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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Power Management - Specialized

NXP Semiconductors MC33PF8100EQESR2

Name: MC33PF8100EQESR2
Brand: NXP Semiconductors
SKU: MC33PF8100EQESR2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MC33PF8100EQESR2

Manufacturer:: NXP Semiconductors

Category:: Power Management - Specialized

Package:: 56-VFQFN Exposed Pad

Datasheet:: MC33PF8100EQESR2.pdf

Description:: POWER MANAGEMENT IC I.MX8 PRE-PR

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Product details

Overview

MC33PF8100EQESR2 from NXP Semiconductors is an automotive-grade 12-channel power management IC (PMIC) designed as the primary power solution for i.MX8QM processors with LPDDR4 memory (PMIC2 role). It integrates seven high-efficiency buck converters (SW1–SW7), four 400 mA LDOs, RTC supply (VSNVS), coin cell charger, watchdog timer, and ASIL B–compliant monitoring circuitry. It operates from a 2.7–5.5 V input and supports dynamic voltage scaling for CPU/GPU/memory rails in infotainment systems.

For engineers reviewing the MC33PF8100EQESR2 datasheet, MC33PF8100EQESR2 pinout, MC33PF8100EQESR2 application, or MC33PF8100EQESR2 equivalent, this page delivers verified technical context, exact regulator specifications, validated HVQFN56 pin mapping, real-world automotive use cases, and two confirmed alternative parts - all grounded in NXP's PF8100 product data sheet Rev. 13 (March 2026).

Technical Context

The MC33PF8100EQESR2 implements a deterministic state machine for fault-aware startup, power sequencing, and fail-safe transitions - including hard watchdog reset, critical thermal shutdown (TJ > 150 °C), and VIN overvoltage lockout. Its architecture separates safety-critical monitoring (voltage/thermal/ABIST) from regulation control, with independent PGOOD signaling per rail and programmable fault counters.

It features a 24-channel analog multiplexer for system diagnostics, OTP-configurable power-up sequence and soft-start timing, and dual-phase or triple-phase configuration capability across SW1–SW4 to support up to 7.5 A on CPU core rails. The I²C interface runs at up to 3.4 MHz with CRC protection and write-lock mechanisms.

Key Specifications

Parameter	Value and Actual Design Meaning
Input Voltage Range	2.7 V to 5.5 V - powers entire PMIC from single main rail; UVLO threshold at 2.7 V ensures reliable startup under automotive battery sag.
Buck Regulators	7 channels: SW1–SW6 (0.4–1.8 V, ±1.5 % accuracy, 2.5 A); SW7 (1.0–4.1 V, ±2 %, 2.5 A) - covers CPU, GPU, DDR I/O, VTT, and auxiliary supplies.
LDO Regulators	4 × 400 mA LDOs (LDO1–LDO4, 1.5–5.0 V, ±3 %) + VSNVS (1.8/3.0/3.3 V, 10 mA) - powers always-on logic, analog cores, and RTC with coin-cell backup.
I²C Interface	Up to 3.4 MHz - enables fast post-boot reconfiguration of output voltages, sequencing, and DVS states without interrupting system operation.
Safety Compliance	ASIL B monitoring circuit (independent voltage/thermal/fault detection, ABIST, FSOB fail-safe output) - meets ISO 26262 requirements for automotive infotainment subsystems.
Package	HVQFN56, 8 mm × 8 mm × 0.9 mm, wettable flank - supports automated optical inspection (AOI) and robust thermal dissipation (RθJC = 0.6 °C/W).
Operating Temperature	−40 °C to +105 °C ambient - qualified for automotive cabin environments per AEC-Q100 Grade 2.

Pinout & Package

HVQFN56 package (SOT684-29(D)), thermally enhanced, 0.5 mm pitch, 56-terminal wettable flank design with exposed EPAD for low-impedance ground connection and improved thermal performance.

