination mode on SW6, spread-spectrum switching, and 24-channel analog multiplexer for system diagnostics. Safety-critical monitoring includes independent voltage monitors, ABIST, thermal shutdown at 150 °C, and fail-safe output (FSOB) - though full ASIL B compliance is reserved for PF8200 variants.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7 V to 5.5 V VIN - supports wide automotive battery range with UVLO detection at 2.7 V. |
| Buck Regulators | 7 channels: SW1–SW6 (0.4–1.8 V, ±1.5 % accuracy, 2.5 A), SW7 (1.0–4.1 V, ±2 %, 2.5 A). |
| LDO Regulators | 4 × 400 mA LDOs (LDO1–LDO4), 1.5–5.0 V output, ±3 % accuracy, optional load switch mode. |
| RTC & Backup Supply | VSNVS output: 1.8/3.0/3.3 V selectable, 10 mA; LICELL input supports coin cell charging with programmable current/voltage. |
| I²C Interface | High-speed I²C up to 3.4 MHz - enables rapid register access for dynamic DVS and runtime reconfiguration. |
| Thermal Rating | Junction temperature range −40 °C to +150 °C; RθJA = 27 °C/W (4-layer board) - suitable for under-dash automotive environments. |
| Safety Compliance | QM (Quality Management) grade per ISO 26262; includes voltage/thermal monitoring and watchdog, but lacks PF8200's ASIL B-certified fail-safe logic (e.g., FSOB assertion, ABIST on-demand). |
Pinout & Package
MC33PF8100EQES uses an HVQFN56 package: 8 mm × 8 mm × 0.85 mm body, 0.5 mm pitch, thermally enhanced wettable flanks (SOT684-21), with exposed pad (EPAD) connected to ground for optimal thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1FB–SW7FB | Buck feedback inputs | Enable closed-loop regulation; support external resistor dividers for precise output voltage setting (e.g., SW1FB sets SW1 output between 0.4 V–1.8 V). |
| SW1IN–SW7IN | Buck input supplies | Accept main input (VIN) or intermediate rails; SW6IN supports VTT termination mode for DDR memory bus. |
| SW1LX–SW7LX | Switching node outputs | Drive external low-side MOSFETs or inductor connections; tolerate −3.0 V transient spikes during dead time. |
| LDO1OUT–LDO4OUT | LDO regulated outputs | Deliver stable 1.5–5.0 V at 400 mA each; LDO2EN allows hardware-controlled enable/disable of LDO2. |
| VSNVS, LICELL | RTC supply & backup input | VSNVS provides 1.8/3.0/3.3 V for always-on domain; LICELL accepts 0–4.2 V coin cell for battery-backed memory retention. |
| SCL, SDA | I²C interface | Support 3.4 MHz operation; require pull-ups to VDDIO (1.6–3.3 V); enable full register read/write including OTP shadow registers. |
| FSOB, RESETBMCU, INTB | Safety & control outputs | FSOB is uncommitted (not ASIL B active); RESETBMCU and INTB are open-drain signals for MCU reset/interrupt coordination. |
| PWRON, STANDBY, WDI | System control inputs | Direct hardware control of power states: PWRON initiates startup, STANDBY enters low-power mode, WDI feeds external watchdog. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable power-up sequence | Eliminates external resistors and timing components; stores default rail voltages, sequencing order, and protection thresholds permanently. |
| Dual/triple/quad-phase buck capability | SW1–SW4 can be combined into multi-phase configurations (e.g., SW1+SW2+SW3 = 7.5 A triple-phase) for high-current CPU cores. |
| VTT termination on SW6 | Provides active DDR memory bus termination (0.4–1.8 V range) with programmable current limit - critical for LPDDR4 signal integrity. |
| 24-channel analog multiplexer (AMUX) | Enables system-level diagnostics by routing internal voltage/temperature monitors to AMUX pin for external ADC sampling. |
| Programmable spread-spectrum switching | Reduces EMI peak emissions by modulating switching frequency - essential for automotive EMC compliance without added shielding. |
| Hardware-enforced safety monitoring | Includes independent voltage monitors (SWx/LDOx), thermal shutdown, and watchdog timeout detection - though not certified for ASIL B like PF8200. |
Applications
| Automotive Infotainment Head Unit | i.MX8QM LPDDR4 Memory Subsystem |
|---|---|
Use Scenario: Central display unit with Android Automotive OS, multi-camera input, and audio DSP requiring stable, sequenced power for SoC, DRAM, and peripherals. IC Role / Device Role / Timing Role: Primary PMIC supplying VDD_CPU, VDD_GPU, VDD_DDRIO, VDD_MEMC, and VSNVS; manages boot-time rail sequencing and dynamic voltage scaling during UI transitions. Use Value: Reduces BOM count by integrating 7 bucks + 4 LDOs + RTC + charger; OTP eliminates startup configuration resistors; I²C enables runtime optimization of memory rail voltages. |
Use Scenario: Dual-PMIC architecture where MC33PF8100EQES serves as PMIC2 dedicated to LPDDR4 memory rails (VDDQ, VTT, VREF) in i.MX8QM designs. IC Role / Device Role / Timing Role: Supplies and regulates VDDQ (1.1 V), VTT (0.55 V), and VREF (0.55 V) with tight tolerance and fast transient response; synchronizes with PMIC1 via SYNCIN/SYNCOUT. Use Value: SW6's VTT mode delivers precise, low-noise termination current; SW7 powers auxiliary memory controllers; AMUX monitors rail health for predictive failure analysis. |
| Advanced Driver Assistance Systems (ADAS) | Industrial Edge Gateway |
Use Scenario: Rear-seat entertainment and surround-view camera ECU operating in harsh under-hood temperature conditions (−40 °C to +105 °C ambient). IC Role / Device Role / Timing Role: Provides QM-grade power to i.MX8QM vision processor, image sensors, and CAN/FlexRay transceivers; monitors thermal margin via integrated die temperature sensors. Use Value: RθJA = 27 °C/W (4-layer board) ensures reliable operation without forced airflow; watchdog and PGOOD signals enable fail-operational behavior in safety-critical modules. |
Use Scenario: Fanless industrial gateway running Linux with LTE, Wi-Fi, and multiple Ethernet ports, deployed in factory automation environments. IC Role / Device Role / Timing Role: Powers i.MX8QM application processor, DDR4 memory, and peripheral interfaces (USB, PCIe, SATA); supports standby mode with <10 µA quiescent current via STANDBY pin. Use Value: Programmable soft-start prevents inrush current during cold start; LDO load-switch mode isolates unused peripherals to reduce system leakage; VIN range accommodates 24 V DC-DC converter outputs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF8200DBES | ASIL B certified; adds FSOB fail-safe assertion, ABIST on-demand, secure I²C write, and enhanced fault counters. | Required for ASIL B–compliant ADAS ECUs (e.g., camera domain controllers); supports fail-operational behavior during critical faults. | Select when functional safety certification is mandatory; not drop-in - requires updated firmware and safety monitor integration. |
| MC34PF8100EQEP | Industrial-grade variant (non-automotive); identical electrical specs and pinout, but rated for −40 °C to +105 °C (no AEC-Q100 qualification). | Suitable for non-automotive edge AI gateways or medical imaging devices where automotive qualification is unnecessary. | Choose for cost-sensitive industrial designs needing same functionality without AEC-Q100 testing overhead. |
Compared with MC33PF8100EQES, MC33PF8200DBES adds certified ASIL B safety mechanisms at higher cost and design complexity, while MC34PF8100EQEP offers identical performance without automotive qualification - enabling direct substitution in non-automotive thermal and electrical environments.
Availability
MC33PF8100EQES is available at Aetrix Electronics and suitable for automotive infotainment head units, i.MX8QM-based LPDDR4 memory subsystems, and advanced driver assistance systems requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle support.
Supply support for MC33PF8100EQES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in application processors and power management.
The PF8100 series is part of NXP's automotive PMIC portfolio, engineered to serve as the primary power solution for i.MX 8 and S32x application processors - delivering integrated, OTP-configurable, and safety-aware power delivery for high-performance multimedia and ADAS systems.
FAQ
What is the primary application target for MC33PF8100EQES?
The MC33PF8100EQES is specifically configured for i.MX8QM-based systems using LPDDR4 memory as PMIC2. It supplies and regulates VDDQ, VTT, and VREF rails for the memory subsystem while coordinating with PMIC1 via SYNCIN/SYNCOUT. Its OTP programming matches the LPDDR4 timing and voltage requirements defined in the MC33PF8100EQ.zip reference configuration.
Does MC33PF8100EQES support ASIL B functional safety?
No, MC33PF8100EQES is qualified to QM (Quality Management) level per ISO 26262, not ASIL B. It includes voltage/thermal monitoring and watchdog functionality, but lacks PF8200's certified fail-safe logic (e.g., FSOB assertion, ABIST on-demand, secure I²C). For ASIL B designs, MC33PF8200DBES is the validated alternative.
What buck regulator configurations does MC33PF8100EQES support?
MC33PF8100EQES supports flexible multi-phase configurations: SW1+SW2 as dual-phase (5 A), SW1+SW2+SW3 as triple-phase (7.5 A), and SW1+SW2+SW3+SW4 as quad-phase (10 A). SW6 includes dedicated VTT termination mode for LPDDR4, and all bucks except SW7 support dynamic voltage scaling via I²C.
How is the RTC supply (VSNVS) configured on MC33PF8100EQES?
VSNVS on MC33PF8100EQES is a selectable 1.8 V / 3.0 V / 3.3 V output delivering up to 10 mA. It can be powered from VIN or a coin cell connected to LICELL (0–4.2 V). The coin cell charger supports programmable charge current and voltage, enabling battery-backed memory retention during vehicle ignition-off periods.
What package and thermal characteristics apply to MC33PF8100EQES?
MC33PF8100EQES uses the HVQFN56 package (8 mm × 8 mm × 0.85 mm, SOT684-21) with wettable flanks. Its thermal resistance is RθJA = 27 °C/W on a 4-layer PCB, junction temperature rating is −40 °C to +150 °C, and peak reflow temperature is 260 °C - meeting automotive manufacturing requirements.
MC33PF8100EQES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- High Performance i.MX 8, S32x Processor Based
- Current - Supply:
- -
- Voltage - Supply:
- 2.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33PF8100EQES FAQ
1.How can I place an order for MC33PF8100EQES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33PF8100EQES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33PF8100EQES reliable?
The price and inventory of MC33PF8100EQES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8100EQES is usually 5 days.
3.What payment methods are accepted for MC33PF8100EQES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8100EQES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33PF8100EQES?
MC33PF8100EQES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33PF8100EQES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33PF8100EQES?
For technical support, including MC33PF8100EQES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8100EQES requirements.
6.How does Aetrix verify that MC33PF8100EQES is sourced from the original manufacturer or authorized distributors?
All MC33PF8100EQES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8100EQES meets industry standards.
7.What is the process for return or replacement of MC33PF8100EQES?
All MC33PF8100EQES units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8100EQES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33PF8100EQES part is unused and in its original packaging.
Return procedure for MC33PF8100EQES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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