Pin/Terminal	Circuit Role	Design Meaning
SW1FB–SW7FB (Pins 3,13,12,31,30,38,2)	Buck output voltage feedback	High-impedance inputs for closed-loop regulation; support external resistor dividers to set precise output voltages per rail.
SW1IN–SW7IN (Pins 4,7,8,11,32,35,37)	Buck input supply	Accepts 2.7–5.5 V input; each connects to dedicated input capacitor bank to minimize switching noise coupling.
SW1LX–SW7LX (Pins 5,6,9,10,33,34,36)	Buck switching node	High dv/dt nodes requiring tight layout; tolerate −3.0 V transient spikes during dead time - mandates low-inductance PCB routing.
LDO1OUT–LDO4OUT (Pins 15,18,25,28)	LDO regulated outputs	Deliver stable 1.5–5.0 V at up to 400 mA; include optional load switch mode for controlled power gating of peripherals.
VSNVS (Pin 47)	RTC supply output	Programmable 1.8/3.0/3.3 V rail with 10 mA drive; powered from VIN or LICELL (coin cell) for battery-backed memory retention.
SCL/SDA (Pins 55/56)	I²C communication interface	Support standard/fast/high-speed modes up to 3.4 MHz; include internal pull-up options and CRC-protected register writes.
FSOB (Pin 29)	Fail-Safe Output	Open-drain ASIL B–compliant safety signal asserted LOW during critical faults (thermal, voltage, watchdog timeout) to trigger system-level fail-safe response.
EPAD (Pin 57)	Exposed thermal pad	Must be soldered to solid GND plane; provides primary thermal path (RθJC = 0.6 °C/W) and reduces junction temperature rise by >20 °C under full load.

Key Features

Feature	Design Value
OTP-based startup configuration	Eliminates 12+ external resistors and capacitors for voltage setting and sequencing - reduces BOM count and improves startup repeatability across production units.
Dual/triple/quad-phase buck configuration	SW1–SW4 can be combined into multi-phase regulators delivering up to 10 A (quad-phase) with interleaved switching - lowers output ripple and eases thermal design for CPU cores.
VTT termination on SW6	Configurable as DDR VTT supply (0.4–1.8 V, 2.5 A) with tracking and current-sense capability - supports LPDDR4 and DDR4 memory termination without external components.
24-channel analog multiplexer (AMUX)	Enables real-time monitoring of internal voltages, temperatures, and external system nodes via single ADC input - simplifies diagnostic firmware and reduces external sensor count.
Programmable watchdog with early warning	WDI input accepts MCU heartbeat; EWARN output signals impending timeout (e.g., 100 ms before RESETBMCU assertion), allowing graceful software recovery.

Applications

Automotive Infotainment Head Unit	i.MX8QM-Based ADAS Camera ECU
Use Scenario: Central display unit with quad-core CPU, GPU, LPDDR4 memory, HDMI, and audio codecs operating in vehicle cabin (−40 °C to +85 °C). IC Role / Device Role / Timing Role: Primary PMIC supplying VDD_CPU (SW1), VDD_GPU (SW2), VDD_DDRIO (SW3/SW4), VTT (SW6), and VSNVS (RTC) with synchronized power-up sequence. Use Value: OTP-programmed sequencing eliminates boot-time race conditions; ASIL B monitoring ensures safe shutdown during voltage faults - meeting OEM functional safety requirements.	Use Scenario: Front-facing camera ECU processing real-time video streams using i.MX8QM with LPDDR4 and MIPI CSI-2 interface. IC Role / Device Role / Timing Role: PMIC2 supplying memory I/O rails (SW3/SW4), VTT (SW6), and always-on VSNVS while coordinating with PMIC1 (MC33PF8100EPES) for core domain. Use Value: Dual-phase SW3/SW4 configuration delivers low-noise 1.1 V DDR I/O at 2.5 A; spread-spectrum switching minimizes EMI impact on sensitive image sensor signals.
Industrial HMI with Secure Boot	Telematics Control Unit (TCU)
Use Scenario: Ruggedized human-machine interface running Linux on i.MX8QM with encrypted storage, secure boot, and CAN FD connectivity. IC Role / Device Role / Timing Role: Provides isolated 1.5 V analog supply (LDO1), 3.3 V I/O (LDO2), and 1.8 V GPU core (SW2) with I²C CRC-protected reconfiguration during firmware updates. Use Value: Load-switch-capable LDOs enable zero-power peripheral isolation; watchdog early-warning (EWARN) supports secure boot integrity checks without system reset.	Use Scenario: Cellular-connected TCU integrating LTE modem, GNSS receiver, and vehicle bus gateways in harsh under-hood environment. IC Role / Device Role / Timing Role: Supplies 1.05 V modem core (SW7), 1.8 V GNSS RF (LDO3), 3.3 V CAN transceivers (LDO4), and VSNVS for clock/calendar with coin-cell backup. Use Value: Coin cell charger (LICELL input) maintains RTC during battery disconnect; wide-input buck SW7 (1.0–4.1 V) accommodates varying modem supply requirements.

Automotive Infotainment Head Unit

i.MX8QM-Based ADAS Camera ECU

Use Scenario: Central display unit with quad-core CPU, GPU, LPDDR4 memory, HDMI, and audio codecs operating in vehicle cabin (−40 °C to +85 °C).

IC Role / Device Role / Timing Role: Primary PMIC supplying VDD_CPU (SW1), VDD_GPU (SW2), VDD_DDRIO (SW3/SW4), VTT (SW6), and VSNVS (RTC) with synchronized power-up sequence.

Use Value: OTP-programmed sequencing eliminates boot-time race conditions; ASIL B monitoring ensures safe shutdown during voltage faults - meeting OEM functional safety requirements.

Use Scenario: Front-facing camera ECU processing real-time video streams using i.MX8QM with LPDDR4 and MIPI CSI-2 interface.

IC Role / Device Role / Timing Role: PMIC2 supplying memory I/O rails (SW3/SW4), VTT (SW6), and always-on VSNVS while coordinating with PMIC1 (MC33PF8100EPES) for core domain.

Use Value: Dual-phase SW3/SW4 configuration delivers low-noise 1.1 V DDR I/O at 2.5 A; spread-spectrum switching minimizes EMI impact on sensitive image sensor signals.

Industrial HMI with Secure Boot

Telematics Control Unit (TCU)

Use Scenario: Ruggedized human-machine interface running Linux on i.MX8QM with encrypted storage, secure boot, and CAN FD connectivity.

IC Role / Device Role / Timing Role: Provides isolated 1.5 V analog supply (LDO1), 3.3 V I/O (LDO2), and 1.8 V GPU core (SW2) with I²C CRC-protected reconfiguration during firmware updates.

Use Value: Load-switch-capable LDOs enable zero-power peripheral isolation; watchdog early-warning (EWARN) supports secure boot integrity checks without system reset.

Use Scenario: Cellular-connected TCU integrating LTE modem, GNSS receiver, and vehicle bus gateways in harsh under-hood environment.

IC Role / Device Role / Timing Role: Supplies 1.05 V modem core (SW7), 1.8 V GNSS RF (LDO3), 3.3 V CAN transceivers (LDO4), and VSNVS for clock/calendar with coin-cell backup.

Use Value: Coin cell charger (LICELL input) maintains RTC during battery disconnect; wide-input buck SW7 (1.0–4.1 V) accommodates varying modem supply requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar power management applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MC33PF8200DBES	ASIL B–certified variant with additional safety features: ABIST on-demand, secure I²C write, FSOB active-safe state, and fail-safe counter (FS_CNT).	Required for ASIL B–compliant systems needing runtime self-test and fail-safe assertion beyond basic monitoring.	Select MC33PF8200DBES when functional safety certification (ISO 26262) requires hardware-enforced safety mechanisms beyond MC33PF8100EQESR2's ASIL B monitoring.
MC33PF8100ERES	Same PF8100 family, but configured for DDR4 memory (PMIC1 role) with different OTP settings - targets i.MX8QM DDR4 core supply instead of LPDDR4 I/O.	Used as PMIC1 for CPU core (VDD_CPU/VDD_GPU) and DDR4 memory controller, not LPDDR4 I/O rails.	Choose MC33PF8100ERES only when designing for DDR4-based i.MX8QM platforms; MC33PF8100EQESR2 is optimized for LPDDR4 I/O and VTT in PMIC2 role.

Compared with MC33PF8200DBES, MC33PF8100EQESR2 lacks runtime ABIST and secure I²C but offers identical regulation performance and lower cost for QM-grade infotainment. Compared with MC33PF8100ERES, it uses distinct OTP programming for LPDDR4-specific sequencing and VTT configuration - making them non-interchangeable without board-level redesign.

Availability

MC33PF8100EQESR2 is available at Aetrix Electronics and suitable for automotive infotainment head units, i.MX8QM-based ADAS ECUs, and industrial HMIs requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle support.

Supply support for MC33PF8100EQESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based application processors and power management.

The PF8100 product line was engineered specifically to deliver integrated, OTP-configurable, ASIL B–capable power solutions for NXP's i.MX 8 and S32x processor families - reducing system complexity while meeting stringent automotive reliability and safety standards.

FAQ

What is the primary application target for MC33PF8100EQESR2?

The MC33PF8100EQESR2 is specifically configured as PMIC2 for i.MX8QM processors with LPDDR4 memory, powering DDR I/O rails (VDD_DDRIO0/1), VTT termination, and auxiliary supplies. Its OTP programming matches the LPDDR4 timing and sequencing requirements defined in NXP's MC33PF8100EQ.zip reference configuration - making it unsuitable for DDR4 or S32V234 platforms without redesign.

Does MC33PF8100EQESR2 support dynamic voltage scaling (DVS)?

Yes, MC33PF8100EQESR2 supports DVS on SW1 through SW6 - enabling real-time adjustment of output voltages during processor DVFS transitions. This is implemented via high-speed I²C writes to dedicated DVS registers, with typical update latency under 10 µs. SW7 does not support DVS due to its fixed 1.0–4.1 V range and independent control architecture.

How is the RTC supply (VSNVS) powered and configured on MC33PF8100EQESR2?

MC33PF8100EQESR2 provides VSNVS as a selectable 1.8 V, 3.0 V, or 3.3 V output (Pin 47), powered either from VIN or a coin cell connected to LICELL (Pin 46). The device includes a programmable coin cell charger with adjustable charge current and voltage thresholds - ensuring reliable RTC operation during vehicle battery disconnect or deep sleep modes.

What safety features does MC33PF8100EQESR2 implement for automotive use?

MC33PF8100EQESR2 implements ASIL B–compliant monitoring including independent voltage monitors per rail (with programmable OV/UV thresholds), thermal shutdown at TJ = 150 °C, watchdog timer with early-warning output (EWARN), and fail-safe output (FSOB) that asserts LOW during critical faults. It does not include ABIST on-demand or secure I²C - features reserved for PF8200 variants.

Can MC33PF8100EQESR2 be used with i.MX8QXP processors?

No - MC33PF8100EQESR2 is OTP-programmed for i.MX8QM with LPDDR4 memory (PMIC2 role). For i.MX8QXP, NXP specifies MC33PF8100FJES or MC33PF8100CCES as compatible alternatives. Using MC33PF8100EQESR2 with i.MX8QXP would result in incorrect power sequencing, unsupported voltage ranges, and potential boot failure due to mismatched OTP configuration.

MC33PF8100EQESR2 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 56-VFQFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Active

Applications:: High Performance i.MX 8, S32x Processor Based

Current - Supply:: -

Voltage - Supply:: 2.5V ~ 5.5V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount, Wettable Flank

Supplier Device Package:: 56-HVQFN (8x8)

MC33PF8100EQESR2 FAQ

1.How can I place an order for MC33PF8100EQESR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for MC33PF8100EQESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC33PF8100EQESR2 reliable?

The price and inventory of MC33PF8100EQESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33PF8100EQESR2 is usually 5 days.

3.What payment methods are accepted for MC33PF8100EQESR2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33PF8100EQESR2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC33PF8100EQESR2?

MC33PF8100EQESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC33PF8100EQESR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC33PF8100EQESR2?

For technical support, including MC33PF8100EQESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33PF8100EQESR2 requirements.

6.How does Aetrix verify that MC33PF8100EQESR2 is sourced from the original manufacturer or authorized distributors?

All MC33PF8100EQESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33PF8100EQESR2 meets industry standards.

7.What is the process for return or replacement of MC33PF8100EQESR2?

All MC33PF8100EQESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33PF8100EQESR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC33PF8100EQESR2 part is unused and in its original packaging.

Return procedure for MC33PF8100EQESR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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